E-Shuttle to Feature Its Electron-Beam Direct Write (EBDW) Technology at GSA Suppliers Expo Oct. 2 in Santa Clara

SUNNYVALE, Calif., Sept. 30 /PRNewswire/ — e-Shuttle, Inc., the company established by Fujitsu Microelectronics Limited and Advantest Corporation to provide prototyping services for leading-edge, large-scale ICs, will feature its Electron-Beam Direct Write (EBDW) technology at the GSA Suppliers Expo & Conference in the Santa Clara Convention Center, October 2.

In booth 701, e-Shuttle will show a 300mm wafer developed using its industry-leading 65nm technology, along with a complete roadmap highlighting current features and future developments. e-Shuttle is now offering the EBDW technology for manufacturing 65nm CMOS logic ICs, which represents the first full-scale application of EBDW techniques for complex devices. The company is also successfully applying EBDW technology for devices using 90nm process technology, manufacturing structured ASICs for fabless semiconductor companies. Producing single-layer via interconnect patterns using EBDW provides a short delivery cycle with mask-less production, with yields comparable to optical lithography.

The 300mm wafer shuttle service — in which wafer delivery combines the orders of multiple customers — reduces costs. Via layers are formed using EBDW, reducing the significant costs involved in forming via layers for ultra-fine interconnects using masks. The EBDW technology has achieved excellent results without compromising yield, demonstrating that EB lithography and ArF lithography can coexist in the fabrication process.

The e-Shuttle F3000 system features a short focal length lens that reduces coulomb interaction when beam current density is high. The F3000 also can project as many as 100 different patterns in a single block area, with a total of 12 blocks available for the user. In addition, in-situ cleaning eliminates the risk of contamination and assures high up-time operation.

About e-Shuttle

Headquartered in Kawasaki, Japan, e-Shuttle, Inc., was founded by Fujitsu Microelectronics Limited and Advantest Corporation on November 1, 2006, to develop EBDW technologies for 90-, 65- and 45-nanometer process technologies, and to establish and offer semiconductor prototyping services, SiExpress(TM). For more information, visit http://www.e-shuttle.co.jp/

All company and other product names mentioned may be trademarks or registered trademarks of their respective owners.

e-Shuttle, Inc.

CONTACT: media, Emi Igarashi, 1-408-737-5647, eigarash@fma.fujitsu.com;or eShuttle, Takahisa Takanoe, +81-44-754-2550, fax, +81-44-754-2551,takano.takahisa@ip.fujitsu.com, both for e-Shuttle, Inc.

Web site: http://www.fma.fujitsu.com/http://www.e-shuttle.co.jp/