TSMC Names Time to Market Design Center Alliance Member
Posted on: Tuesday, 19 August 2008, 12:00 CDT
Time to Market Inc. (TTM) today was named a TSMC Design Center Alliance (DCA) Program Partner. TSMC DCA Program is one of the key collaborative components of the company's recently unveiled Open Innovation Platform(TM). Open Innovation Platform(TM) is a platform for innovations, hosted by TSMC and open to TSMC customers and partners. It is built on TSMC's design-enabling building blocks and an ecosystem interface.
TTM employs Cadence(R) Design Systems' Encounter(R) Digital IC Design Platform for 65nm designs and below. It recently designed and validated a networking system on chip (SoC) in record time using Cadence's Litho Physical Analyzer for layout printability checking and using SoC Encounter GXL, which includes both NanoRoute and Cadence Chip Optimizer for correction. TSMC cited TTM's ability to offer a cost-effective, reliable and dependable path for taking a design from concept to silicon. "Our mission to build a seamless interface for our customers, along with our varied experience complements the high standards set by TSMC," remarks Venkata Simhadri, TTM's president and chief executive officer.
"Adding Time to Market to our Design Center Alliance strengthens and expands our global network of, qualified IC design centers," says Tom Quan, deputy director of Design Methodology and Service Marketing at TSMC.
TSMC DCA provides broad service choices to designers, from register transfer level (RTL) design to chips, including full chip placement and routing, RTL-to-GDS implementation, as well as offering mixed-signal/analog/RF building blocks. Proven records of more than 300 tapeouts every year assure the risk reduction of TSMC's customers for design and manufacturing. TSMC DCA also fulfills all requirements of projects for TSMC's advanced processes.
The TSMC Open Innovation Platform(TM) efficiently and openly encourages the speedy implementation of innovation amongst the semiconductor design community, its ecosystem partners and TSMC's IP, design implementation and DFM capabilities, process technology and backend services. A key element of the Open Innovation Platform(TM) is a set of ecosystem interfaces and collaborative components initiated and supported by TSMC that more efficiently empowers innovation throughout the supply chain and which enables the creation and sharing of newly created revenue and profitability. TSMC's Active Accuracy Assurance (AAA) initiative is a critical part of the Open Innovation Platform(TM), providing the accuracy and quality required by the ecosystem interfaces and collaborative components.
About TTM Inc.
Incorporated in 1998, Time To Market (TTM) Inc. is an ASIC design and embedded software services company based in San Jose, Calif., with operations in Hyderabad and Bangalore, India. TTM's reputation is based on a long history of first time success and on-time delivery of large and complex designs in 90nm and 65nm silicon, with SERDES high-speed interfaces and flip-chip packaging. TTM has completed ASIC projects for leading electronics companies in the consumer, networking and communications markets. For more information about TTM, visit: www.time2mkt.com, or call (408) 213-0370.
Time to Market Inc. acknowledges trademarks or registered trademarks of other organizations for their respective products and services.
Source: Business Wire
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