EV Group Secures Order for 300-mm Wafer Bonder From SEMATECH’s 3D Interconnect Program at UAlbany NanoCollege
With the rising demand for smaller, more functional and lower-power chips, 3D architecture is emerging as the clear approach for meeting leading-edge consumer device requirements. As collaboration on TSV/3D intensifies, barriers continue to be broken down thereby speeding industry-wide technology adoption among memory and CMOS manufacturers.
“SEMATECH has been involved in 3D research for several years, and we are committed to building a strong infrastructure to pave the way for volume production of TSVs,” noted
Today, EVG’s fully automated 300-mm GEMINI wafer bonder systems are used for high-volume wafer bonding applications for MEMS, 3D IC integration and advanced packaging, as well as compound semiconductor applications. The system purchased by SEMATECH is based on the flexible, field-proven GEMINI platform and integrates the company’s SmartViewNT series announced in December 2008. Up until now, room-temperature fusion bonding and high-temperature, high-force thermo compression bonding were processed on two separate tools. This next-generation design can combine all of these bonding capabilities into one system for maximum R&D flexibility. Alternatively, it can be configured for a specific process flow to maximize productivity in a manufacturing environment.
Both Lindner and Arkalgud are panelists on the BrightSpots(SM) 3D IC Forum, a unique three-weeklong online discussion on 3D IC developments. The panel is now live and will conclude
About EV Group
EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers’ fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.
In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS. Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via (TSV) process for major ICs and MEMS/sensors. Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions.
Founded in 1980, EVG is headquartered in St. Florian,
For over 20 years, SEMATECH(R) (www.sematech.org) has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners.
The UAlbany CNSE is the first college in the world dedicated to education, research, development, and deployment in the emerging disciplines of nanoscience, nanoengineering, nanobioscience, and nanoeconomics. CNSE’s Albany NanoTech Complex is the most advanced research enterprise of its kind at any university in the world. With over
SOURCE EV Group