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Analysis of the Structure of the Thick-SOI Material and Device Industry Including Key Market Metrics

Posted on: Wednesday, 11 June 2008, 09:00 CDT

Research and Markets (http://www.researchandmarkets.com/research/4a8225/thicksoi_market_2) has announced the addition of the "Thick-SOI Market 2008" report to their offering.

The term thick-SOI refers to a semiconductor substrate with an active, single-crystal silicon layer whose thickness exceeds 1um. It lies on a buried oxide which is set on top of a silicon wafer carrier. This structure is widely used in MEMS and in Power Device electronics.

In 2007, thick-SOI substrates accounted for a $72M market, representing approximately 380,000 6" (equiv.) wafer units. MEMS currently accounts for 38% of this market, and this figure is expected to exceed 45% by 2012. The other outlet for these products is the power semiconductor industry.

MEMS business is boosting thick-SOI demand thanks to the market dynamism of products such as accelerometers or gyroscopes, which are now widely used in numerous consumer products (cell-phones, game-pads, cameras...). MEMS-related activities are expected to drive more than 300,000 6" thick-SOI substrates in 2012.

Power electronics was the first sector with a need for thick-SOI: this technology was developed to design and manufacture some of the plasma TV (PDP) drivers ICs. As a result, the very high market penetration of plasma technology in large flat panel displays led to very rapid ramp-up in this segment. In 2006, about 200,000 6"-thick SOI wafers were processed. This being said, competition from LCD technology is currently reversing this trend: whereas the CAGR of thick-SOI PDP-related business was routinely above 25% in the past years, annual growth is forecasted to be only 6% after 2008.

The leading company in the thick-SOI wafer business is still SEH (J), followed by SUMCO (J). Asia supplies about 75% of all thick-SOI wafers and is consuming in between 40% to 50% of the worldwide wafer volume in MEMS and Power Electronics. Due to its involvement in both sectors, namely MEMS and Power electronics, DENSO (J) still leads the pack of the TOP 25 thick-SOI users, with STM, NEC and Fuji following fairly closely behind. The largest pure-MEMS player is Silex Microsystems, the Swedish company. In 2011, the $100M mark will be reached for substrates, and 10% CAGR is forecasted until 2012.

This report provides a unique description on the thick-SOI material business in a single package. It highlights the main metrics and the key market trends that will help material and equipment vendors to position their R&D efforts and anticipate the changes and forecasted evolution of their business.

Benefits of the report for equipment and material suppliers:

- Analysis of the structure of the Thick-SOI material and device industry including key market metrics

- Calculations of wafer volumes to be processed for each market segments

- Listing and ranking of the Thick-SOI providers and users with related market shares

Companies Mentioned:

- Analog Devices

- APM

- Denso

- E2V

- Freescale

- Honeywell

- Matsushita

- OKI Electric

- STM Catania

- STM Tours

- TMT

- TSMC

- Atotech

- Dalsa Semiconductor

- Fraunhofer IZM

- Freescale Sendai

- IMT

- Micralyne

- Pirelli

- Siimpel

- Silex Microsystems

- Texas Instrument

- VTT

- X-Fab

- Fraunhofer IPMS

- Chemnitz Univ

For more information visit http://www.researchandmarkets.com/research/4a8225/thicksoi_market_2

Source: Business Wire

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