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Enable Customers’ Fastrack to USB 3.0, Faraday Pioneers to Launch Its USB 3.0 PHY in UMC 0.13um

May 14, 2009

HSINCHU, Taiwan and SUNNYVALE, Calif., May 14 /PRNewswire-Asia-FirstCall/
– Faraday Technology Corporation (TAIEX: 3035) today announced the
availability of the commercial USB 3.0 physical layer (PHY) at UMC 0.13um
high-speed (HS) process. This new component is based upon USB 3.0 version 1.0
specification, functionally and electrically, with the maximum speed of
5.0Gbps.

Succeeding to the successful histories on USB 2.0, Faraday’s USB 3.0 PHY
is one of the earliest solutions appearing in the market. Due to the demand of
higher-speed peripheral interface evoked by the widening gap between the speed
limitation of USB 2.0 and increasing growth of data capacity; the application
of USB 3.0 (SuperSpeed USB) will cover not only the territories of its
predecessor also some new areas created by this high-speed transmission,
especially in multimedia storage. Faraday has been engaged by numerous
customers for product development, including one host controller provider.
Faraday expects this will bring her great opportunity after the application
booming in 2010.

“Just weeks after launching the leading PCIe GII solution, now Faraday has
the USB 3.0PHY, which points to the fact that Faraday do have the most robust
design capabilities in high-speed IO among the peers,” said Steve Wang, Chief
Strategy Officer at Faraday. “As a contributor to the USB Implementers Forum
(USB-IF), Faraday has been dedicated to USB 3.0 development in order to
deliver early products right after the specification’s finalization. We have a
clear roadmap ahead and the achievement is satisfying so far. Following the
0.13um PHY, the 90nm PHY will be available soon, and 55nm and 40nm are under
development as well. Faraday is optimistic in USB 3.0′s prevalence and
confident with our ability to provide the most competitive USB 3.0 solution
and service,” he added.

“We are pleased to see that a USB 3.0 PHY solution has been made available
from Faraday” said Jeff Ravencraft, USB-IF president and chairman. “The market
is ready for SuperSpeed USB technology to meet the increasing demand for
faster transfer speeds. USB 3.0 PHY solutions like Faraday’s will help enable
the industry to bring SuperSpeed USB products to the market.”

To achieve the specification with trade-off between power and die size,
Faraday has carried out some sophisticated improvement in this PHY
architecture, including a new compensation circuits in the equalizer of
receiver to eliminate the channel loss caused by the cable and trace wire in
the board. Some other new architectures also work for clock data recovery and
transmitter to make the eye diagram meet the specification in all conditions.

Event notice

At the upcoming SuperSpeed USB Developers Conference (5/20-5/21, Tokyo,
JP), Faraday will demo the complete USB 3.0 solutions, covering host solution
(USB 3.0-PCIe) on PC, device platforms for SSD development, and USB 3.0-SATA
bridge chip.

About Faraday Technology Corporation

Faraday Technology Corporation is one of the largest fabless ASIC
companies in the Asia-Pacific region, and it also has a significant presence
in other world-wide markets. Headquartered in Taiwan, Faraday has service and
support offices around the world, including the U.S., Japan, Europe, and
China. For more information, please visit: http://www.faraday-tech.com .

    Press contact

     Carol Yang
     Faraday Technology Corporation
     Tel:   +886-3-578-7888 ext 4047
     Email: htyang@faraday-tech.com

SOURCE Faraday Technology Corporation


Source: newswire



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