August 6, 2008
Amtech Systems to Announce Fiscal 2008 Third Quarter Financial Results on August 13, 2008
Amtech Systems, Inc. (NASDAQ:ASYS), a global supplier of production and automation systems and related supplies for the manufacture of solar cells, semiconductors, and silicon wafers, today reported that it will announce its fiscal 2008 third quarter financial results after the close of regular market trading on Wednesday, August 13, 2008. The Company will report results in a news release issued immediately following the close of the market on August 13, 2008, followed by a conference call to discuss the results starting at 2:00 p.m. Pacific Time (5:00 p.m. ET).
What: Amtech fiscal 2008 third quarter financial results conference call When: Wednesday, August 13th at 2:00 p.m. Pacific Time (5:00 p.m. Eastern Time) Webcast: A live and archived web cast of the conference call can be accessed from the investors section of Amtech's website at www.amtechsystems.com or at www.mkr-group.com (under featured events). Dial In: To access the live conference call, dial (800) 240-7305 and request the "Amtech" call. Replay: An audio replay of the conference call can be accessed at (800) 405-2236. The replay will be available starting approximately two hours after the call and remain in effect for one week. The required pass code is 11118369#.
About Amtech Systems, Inc.Amtech Systems, Inc. manufactures capital equipment, including silicon wafer handling automation, thermal processing equipment and related consumables used in fabricating solar cells and semiconductor devices. Semiconductors, or semiconductor chips, are fabricated on silicon wafer substrates, sliced from ingots, and are part of the circuitry, or electronic components, of many products including solar cells, computers, telecommunications devices, automotive products, consumer goods, and industrial automation and control systems. The Company's wafer handling, thermal processing and consumable products currently address the diffusion, oxidation and deposition steps used in the fabrication of solar cells, semiconductors, MEMS and the polishing of newly sliced silicon wafers.