New Fine Pitch Bump Adapters from Aries Enable Use of Alternate ICs on PCBs Originally Designed for TSSOPs and QFP Packages
This adapter will enable the user to solder a BGA (ball grid array) or other SMT device to pads on the component side of the adapter, which will then connect through the adapter to the 0.5 mm pitch raised connection pads (up to 0.010″) on the bottom. The connection scheme comes standard in a pin 1-to-pin 1 routing, but can easily be customized to accommodate virtually any connection requirement.
The Aries Fine Pitch Bump Adapter boards are fabricated from 0.032″ thick FR4 or Rogers 370 HR, with 1/2 oz. copper traces on both sides. The NSMD (non-solder mask defined) pads are finished with ENIG (electroless nickel immersion gold). The adapters operate at up to 221 degrees F (105 degrees C) for FR4 versions and 226 degrees F (130 degrees C) for the lead-free version.
Fine Pitch Bump Adapters are available in a panelized form for easy pick-and-place assembly of the new device, as an adapter only, or as a complete, turn-key solution with devices mounted. Aries specializes in custom design and production. In addition to standard products, special materials, platings, sizes and configurations can be furnished depending on quantity.
Pricing is dependent on application and quantity, but typically starts at
For additional information, contact Aries Electronics Inc., 2609 Bartram Road,
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SOURCE Aries Electronics