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Aviza Technology Receives Order From Winbond Electronics Corporation

Posted on: Tuesday, 12 July 2005, 09:01 CDT

SCOTTS VALLEY, Calif., July 12 /PRNewswire/ -- Aviza Technology, Inc., a global supplier of production-proven thermal process and atomic layer deposition (ALD) systems, today announced that it received and began shipping a multi-system order from Winbond Electronics Corporation of Hsinchu, Taiwan for Aviza's RVP-300(TM)plus thermal processing systems. A new customer to Aviza, Winbond selected the RVP-300plus system for its process performance, reliability, extendibility and cost of ownership benefits. Winbond's selection of Aviza represented over half of their total thermal process system order.

"We anticipate that the 90-nm DRAM process technology transferred by Infineon Technologies will be utilized for the development of low power SDRAMs, PSRAMs and other related memory products," said Dr. Victor Wang, Fab Director of Winbond Electronics Corporation. "We also believe that the 90-nm DRAM process technology will play a critical role as manufacturing at the 300-mm fab ramps up to mass production. With Aviza's expertise and successful collaboration with Infineon, we found that Aviza offered the leading-edge systems scalable at 90-nm process node and below."

The RVP-300(TM)plus is a production-proven 300-mm, large batch thermal processing system that combines high productivity with a full complement of atmospheric pressure and low pressure chemical vapor deposition (LPCVD) process solutions. Aviza's suite of RVP-300plus tools will be installed at Winbond's new 300-mm fab in Central Taiwan Science Park in Taichung, Taiwan. This 300-mm fab is targeting production of DRAM, mobile RAM and Flash memory at 110-nm node, with extendibility to 90 nm and beyond.

"We are excited to add Winbond to our customer portfolio," said May Su, Vice President and General Manager of Aviza Technology's Thermal Business Unit. "We have seen a mutually successful technology transfer with Infineon at 110-nm node and more recently at 90-nm node. We believe that securing more than half of the order from Winbond for our RVP-300plus tools validates Aviza's technology experience and expertise for providing leading-edge thermal processing systems, and will allow us to continue to gain momentum and increase our share in this critical served market."

About Winbond

Winbond Electronics Corporation was founded in Hsinchu Science-Based Industrial Park, Taiwan in 1987. By positioning itself as a "Mobile Electronics Solution" provider, Winbond owns two business groups-Logic IC Business Group and Memory IC Business Group. Logic IC Business Group focuses on three specific domains: microcontroller-based ICs, PC & peripherals and network access ICs. As to Memory IC Business Group, the products include Specialty DRAM, Pseudo SRAM and Flash.

It has become the largest IDM (Integrated Device Manufacturer) Company in Taiwan semiconductor industry. With more than 4,200 employees worldwide, the Company has subsidiaries located in America, Japan, Hong Kong and China.

Further information is available at: http://www.winbond.com/ . About Aviza Technology, Inc.

Aviza Technology is a supplier of thermal processing, low-pressure chemical vapor deposition and atomic layer deposition solutions to the global semiconductor industry. The company maintains a worldwide installed base of more than 2,500 tools. Aviza's headquarters, manufacturing and R&D facilities are located in Scotts Valley, Calif. Additional sales and customer support facilities are located in Germany, France, Scotland, Taiwan, China, Japan, Singapore and Malaysia. Aviza has 500+ full-time employees and contractors worldwide. Additional information can be found at http://www.avizatechnology.com/.

NOTE: RVP-300plus is a trademark of Aviza Technology, Inc.

Aviza Technology, Inc.

CONTACT: Sherrie Gutierrez of Aviza Technology, +1-831-439-6382, orsherrie.gutierrez@avizatechnology.com

Web site: http://www.avizatechnology.com/

Web site: http://www.winbond.com/


Source: PRNewswire

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