October 28, 2008
EADS Astrium, Hifn, Innovision Research, Magnum Semiconductor, Rockwell Collins, Universite De Cergy Pontoise, Vivante, and Wipro Join OCP-IP
Open Core Protocol International Partnership (OCP-IP) today announced that EADS Astrium, Hifn, Innovision Research and Technology, Magnum Semiconductor, Rockwell Collins, Universite de Cergy Pontoise, Vivante Corporation, Wipro Technologies, and Zoetronics Join OCP-IP. The eight new members illustrate the strong support and industry-wide adoption of the OCP standard. OCP-IP members receive free training and support, software tools, and documentation, enabling them to focus on the challenges of SoC design. Leveraging OCP-IP's infrastructure eliminates the need to internally design, document, train and evolve a proprietary standard and accompanying support tools, freeing up critical resources for the real design work, while providing enormous cost savings.
Astrium, a wholly owned subsidiary of EADS, is dedicated to providing civil and defense space systems and services. Astrium has 12,000 employees in France, Germany, the United Kingdom, Spain and the Netherlands. Its three main areas of activity are Astrium Space Transportation for launchers and orbital infrastructure, Astrium Satellites for spacecraft and ground segment and its wholly owned subsidiary Astrium Services for the development and delivery of satellite services.
Innovision Research & Technology plc (AIM:INN), is leading the next generation of NFC/RFID solutions. As a leading fabless developer of Short-Range Data Communication semiconductor and system solutions, with particular focus on NFC/RFID (Radio Frequency Identification) and ultra low-cost Integrated Circuit (IC) and RF electronic design, IRT is pushing cost performance to enable clients to get maximum utility for minimum cost. The company develops innovative semiconductor technologies, ICs, RF systems (HF/UHF) and complete end product applications for mass volume commercialisation and then licenses customers for its incorporation into their own products. At the heart of the emerging Near Field Communication (NFC) market, Innovision R&T designs and develops NFC/RFID IC solutions for the global mobile handset and consumer device sectors.
Magnum Semiconductor is a premier provider of chips, software, reference platforms and engineering support services for recording, viewing and managing high quality audio/video content. Magnum Semiconductor is headquartered in Milpitas, Calif. with sales and engineering offices in Canada, China, Japan, and Korea.
Rockwell Collins (NYSE:COL) is a pioneer in the development and deployment of innovative communication and aviation electronics solutions for both commercial and government applications. Our expertise in flight deck avionics, cabin electronics, mission communications and information management, and simulation and training is strengthened by 20,000 employees, and a global service and support network that crosses 27 countries.
Universite de Cergy Pontoise is a leading centre of teaching and research, in France. The university is ideally located just 30 kms west of central Paris, in the Val-d'Oise department. The university offers all levels of graduate and post-graduate studies. 134 bachelor's, master's and doctorate degrees are available in a wide range of fields: law, economy and management, languages, literature and social sciences, and science and technology.
Vivante Corporation is a graphics technology company licensing 2D and 2D/3D GPU IP cores delivering HD Visual Reality(TM) and Mobile Visual Reality(TM) to semiconductor solution providers targeting the high definition home entertainment, embedded mobile, image processing and automotive display and entertainment markets. Vivante's GPU technology is architected from the ground up to deliver a high precision, ultra-threaded shader implementation which maximizes graphics performance and quality delivered per milliwatt of system power consumption. All of Vivante's 2D/3D GPU cores are fully compliant with industry standard APIs including OpenGL(R) ES 2.0, OpenVG(TM), and OpenGL ES 1.1. Today Vivante licensees are demonstrating SoC products which include OpenGL ES 2.0 compliant GPUs with the world's smallest silicon footprint. Vivante Corporation is headquartered in Sunnyvale, California with a subsidiary in Shanghai, China.
Wipro Technologies, a division of Wipro Limited (NYSE:WIT) is the first PCMM Level 5 and SEI CMM Level 5 certified global IT services organization. Wipro Technologies was recently assessed at Level 5 for CMMI V 1.2 across offshore and onsite development centers. Wipro is one of the largest product engineering and support service providers worldwide. Wipro provides comprehensive research and development services, IT solutions and services, including systems integration, information systems outsourcing, package implementation, software application development, and maintenance services to corporations globally. As a designer of 50+ high performance SoCs every year, Wipro will work closely with the OCP-IP foundation in advancing interconnect architectures.
"This new group of members represents a diverse set of product offerings, and highlights the broad OCP acceptance and adoption across many markets," said Ian Mackintosh, president of OCP-IP. "We are very proud to announce and welcome our new members, and look forward to working with them in the future."
For the latest information on OCP-IP please see our free quarterly newsletter at http://www.ocpip.org/pressroom/newsletters/
The OCP International Partnership Association, Inc. (OCP-IP), formed in 2001, promotes and supports the Open Core Protocol (OCP) as the complete socket standard ensuring rapid creation and integration of interoperable virtual components. OCP-IP's Governing Steering Committee participants include: Nokia (NYSE:NOK), Sonics Inc., Synopsys (SNPS), Texas Instruments (NYSE:TXN), and Toshiba Semiconductor Group (including Toshiba America TAEC). OCP-IP is a non-profit corporation delivering the first fully supported, openly licensed, core-centric protocol comprehensively fulfilling system-level integration requirements. The OCP facilitates IP core reusability and reduces design time, risk, and manufacturing costs for SoC designs. For additional background and membership information, visit www.OCPIP.org.
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