RF Micro Devices is Industry's Fastest Company to Ship 250 Million Power Amplifier Modules
Posted on: Monday, 25 August 2003, 06:00 CDT
GREENSBORO, N.C.--(BUSINESS WIRE)--Aug. 25, 2003--
Driven By RFMD's Sales Of The World's Best-Selling Power Amplifier
Modules With Integrated Power Control
RF Micro Devices, Inc. (Nasdaq: RFMD), a leading provider of proprietary radio frequency integrated circuits (RFICs) for wireless communications applications, today announced that it has shipped its 250 millionth power amplifier (PA) module. RFMD is the fastest company in the industry to ship 250 million PA modules.
Eric Creviston, vice president of wireless products at RF Micro Devices, said, "We are proud to announce the shipment of our 250 millionth PA module, which is another major milestone for RF Micro Devices. In May 2003, just three months ago, we shipped our 200 millionth PA module, and we view today's announcement as further proof of our position as the world's leading PA provider for handsets."
Creviston continued, "This success is due in part to our proven design and manufacturing expertise, as well as the strength of our PowerStar(TM) products, which are the world's best-selling power amplifier modules with integrated power control. Our patent-pending PowerStar solutions have helped RFMD become the leading supplier of PAs for the GSM air interface standard, which accounts for approximately two-thirds of the world's cell phones."
Joe Grzyb, general manager of the power amplifier product line at RF Micro Devices, said, "By combining our aggressive pace of new product introduction, a passion for excellence in customer support and our position as the market leader in PAs, we anticipate continued strong acceptance of our PA products by the world's major handset manufacturers. We recently introduced the RF3146 next-generation PowerStar PA module with integrated power control. Based on our new, patent-pending Lead Frame Module(TM) packaging technology, the RF3146 offers our customers improved performance, reduced product size and lower cost. At the same time our Lead Frame Module packaging technology helps streamline our manufacturing process and we expect this will lead to improved margins on these modules."
Power amplifiers are one of the most critical components in the radio section of handsets and amplify the handset's signal through its antenna back to the base station. RFMD's PowerStar products simplify phone design and manufacturing, and significantly reduce customers' engineering time and resources in product test, in some cases by more than 50 percent, thereby accelerating time-to-market and reducing overall cost.
RFMD is the only company with product availability in cellular, wireless LAN, Bluetooth(R) technology, GPS and satellite radio.
RF Micro Devices, Inc., an ISO 9001- and ISO 14001-certified manufacturer, designs, develops, manufactures and markets proprietary RFICs primarily for wireless communications products and applications such as cellular and PCS phones, base stations, WLANs, and cable television modems. The Company offers a broad array of products - including amplifiers, mixers, modulators/demodulators, and single-chip receivers, transmitters and transceivers - representing a substantial majority of the RFICs required in wireless subscriber equipment. The Company's goal is to be the premier supplier of low-cost, high-performance integrated circuits and solutions for applications that enable wireless connectivity. RF Micro Devices, Inc. is traded on the Nasdaq National Market under the symbol RFMD. For more information about RFMD, please visit www.rfmd.com.
This press release contains forward-looking statements that relate to RF Micro Devices' plans, objectives, estimates and goals. Words such as "expects,""anticipates,""intends,""plans,""projects,""believes," and "estimates," and variations of these words and similar expressions, identify these forward-looking statements. RF Micro Devices' business is subject to numerous risks and uncertainties, including variability in quarterly operating results, the rate of growth and development of wireless markets, risks associated with the operation of wafer fabrication, molecular beam epitaxy and test, tape and reel facilities and the Company's conversion from four-inch to six-inch wafer manufacturing, its ability to manage rapid growth and to attract and retain skilled personnel, variability in production yields, its ability to control and reduce costs and improve gross margins on highly integrated products, dependence on a limited number of customers and dependence on third parties. These and other risks and uncertainties, which are described in more detail in RF Micro Devices' most recent Annual Report on Form 10-K filed with the Securities and Exchange Commission, could cause actual results and developments to be materially different from those expressed or implied by any of these forward-looking statements.
RF MICRO DEVICES(R), RFMD(R), PowerStar(TM) and Lead Frame Module(TM) are trademarks of RFMD, LLC.
Related Articles
- Micro Power Announces Integrated Power Supply Capabilities
- ADI Engineering Announces Embedded Mini-ITX Single Board Computer for the Intel(R) EP80579 Integrated Processor Product Line
- Siemens Wireless Modules Expands Its Scalable M2M Product Offerings With Four New Modules
- Kodak and NDMA Collaborate on Product-Integration Initiatives to Support Mammography Screening in Europe
- Telindus Access Products Integrates Intoto's VPN and Firewall Security Software for Broadband Access Routers
- LG Innotek to Produce Family of High-Resolution Display Modules Fully Integrated With PenTile RGBW(TM) Technology From Clairvoyante(TM)
- TI Introduces Precision, Micro-Power Op Amps for Battery-Powered Applications
- Sun, Microsoft to End Silence About Product Integration Work
- Siemens ICM WM Chooses Analog Devices and TTPCom Wireless Technologies for Next-Generation EDGE Modules
User Comments (0)

RSS Feeds