Fujitsu to Chair IEC Forum Panel on WiMAX and Alternative Service Models at SUPERCOMM 2005
Posted on: Friday, 27 May 2005, 09:00 CDT
Fujitsu Network Communications:
WHAT: Bill Erickson, senior vice president of sales and marketing at Fujitsu, will chair an International Engineering Consortium (IEC) Communications Forum panel that will discuss new service paradigms enabled by WiMAX during the SUPERCOMM(R) 2005 convention and exposition. This topic, as well as other solutions that enable networking beyond convergence, will be discussed in the Fujitsu booth (No. 41015). For more information about SUPERCOMM 2005, visit http://www.supercomm2005.com. Bill will chair the "WiMAX: Alternative Service Models for Service Providers" panel that will discuss WiMAX service offerings such as broadband data and Voice over IP (VoIP), fixed and nomadic application details, network interface applications, infrastructure requirements, operating cost models and business/market models. In addition, the panel will discuss challenges facing the broadband wireless market, including service provider competition, technological competition between 3G and WiMAX, competing standards, spectrum limitations and mobility migration issues. Other speakers will include Dean Chang, director of product management, Aperto Networks, WiMAX board member and chair of the Service Provider Working Group; Arun Ghosh, principal member of technical staff, SBC Labs; Philip Junker, senior vice president of strategic applications, Alltel; Jonathan Morgan, vice president of product marketing, Tatara Systems; and Lindsay Schroth, senior analyst, The Yankee Group. WHEN: Presentation: Thursday, June 9, 2005; 9:45 a.m. to 12:45 p.m. Exhibit: Tuesday, June 7, 2005; 9:00 a.m. to 5:00 p.m. Wednesday, June 8, 2005; 9:00 a.m. to 5:00 p.m. Thursday, June 9, 2005; 9:00 a.m. to 3:00 p.m. WHERE: McCormick Place, Chicago, Ill. Presentation: Room S403B Exhibit: Fujitsu Booth No. 41015 WHO: Bill Erickson is the senior vice president of sales and marketing at Fujitsu Network Communications, based in Richardson, Texas. With over 20 years of experience in the telecom industry, Bill oversees the company's sales, marketing and services divisions. Bill started his career in 1984 as a member of the technical staff at Bellcore (now Telcordia) where he worked on a variety of projects, including the development of TL1 and SONET requirements. Bill joined Siemens Transmission Systems in 1988 as a systems engineer working on their optical transport portfolio. In 1990, Bill became a manager in the strategic planning department at Fujitsu and has since held a number of positions, including senior manager of operations planning, senior director of access and transport planning and vice president of product planning. Bill holds a bachelor's degree in both physics and mathematics from Monmouth University in West Long Branch, N.J., and a master's degree in computer science from Stevens Institute of Technology in Hoboken, N.J.
Fujitsu Network Communications Inc. creates and delivers robust wireline and wireless solutions that power next-generation telecommunication networks. With an unequalled portfolio of IT and telecom products and the support of Fujitsu Limited, a $44.5B company with over 150,000 professionals in more than 100 countries, Fujitsu helps its customers fuse information and networking technology with commercial value. Over 300,000 Fujitsu network elements have been deployed by all major carriers across North America. As the metro market leader in both SONET and ROADM technology, the fundamental building blocks of next-generation networks, Fujitsu is helping customers take networking beyond convergence. For more information, please visit http://us.fujitsu.com/telecom.
FUJITSU (and design) (R) and THE POSSIBILITIES ARE INFINITE(TM) are trademarks of Fujitsu Limited. SUPERCOMM(R) is a trademark of the Telecommunications Industry Association (TIA) and the United States Telecom Association (USTA). All rights reserved. All other trademarks are the property of their respective owners.
Source: Business Wire
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