High Growth Forecasted for the World System on a Chip Market
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World System on a Chip Market
This report analyzes the worldwide markets for System-On-A-Chip (SOC) in US$ Million.The specific end-use segments analyzed are Computers, Communication Equipment, Consumer Electronic Devices, Automotive Applications, and Others (Including Industrial Automation, Military, Medical and Other Applications). The major types of SOCs also analyzed are SoCs Based on Standard Cell, and SoCs Based on Embedded IP.The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual forecasts are provided for each region for the period of 2004 through 2015. The report profiles 189 companies including many key and niche players worldwide such as Actel Corporation, Altera Corporation, ARC International, ARM Holdings, Broadcom Corporation, Core Logic, Freescale Semiconductor, GCT Semiconductor Inc., Infineon Technologies, Intel Corporation, LSI Corporation, Marvell Technology Group Ltd., Matsushita Electric Industrial Co., Ltd, Mentor Graphics Corporation, NEC Electronics Corporation, NVIDIA Corporation, ON Semiconductors Corporation, Palmchip Corporation, Provigent, Inc., Renesas Technology Corp., Samsung Electronics Co., Ltd., STMicroelectronics N.V, Synopsys Inc., Taiwan Semiconductor Manufacturing Co. Ltd., Texas Instruments, Toshiba America Electronics Components, Xilinx, Inc., Zilog Inc., and Ziptronix, Inc. Market data and analytics are derived from primary and secondary research. Company profiles are mostly extracted from URL research and reported select online sources.
SYSTEM-ON-A-CHIP (SoC) MCP-1471 A GLOBAL STRATEGIC BUSINESS REPORT CONTENTS I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS Study Reliability and Reporting Limitations I-1 Disclaimers I-2 Data Interpretation & Reporting Level I-2 Quantitative Techniques & Analytics I-3 Product Definitions and Scope of Study I-3 II. EXECUTIVE SUMMARY 1. Market Highlights II-1 2. System-On-A-Chip: A Major Breakthrough in Semiconductor Industry II-2 Global System-on-a-Chip Market II-2 SoCs Grow at the Expense of Standalone Chips II-2 North America Dominates, Asia-Pacific Witnesses Fastest Growth II-3 Table 1: Global SoCs Market by Geographic Region/ Country: Percentage Share Breakdown for US, Canada, Japan, Europe, Asia-Pacific (Excluding Japan) and Rest of World for 2007 & 2010(includes corresponding Graph/Chart) II-3 Table 2: Global SoCs Market: Geographic Region/Country Ranked by Growth for US, Canada, Japan, Europe, Asia-Pacific (Excluding Japan), and Rest of World (includes corresponding Graph/Chart) II-4 SoCs Based on Embedded IP Steals the Limelight II-4 SoCs Based on Standard Cells Grows with Moderate Rate II-4 Table 3: Global SoCs Market by Product Type: Percentage Share Breakdown for SoCs Based on Standard Cell, and SoCs Based on Embedded IPs for 2007 & 2010 II-4 Table 4: Global SoCs Market: Product Types Ranked by Growth for SoCs Based on Embedded IP, and SoCs Based on Standard Cell II-5 Computers and Communications Lead End-use Category II-5 Table 5: Global SoCs Market by End-use Application: Percentage Share Breakdown for Computers, Communication Equipment, Consumer Electronics Devices, Automotive Applications and Others for 2007 & 2010 (includes corresponding Graph/Chart) II-6 Table 6: Global SoCs Market: End-Use Applications Ranked by Growth for Consumer Electronics Devices, Automotive Applications, Computers, Communication Equipment and Others (includes corresponding Graph/Chart) II-6 Consumer Electronics Products on a High Growth Track II-7 Increasing Usage of SoC Solutions in Medical Field II-7 3. Progression of the SoC Market II-8 4. Factors Driving S-o-C Market II-9 Increasing Need for Compactness and High Speed II-9 New End-Use Devices Spark Up SoCs Market II-9 Innovations Drive Growth II-9 Growing Demand for 90-nm Technology II-10 Customization to Meet Client's Requirements II-10 Advent of Three-Dimensional Chips II-10 SoC IP Designs Witness Rising Demand II-11 5. Competitive Overview II-12 Leading Players in the SoC Market II-12 Players in Hard Disk Drive SoCs Market - A Recent Past Perspective II-12 Table 7: Global Hard Disk Drives (HDD) SoCs Market: (2005): Percentage Share Breakdown by Company for Agere, Marvell and STMicroelectronics (includes corresponding Graph/Chart) II-12 6. Industry Challenges II-13 High Costs, a Major Deterrent II-13 Time-to-Market Pressures II-13 Verification Challenges II-14 Testers - A Solution to the Challenge II-14 IP Compatibility Issue II-15 Issues Related to Marketing of ICs II-15 Customer & Software Support and Staffing Challenges II-16 7. Market Trends & Issues II-17 Embedded Software to Power System-on-a-Chip (SoC) Solutions II-17 Advanced ESL Design-For-Verification Solution to Reduce Verification Time for Complex SoCs II-17 Dual-Core Processors Gain Ground II-17 ASIC Designs for Supersystems Make a Foray II-18 Development of IP Market II-18 Emergence of System-above-Chip (SaC) Market II-19 Advent of Lab-on-a-Chip (LoC) Technology II-19 Standardization to Drive the Market II-19 SoCs Surpasses Standalone Chip in Terms of Price II-20 Development of Reusable IPs II-20 Innovations Address Power Leakage and Multiple Tasks Handling II-20 Consolidation Fuels Growth II-21 Growth in the Semiconductor Manufacturing Equipment Sector II-21 Multi-Tasking Microprocessors Gain Significance II-21 EDA and Silicon Intellectual-Property (IP), Two Burgeoning Sectors II-21 PLD Market Demand - A Recent Past Perspective II-22 Table 8: Global Programmable Logic Device (PLD) Market: (2005): Percentage Share Breakdown by Company for Xilinx, Altera and Others (includes corresponding Graph/Chart) II-22 Customizable Analog IPs Add New Dimension to Complex SoCs II-22 FPGA Makes Inroads in the Semiconductor Chips Market II-22 Development of Premanufactured ASICs, and Flash- and SRAM- Series of FPGAs II-23 Innovative Design Configuration of FPGAs II-23 Emergence of Three-Tier Design Approach of FPGA-Based Chips II-23 Evolution of System-On-A-Programmable Chip (SOPC) II-23 Wide Application of SoCs in Mobile Phones and Broadband Networks II-24 Standard Logic and Interface Equipment Prevails II-24 Compact Size of Logic Devices Favors Growth II-24 8. Product Overview II-26 SoC - Emerging Technology in the Global Semiconductor Industry II-26 Components of SoC II-26 System-on-a-Chip (SoC) Block Diagram II-26 SoC Design Benefits II-26 "Second-Generation" SoCs II-27 ASIC SSOC - A New Dimension II-27 SoC Device Types II-27 Standard Cells II-27 Embedded IP II-27 Micro Logic IP II-28 Memory IP II-28 ASIC/PLD IP II-28 Analog IP & Other Components II-28 Standards for SoCs II-28 SoC Processor Types II-29 Soft Instruction Processors II-29 Configurable Processors II-29 Total Design Strategies for SoCs II-29 Architecture Strategy II-29 Design-for-Test Strategy II-30 Validation Strategy II-30 Synthesis and Back-End Strategy II-30 Integration Strategy II-30 9. SoC End-Use Applications II-31 Computers II-31 Communications Equipment II-31 Consumer Electronics Devices II-31 Automotive Applications II-31 Others II-32 Industrial Automation & Military II-32 Medical & Office Devices II-32 CRM and Hearing Aid Products Dominate the Category II-32 New Mixed-Signal Radio-Frequency (RF) Technology Design II-32 SoC-Equipped Nanorobots II-33 10. SoC Intellectual Property (IP) II-34 Interconnect - A Growing Sector of Semiconductor IP Market II-34 11. System-in-Package (SIP): A Potential Threat to System-on-a-Chip II-35 SiP Market II-35 12. Semiconductor Industry Overview II-36 Global Semiconductor Industry - Witnessing Rapid Growth II-36 The Moore's Law Gives Rise to Sophisticated, Faster and Cheaper Chips II-36 Technology Advancements Provide Necessary Impetus II-36 Semiconductor Industry by Geographic Markets II-36 Asia and the US - Two Major Semiconductors Market II-36 Leading Semiconductor Players - A Recent Past Perspective II-37 Table 9: Global Semiconductors Market by Leading Players (2005): Market Share Breakdown by Company for Intel, Samsung, Renesas, Texas Instruments, Toshiba, STMicroelectronics and Others (includes corresponding Graph/Chart) II-37 Semiconductors Market by End-Use Sectors - A Recent Past Perspective II-38 Table 10: Global Semiconductors Market (2005): Percentage Share Breakdown by End-Use Sector for EDP, Telecom, Industrial, Automotive, Consumer and Military & Others (includes corresponding Graph/Chart) II-38 Integrated Circuits and Fabless Market - A Recent Past Perspective II-38 IC Market II-38 Table 11: Global Market for IC Design Houses Using Foundry Services (2005): Percentage Share Breakdown by Region for South Korea, Japan, China, Taiwan and Rest of World (includes corresponding Graph/Chart) II-38 Fabless Market II-39 Table 12: Global Fabless Market (2005): Percentage Share Breakdown by Region for North America, Asia Pacific, Europe and Rest of World (includes corresponding Graph/Chart) II-39 Table 13: Global Fabless Market (2005): Percentage Share Breakdown by Company for Qualcomm, Broadcom, NVidia, ATI, SanDisk, Agilent Xilinx, Marvell, MediaTek, Altera and Others (includes corresponding Graph/Chart) II-39 MEMS Market II-40 Table 14: Global Micro-Electromechanical Systems (MEMS) Market (2005): Percentage Share Breakdown by Product Type for Actuators and Sensors II-40 13. SoC Technological Developments by Select Market Players II-41System-on-a-Chip (SoC) for Printers II-41 W-OFDM-SoCs II-41 Xilinx(R) Virtex(TM) FPGAs and Embedded Solutions II-41 EPON-Based System-on-a-Chip (SoC) II-42 RapidChip(R) SoC Prototyping Platform II-42 Analog Devices Othello-E Transceiver II-42 True System-on-a-Chip (SoC) II-42 14. Product Developments & Launches II-43 Broadcom Unveils Advanced Encoder/Transcoder SoC Solution II-43 Broadcom Showcases High Definition Set-Top Box System-on-a-Chip II-43 Broadcom Unveils a Single Chip DBS Set-Top-Box Solution II-43 GCT Semiconductor Unveils SoC Solution Supporting WiMAX and WiFi Functionality II-43 Infineon Releases CAT-iq(TM) Wireless Engine II-43 Broadcom Showcases a Whole New Range of SoC Solutions for Mobile Devices II-44 NVIDIA Introduces an Innovative Applications Processor II-44 Samsung Introduces Single-Chip Decoder II-44 Toshiba Introduces SoC Solution for ATSC LCD HDTVs II-44 Broadcom Uncovers Reference Design Platform for HD Optical Disc Players II-44 Broadcom Introduces Digital-to-Analog Adapter II-45 STMicroelectronics Introduces 'ST21NFCA' - SoC Solution for the NFC Market II-45 Broadcom Unveils SoC Solutions for the Mobile TV Market II-45 New Series of IC Tuners from Infineon II-45 TI Integrates Bluetooth(R), FM and GPS Technologies on to a Single Chip II-45 STMicroelectronics Releases Bluetooth(R) and FM-Radio SoC Solution II-45 Upgraded Version of 90-Namnometer Reference Flow from SMIC and Synopsys II-46 Syntax-Brillian Opts Digital TV SoC Solution from Broadcom II-46 Broadcom Showcases BCM7400B SoC II-46 Marvell Introduces Bluetooth Single-Chip Solution II-46 D2 Technologies Unveils Embedded VoIP Software II-46 Broadcom Rolls Out the New BCM4325 Single-Chip II-47 Westinghouse Digital Selects BCM3560 SoC Solution II-47 Broadcom Releases the BCM7118 Single Chip II-47 Infineon Launches 3G ADSL2+ SoC II-47 ARC International Launches New VRaptor(TM) Media Architecture II-47 MOSAID Rolls Out Memorize(TM) and Fractional-N PLL II-48 Starport Systems Unleashes SoC Solution for Gen2 UHF RFID Readers II-48 Alvand Technologies Unveils SoC Humming-B(TM) Family of Tuners II-48 MagnaChip Releases MC531EA SoC Imaging Solution II-48 Genesis Microchip Unveils the Chaplin DTV family of ICs II-48 PMC-Sierra Unveils the PAS65311 GPON ONT Reference Design Solution II-48 STMicroelectronics Unleashes the SPEAr Head600 and SPEAr Plus600 ICs II-49 CAST, Inc. Rolls Out the SOC Kernels II-49 ARM and Northwest Logic's PCI-SIG-compliant solution II-49 Cypress Releases The PSoC Express 2.1 II-49 Texas Instruments Unveils Single-Chip NaviLink(TM) 5.0 Solution II-49 Sonics Launches New Version of SonicsMX(R) SMART Interconnect(TM) Solution II-50 SanDisk to Roll Out 8-Gb & 16Gb MLC NAND Flash Memory Chip II-50 Broadcom Launches BCM7440 Blu-ray/HD DVD SoC Solution II-50 Freescale Launches PowerQUICC(TM) III Processor Line II-50 Freescale Introduces Multicore MPC8572 Family II-50 Freescale Unveils the MPC8323E Processor II-51 GCT Semiconductor Releases Monlothic Single Chip II-51 National Semiconductor and ARM Launch PWI 2.0 Specification II-51 NEC Electronics Rolls Out UX7LSeD Technology II-51 NEC Electronics Launches MP201 Single-Chip Application Processor II-51 NEC Electronics Introduces 55nm Standard CMOS Process Technology II-51 National Semiconductor LM5071 Single Chip Solution II-52 Synopsys Unveils DesignWare(R) Mobile Storage II-52 Denali's Databahn(TM) Product Released for NAND Flash Memory Devices II-52 Pixelplus Unleashes PM1001 and PO4030 SoC Solutions II-52 Adventiq's Launches KVM System-On-A-Chip Product II-52 Semtech Corporation Rolls Out SX8801R SoC for Data Acquisition II-53 Key ASIC Unleashes the KeySoC(TM) Platform II-53 Summit Unleashes the Panorama(TM) in Three Configurations II-53 Micronas Unveils a New Audio SoC Solution for TV - Manufacturers II-53 LTRIM Technologies Launches Latest Genre of DC-DC Converter IP Blocks II-54 Silistix's New Chip Area Interconnection (CHAIN) Scheme II-54 SigmaTel Unleashes the STDC3000 SoC Controller Solution II-54 Chipcon Releases the 'CC1110' SoC Solution for Wireless Payment Systems II-54 Atmel(R) Corporation Launches its All-Format DVD SoC II-55 Pixelplus Releases the 1.3 Megapixel Image Sensor PO5130 SoC II-55 Broadcom Introduces SoC Power Management Unit II-55 FMA Launches the Mobile WiMAX System-on- Chip (SoC) Solution II-55 DSP Group Unveils A New System-on-a-Chip Solution II-55 IP Cores Introduces Two Advanced Encryption Standard (AES) Based Security IP Cores II-56 PMC-Sierra Unveils Multi-Service MIPS-based Processor SoC Solution II-56 Conexant Releases ADSL2plus Central Office SoC Solution II-56 TI Releases VoIP System-on-a-Chip Solution II-56 Zoran Unveils System-on-Chip Approach 5 family of Processors II-56 DAFCA Releases ClearBlue(TM) version 2006.1 Product Suite II-57 TEK Microsystems and QinetiQ RTES Jointly Develop the JazzStore SoC(TM) II-57 LG to Design SoCs by Employing Apache's RedHawk-EV Solution II-57 Faraday Unveiled the FIE7010- an MP3 Player SoC Platform II-57 Pixelplus Releases Second Generation of SoC Image Sensors II-57 PMC-Sierra Launches the PM5336 ARROW 2488 II-58 Provigent Introduces Development Kit for Wireless PTP Systems II-58 Renesas Unveils Transistor Technology Using Hybrid CMIS Transistors II-58 Renesas Unleashes the "SH7774" SoC Solution for Car Navigation Devices II-58 Renesas Introduces Chip-on-Chip Technology II-58 S2C Releases Two Models of Rapid FPGA Prototyping Solution Series II-59 Samsung Electronics Unveils System-on-Chip Solution for Hybrid Drive II-59 STMicroelectronics Introduces the T90 System-on- Chip (SoC) Solution II-59 Synopsys Develops PCI Express to AMBA 2.0 AHB DesignWare(R) Bridge II-59 Toshiba Introduces Second Generation of TC904XX Family of SoCs II-59 Toshiba Unveils 2.0 Megapixel and 3.2 Megapixel CMOS SoC Image Sensors II-60 Hua Hong NEC and Synopsys Unveil their Reference Design Flow 2.0 II-60 Sonics Inc., Unveils SonicsMX SMART Interconnects Solution II-60 Sonics White Paper Defining SoC Interconnect Options for Developers II-60 Sonics Introduces the SonicsLX SMART Interconnect Solution II-60 Actel Introduces Design Infrastructure for ARM7-Enabled Fusion Programmable System Chips II-61 Actel Unveils the CoreMP7 Development Kit for ARM7-Enabled CoreMP7 Soft Processor Core II-61 Cypress Semiconductor Launches New Evaluation Kit for Wireless Radio System-on-a-Chip (SoC) II-61 Pentax Introduces Optio A10 Image Stabilization System Using Cypress' PsoC II-61 Hynix and M-Systems Introduces DOC Embedded Flash Drive (EFD) II-61 Sonics Unveils a New S3220 SMART Interconnects Solution II-61 Atmel Unveils New SoC Solution II-62 Agere Systems Develops USB 2.0 SoC II-62 Sunplus Unveils SPG290, a High-Performance System-on-a-Chip (SoC) II-62 Renesas Introduces Two Single-Chip ICs II-62 Renesas Unveils SH7397 32-Bit Microprocessor as a Single Chip Solution II-62 STMicroelectronics Releases 90nm HDD SoC devices II-63 Zoran Launches APPROACH 5, SoC for Mobile Handsets II-63 SigmaTel Unveils New SoC Solution for Multi-Function Printers II-63 CEVA Introduces a New DSP Architecture, the CEVA-X1621(TM) II-63 Conexant Systems Unveils Integrated Xenon SoC Solution II-63 K-Micro Releases Topaz Computing Subsystem for SoCs II-64 Samsung Electronics Introduces 90-nm SoCs for Mobile Applications II-64 Magma and ARM Unveils an Advanced Implementation Solution for SoC Designs II-64 Parama Networks Unveils Transport SoC Technology II-64 Renesas Develops Advanced TTRAM for High-Speed and Low Power Consuming Applications II-64 Renesas Introduces Automated Device Sizing System for Use in SoCs II-65 S2C Releases New Interconnect Technology for SoC Designs II-65 PortalPlayer Introduces Two New Audio SoCs II-65 LSI Logic Corporation Innovates RapidChip SoC Prototyping Platform II-65 PRO/Wireless 5116 SoC from Intel II-65 New SoC Solution from Micronas II-65 Chipcon Innovates CC2431 ZigBee(TM) SoC Solution II-66 Ziptronix Develops Three-Dimensional System-on-a-Chip Device II-66 1st Silicon and ZFOUNDRY Develops A18 Technology II-66 Chipcon Unveils CC2430 ZigBee SoC Solution II-66 Cypress Unveils 1.3-Megapixel SoC and Image Sensor Solutions II-66 Marvell Unveils VoWLAN SoC Solutions II-67 Micron Technology Unveils New SoC Sensor II-67 Mindspeed Technologies Introduces SoC Solution II-67 BroadLight Unveils BL2000 SoC II-67 STMicroelectronics Innovates SoC IC Devices II-68 RF Micro Devices Releases SiW4000 Bluetooth SoC Solution II-68 Vitesse Unveils Ethernet Switch System-on-a-Chip Solutions II-68 Cypress Develops Programmable System-on-a-Chip, CY8C24794-24LFXI II-69 Cypress Launches Programmable SoC, CY8C21x23 II-69 FS2 System Navigator from First Silicon Solutions II-69 AMI Semiconductor Enhances its SmartPower SoC Mixed-Signal IC Technology II-69 AMI Semiconductor Develops Miniature Single-Chip Stepper Motor Driver-Controller ICs II-69 Atheros Develops Integrated Single-Chip 802.11g Access Point Solution II-70 Matsushita (Panasonic) Develops HD-PLC Technology for Home Networking Applications II-70 AXIOM Introduces MPSim(TM) System Verilog Verification II-70 Provigent Launches PVG310 Single-Chip Modem II-70 QUALCOMM and TSMC Jointly Develops 90-nm MSM(TM) Solutions II-70 Renesas Offers Embedded DRAM Core for SoCs II-71 RF Micro Unveils SiW4000(TM) SoC Bluetooth(R) Solution II-71 Samsung Develops ViP Design Methodology for Significantly Reducing SoC Design Time II-71 QuickLogic Corporation Introduces New Programmable SoC Devices II-71 New Solution for ESL Designs II-71 Vitesse Develops Gigabit Ethernet Switches II-71 Passave Develops SoC for EPON II-72 Enpirion Unveils Power SoC Solution II-72 CEVA Unveils Xpert-Palm II-72 Agilent Offers SoC Solution for PDAs II-72 Advantest Develops New T2000 MS Mainframe for Mid-Range SoCDevices II-72 Advantest Introduces T6577 SoC Test System II-73 15. Recent Industry Activity II-74 ON Semiconductor Acquires AMI Semiconductor II-74 Broadcom Takes Over Sunext Design II-74 Broadcom Collaborates with Microsoft II-74 Broadcom Along with Coship Provides HD Set-Top Box Solution in China II-74 Zilog Signs Distribution Agreement with Nu Horizons II-74 BroadLight partners with ITRI II-75 ARC Extends Collaboration Agreement with Toshiba II-75 Samsung Uses Integrated FM Radio and Bluetooth(R) SoC from Broadcom II-75 NEC Opts Wipro to Provide Semiconductor Design Solutions II-75 Axiom Invests US$3 Million for New R&D Center in India II-75 Matsushita Implements IC Compiler of Synopsys II-75 EtherWaves Acquires Sonarics II-76 Silicon Image Acquires sci-worx II-76 Cortina Systems Acquires ImmenStar II-76 Wipro Acquires OTCS II-76 Synopsys Acquires MOSAID IP Assets II-76 BroadLight Collaborates with OpenCon Systems II-76 Mindspeed Partners with Terawave II-76 IC Nexus Partners with HDL Design House II-77 Global Unichip Allies with Vivante Graphics II-77 Jazz and Fujitsu Join Forces II-77 Coronis Systems Partners with Essensium N.V. II-77 Global Unichip Opts Testing Solution from Synopsys II-77 Core Logic to Establish Solution Center in China II-78 Newark Signs Franchise Agreement with Cypress II-78 Silicon Image Signs an Accord with Sunplus II-78 ARC Signs Multiple Agreements II-78 Global IP Sound Changes to Global IP Solutions II-78 Faraday Forms an Alliance with Palmchip Corporation II-78 CAST Enters into a Distribution Agreement with S2C II-78 Renesas - ZMD Alliance to Introduce 900-MHz Band ZigBee(R) Chipset by 2008 II-79 Renesas Enters into an Agreement with Key Stream Corporation II-79 Renesas and Matsushita into their Fifth Stage of Collaboration II-79 Renesas Employs Synopsys' VCS Verification Solution and VMM Methodology II-79 Renesas Adopts Synopsys' IC Compiler Solution II-79 S2C Inc. is Tensilica(R) Inc.'s New Prototyping Partner in China II-79 Sonics Inc.(R) Enters into an Agreement with Ricoh Company II-80 MoSys Adopts SMIC's CMOS Process Technology II-80 e2v Opts Tower Semiconductor to Manufacture CMOS Image Sensors II-80 Haier Group Adopts Broadcom's Digital TV System-on-Chip Solution II-80 AMI Semiconductor Acquires Assets of NanoAmp II-80 AMD Acquires ATI Technologies II-80 LSI Buys Metta Technology II-81 NVIDIA Acquires PortalPlayer II-81 PMC-Sierra Acquires Passave II-81 Broadcom Purchases Sandburst II-81 Texas Instruments Purchases Chipcon AS II-81 Essensium Acquires Mind II-81 inSilicon and Sonics Form an Alliance for Developing Plug-and -Play SoC Platforms II-82 Sonics and CoWare(R) Enter into a Distribution Agreement II-82 BroadLight Enters into a Contract with Askey Computer II-82 Actions Semiconductor and GMI Sign an Agreement II-82 Mistletoe and eSilicon Develop an Integrated VPN-firewall SoC II-82 Matsushita Collaborates with Renesas to Test 45-nm SoC Technology II-82 Imagination Starts Operations in the US II-82 Air Broadband Selects FMA's WiMAX SoC Solution II-83 ARM Licenses Advantage and Metro Products for 45 nm Technology II-83 QUALCOMM Starts Production of 90nm Chips II-83 eASIC Adds Two European Firms to Support Nextreme Line II-83 Newport Grabs More Funds to Develop SoC Solutions II-83 Sonics Inks an Agreement with CoWare II-83 SMIC and ARC Sign A Joint Agreement II-83 Toshiba Signs an Agreement with ARM II-84 ARCA Licenses ARM926EJ-STM Processor II-84 CMP Licenses ARM(R) RealView(R) ESL Tools II-84 Freescale to License The V2 ColdFire Core II-84 GCT Gets License for ARM926EJ-S(TM) Processor II-84 MIPS and msystems Unite to Develop a Safe-SOC(TM) Security platform II-84 Mobileye Obtains License for MIPS32(R) 34Kf(TM) Core II-85 Extreme DA Collaborates with UMC II-85 Scaleo chip Signs an Agreement with Wipro-NewLogic II-85 Key ASIC Partners with Silterra Malaysia Sdn. Bhd. II-85 STMicroelectronics Partners with iBiquity Digital Corporation II-85 SOCLE Employs UMC's 90nm Process Technology II-85 Wipro Technologies Partners with Tensilica's Processor Core Design Center II-86 Global Locate Partners with Toshiba to Roll Out Marlin(TM) A-GPS Chip II-86 Renesas Design Vietnam Opts Synopsys as EDA Provider II-86 CoWare Enters into a Strategic Agreement with Sonics II-86 CoFluent Collaborates with Sonics Inc. II-86 Summit Sells SystemC-based Sonics SMART Interconnects Solutions II-86 Bay Microsystems Acquires Parama Networks II-87 Broadcom Acquires Athena Semiconductors II-87 Cadence Acquires Verisity II-87 MOSAID Takes Over Virtual Silicon II-87 NVIDIA and ARM Enters into a Licensing Agreement II-87 SkyPilot Enters into a Contract Agreement with Fujitsu Microelectronics for WiMAX SoCs II-88 Virage Logic Enters into an Agreement with UMC II-88 ZAiQ Technologies Teams Up with S2C Inc. II-88 Synopsys Joins Forces with UMC II-88 Marvell Enters into a Deal with UTStarcom II-88 Tensilica Signs an Agreement with EVE II-88 Global UniChip Signs an Agreement with Synopsys II-89 Tower Semiconductor and Cadence Joins Forces II-89 Silterra Teams Up with Essensium II-89 White Electronic Designs Secures Contract for Supply of SoC Microprocessor Modules II-89 BroadLight Enters into a Licensing Agreement with MIPS Technologies for MIPS(R) Processor II-89 ARM Acquires Artisan Components II-89 Flextronics Partners with inSilica for the Development of SoC Solutions II-90 ARM, Artisan Components, NSC, Synopsys and UMC Collaborate for Advanced SoC Technology II-90 Ansoft Corporation Joins forces with Synopsys, Inc II-90 Nordic Semiconductor Obtains New Components Contract in Europe II-90 16. Related Product/Corporate Developments II-91 Imagination Technologies Unveils New HD Video Decoder Core II-91 Mobileye Selects SMART Interconnect Solution of Sonics II-91 Cypress Semiconductor Introduces CY3630 Evaluation Kit for its Wireless Radio SoCs II-91 Renesas Technology Unveils Twin-Transistor RAM II-91 New Products from Texas Instruments II-92 K-Micro Develops Topaz Computing Subsystem II-92 New Innovations from AMI Semiconductor II-92 MemMax Memory Scheduler from Sonics, Inc II-92 Sonics Inc. Unveils New Version of SonicsMX SMART Interconnect II-92 SkyPilot Networks Selects SoC Solutions of Fujitsu Microelectronics II-93 Agere Systems Deploys IC Compiler of Synopsys II-93 Aperto Employs SoC Solutions of Fujitsu II-93 Jazz Semiconductor Unveils Innovative Process Platform for Advanced RF and Analog SoCs II-93 Telairity Launches Unique Processor Architecture for High Definition Video II-93 CoWare and Cadence Develop ESL Design Verification Flow II-93 Advantest Unveils Mid-Range SoC Test Solution II-94 Mentor Graphics Introduces Platform Express Product for SPIRIT 1.0 Norms II-94 17. Focus on Select Players II-95 Actel Corporation (US) II-95 Altera Corporation (US) II-95 ARC International (US) II-95 ARM Holdings (UK) II-95 Broadcom Corporation (US) II-96 Core Logic (South Korea) II-96 Freescale Semiconductor (US) II-96 GCT Semiconductor Inc. (US) II-97 Infineon Technologies (Germany) II-97 Intel Corporation (US) II-97 LSI Corporation (US) II-98 Marvell Technology Group Ltd. (US) II-98 Matsushita Electric Industrial Co., Ltd (Panasonic) (Japan) II-99 Mentor Graphics Corporation (US) II-99 NEC Electronics Corporation (Japan) II-100 NVIDIA Corporation (US) II-100 ON Semiconductors Corporation (US) II-100 Palmchip Corporation (US) II-101 Provigent Inc. (US) II-101 Renesas Technology Corp. (Japan) II-102 Samsung Electronics Co., Ltd. (South Korea) II-102 STMicroelectronics N.V. (Switzerland) II-102 Synopsys Inc. (US) II-103 Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan) II-103 Texas Instruments (US) II-104 Toshiba America Electronics Components (US) II-104 Xilinx Inc. (US) II-104 Zilog Inc. (US) II-105 Ziptronix, Inc. (US) II-105 18. Global Market Perspective II-106 Table 15: World Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) by Geographic Region/Country - US, Canada, Japan, Europe, Asia-Pacific (Excluding Japan) and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2004 through 2010 (includes corresponding Graph/Chart) II-106 Table 16: World Long-term Projections for System-on-a-Chip (SoC) by Geographic Region/Country - US, Canada, Japan, Europe, Asia-Pacific (Excluding Japan) and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart) II-107 Table 17: World 10-Year Perspective for System-on-a-Chip (SoC) by Geographic Region/Country - Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (Excluding Japan) and Rest of World Markets for 2004, 2008 and 2013 (includes corresponding Graph/Chart) II-108 Table 18: World Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) by Product Type - SoCs Based on Standard Cell and SoCs Based on Embedded IP Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2004 through 2010 (includes corresponding Graph/Chart) II-109 Table 19: World Long-term Projections for System-on-a-Chip (SoC) by Product Type - SoCs Based on Standard Cell and SoCs Based on Embedded IP Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2011 through 2015(includes corresponding Graph/Chart) II-110 Table 20: World 10-Year Perspective for System-on-a-Chip (SoC) by Product Type - Percentage Breakdown of Dollar Sales for SoCs Based on Standard Cell and SoCs Based on Embedded IP Markets for 2004, 2008 and 2013 II-110 Table 21: World Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) by End-Use Application - Computers, Communications Equipment, Consumer Electronics Devices,Automotive Applications and Other Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2004 through 2010 (includes corresponding Graph/Chart) II-111 Table 22: World Long-term Projections for System-on-a-Chip (SoC) by End-Use Application - Computers, Communications Equipment, Consumer Electronics Devices, Automotive Applications and Other Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart) II-112 Table 23: World 10-Year Perspective for System-on-a-Chip (SoC) by End-Use Application - Percentage Breakdown of Dollar Sales for Computers, Communications Equipment, Consumer Electronics Devices, Automotive Applications and Other Markets for 2004, 2008 and 2013 (includes corresponding Graph/Chart) II-113 III. MARKET 1. North America III-1 Semiconductors Market Perspective III-1 An Overview of the SoC Market III-1 1a. The United States III-2 A.Market Analysis III-2 Rise in SoC End-Use Sectors Drives the Growth III-2 Technological Innovations Adds to Growth III-2 The U.S. Companies Follows Outsourcing Strategy to Reduce Costs III-2 Product Developments & Launches III-2 Strategic Corporate Developments III-26 Related Product/Corporate Developments III-37 Focus on Select Players III-40 Actel Corporation III-40 Altera Corporation III-40 ARC International III-40 ARM-US III-41 Atmel Corporation III-41 AXIOM Design Automation III-41 Broadcom Corporation III-41 Sandburst Corporation III-42 BroadLight, Inc. III-42 Cadence III-42 Conexant Systems, Inc III-42 CPU Technology, Inc III-42 Cypress Semiconductor Corp III-43 Enpirion III-43 Eureka Technology III-43 Freescale Semiconductor III-43 Fujitsu Microelectronics III-44 GCT Semiconductor Inc. III-44 IBM Microelectronics III-44 Intel III-44 LSI Corporation III-45 Marvell Technology Group Ltd. III-46 Magma Design Automation III-46 Mentor Graphics Corporation III-46 Mindspeed Technologies III-47 MIPS Technologies III-47 Motorola III-47 National Semiconductor III-47 NEC Electronics America III-48 NeoMagic Corporation III-48 NVIDIA Corporation III-48 ON Semiconductors Corporation III-48 Palmchip Corporation III-49 Palmchip Semiconductor III-49 Bay Microsystems III-50 PMC-Sierra III-50 Provigent Inc. III-50 QuickLogic Corporation III-50 RF Micro Devices III-51 S2C Inc. III-51 SanDisk Corp. III-51 Sonics, Inc III-52 Synopsys Inc. III-52 Texas Instruments Incorporated III-53 Toshiba America Electronics Components III-53 Wipro Technologies III-53 Xilinx Inc. III-54 Zilog Inc. III-54 Ziptronix, Inc. III-54 B.Market Analytics III-55 Table 24: The US Recent Past, Current & Future Analysis for System- on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2004 through 2010 (includes corresponding Graph/Chart) III-55 Table 25: US Long-term Projections for System-on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart) III-55 1b. Canada III-56 A.Market Analysis III-56 Mosaid Technologies, Inc. - A Major Player III-56 B.Market Analytics III-57 Table 26: The Canadian Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2004 through 2010 (includes corresponding Graph/Chart) III-57 Table 27: Canadian Long-term Projections for System-on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2011 through 2015(includes corresponding Graph/Chart) III-57 2. Japan III-58 A.Market Analysis III-58 An Overview of Japanese Semiconductor Market III-58 Consumer Profile III-58 Foreign Players Ties-Up with Local Fabricators and Vendors III-58 Local Companies Expands Customer Base III-58 SoC Market Overview III-58 Growth in IC Sector III-59 Product Developments & Launches III-59 Strategic Corporate Developments III-61 Related Product/Corporate Developments III-62 Focus on Select Players III-62 Hitachi, Ltd. III-62 Matsushita Electric Industrial Co., Ltd (Panasonic) III-63 NEC Electronics Corporation III-63 Renesas Technology Corp. III-64 B.Market Analytics III-64 Table 28: Japanese Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2004 through 2010 (includes corresponding Graph/Chart) III-64 Table 29: Japanese Long-term Projections for System-on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart) III-65 3. Europe III-66 A.Market Analysis III-66 Semiconductors Market Overview III-66 SoC Market Overview III-66 Semiconductors Market by European Regions - A Recent Past Perspective III-66 Table 30: Semiconductors Market in Europe (2005 & 2006): Percentage Share Breakdown by Region/ Country for Germany, UK, France, Nordic Countries, Italy, Benelux Region and Rest of Europe (includes corresponding Graph/Chart) III-66 Semiconductors Market by End-Use Sectors - A Recent Past Perspective III-67 Table 31: Semiconductors Market in Europe (2005): Percentage Share Breakdown by End-Use Sector for EDP, Telecom, Automotive, Consumer, Industrial and Military & Others (includes corresponding Graph/Chart) III-67 Consolidation Drives the Market III-67 Market Trends III-67 SoC Deployment Rises for the Automotive and the Communications Sector III-67 Demand for Pre-Configured Functional IP Blocks Rising III-68 Subcontracting Increases for Final SoC Products Assembly to Low- Cost European Countries III-68 Product Developments & Launches III-68 Strategic Corporate Developments III-71 Related Product/Corporate Development III-72 Focus on Select Players III-72 ARM Holdings (UK) III-72 Essensium (Belgium) III-73 Infineon Technologies (Germany) III-73 NEC Electronics (Europe) (Germany) III-73 Nordic Semiconductor (Norway) III-73 OKI Electric Europe (Germany) III-74 Samsung Electronics (UK) III-74 STMicroelectronics N.V. (Switzerland) III-74 B.Market Analytics III-75 Table 32: European Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2004 through 2010 (includes corresponding Graph/Chart) III-75 Table 33: European Long-term Projections for System-on- a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart) III-75 4. Asia-Pacific III-76 A.Market Analysis III-76 SoC Market Overview III-76 Asia Emerges as a Major Market for SoC Deployment in Wireless Devices III-76 China III-76 India III-77 From Just Design to Complete Solutions III-77 Challenges Faced III-77 South Korea III-77 Integrated Circuits (ICs) Market - A Recent Past Perspective III-77 Table 34: Integrated Circuits (ICs) Market in Korea (2005): Percentage Share Breakdown by End-Use Services for Corporate Management, Design & Development, Engineering Management, Test Engineering and Others (includes corresponding Graph/Chart) III-78 Korean SoC Market on a Rise III-78 Product Developments & Launches III-79 Strategic Corporate Developments III-81 Focus on Select Players III-84 X-FAB Sarawak Sdn. Bhd. (Malaysia) III-84 5V Technologies (Taiwan) III-85 Core Logic (South Korea) III-85 Dongbu HiTek Company Ltd. (South Korea) III-85 EE Solutions (Taiwan) III-85 Faraday Technology Corp. (Taiwan) III-85 Global Unichip Corp. (Taiwan) III-86 Hynix Semiconductor (South Korea) III-86 ICNexus (Taiwan) III-86 Insilica Semiconductors (India) III-86 Integrated Circuit Solution (Taiwan) III-87 Samsung Electronics Co., Ltd. (South Korea) III-87 Silicon Motion Technology (Taiwan) III-87 Silterra Malaysia Sdn. Bhd. (Malaysia) III-87 Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan) III-88 United Microelectronics Corp. (Taiwan) III-88 B.Market Analytics III-89 Table 35: Asia-Pacific Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2004 through 2010 (includes corresponding Graph/Chart) III-89 Table 36: Asia-Pacific Long-term Projections for System-on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart) III-89 5. Rest of World III-90 Market Analysis III-90 Table 37: Rest of World Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2004 through 2010 (includes corresponding Graph/Chart) III-90 Table 38: Rest of World Long-term Projections for System-on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart) III-90 IV. COMPETITIVE LANDSCAPE
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