Unisem and ASAT Limited Enter Into Cross Licensing Agreement of Key Advanced Leadless Semiconductor Packaging Technologies
HONG KONG, DONGGUAN, China and MILPITAS, Calif., July 20 /PRNewswire-FirstCall/ — ASAT Limited, a subsidiary of ASAT Holdings Limited (OTC Bulletin Board: ASTTY), a global provider of semiconductor package design, assembly and test services, today announced that it has entered into a cross licensing agreement with Unisem (M) Berhad that will allow each company to manufacture and market the other company’s key advanced leadless packaging technologies. The packaging technologies included in this agreement are Unisem’s Etched Leadless Package (ELP), Taped Leadframe Package (TLP) and ASAT’s Thin Array Plastic Package (TAPP) and Thermal Leadless Array (TLA) package.
As the industry continues to push towards complex, yet cost effective semiconductor packaging solutions, the demand for advanced leadless leadframe based packaging continues to grow. Beyond the material cost savings over substrate based packages, design flexibility, increased I/O densities and reduced footprints have made these technologies a perfect match for smaller and thinner applications with less system board space.
“Having these packaging technologies available at both SATS providers will give our customers the added confidence of second source availability,” said C.H. Ang, COO of Unisem Group. “We are excited about the opportunity to expand the availability of our package technologies as well as benefit from these additional technologies developed by ASAT,” continued Ang.
“We believe that our innovative technologies allowing for higher densities in reduced footprint leadframe-based packages are well positioned, given the continued growth in the market for QFN. Our synergy with Unisem has resulted in a cooperative agreement that will help facilitate broader adoption of these technologies in a timely fashion,” said Joe Martin, chief business officer of ASAT Holdings Limited.
About ASAT Limited:
ASAT Limited, a wholly owned subsidiary of ASAT Holdings Limited, is a global provider of semiconductor package design, assembly and test services. With more than 20 years of experience, the Company, through its operating subsidiary in China, ASAT Semiconductor (Dongguan) Limited, offers a definitive selection of semiconductor packages and world-class manufacturing lines. ASAT’s advanced package portfolio includes standard and high thermal performance ball grid arrays, leadless plastic chip carriers, thin array plastic packages, system-in-package and flip chip. ASAT was the first company to develop moisture sensitive level one capability on standard leaded products. Today the Company has operations in the United States, Asia and Europe. For more information, visit www.asat.com.
Unisem is a global provider of semiconductor assembly and test services for many of the world’s most successful electronics companies. Unisem offers an integrated suite of packaging and test services such as wafer bumping, wafer probing, wafer grinding, a wide range of leadframe and substrate IC packaging, wafer level CSP and RF, analog, digital and mixed-signal test services. Our turnkey services include design, assembly, test, failure analysis, and electrical and thermal characterization. Unisem has factory locations in Ipoh, Malaysia; Wales, United Kingdom; Chengdu, People’s Republic of China; Batam, Indonesia and Sunnyvale, USA. The company is headquartered in Kuala Lumpur, Malaysia. For more information about Unisem, please visit www.unisemgroup.com.
This news release contains statements and information that involve risks, uncertainties and assumptions. These statements and information constitute “forward-looking statements” within the meaning of federal securities laws including Section 27A of the United States Securities Act of 1933, as amended, and Section 21E of the United States Securities Exchange Act of 1934, as amended. Such forward-looking statements involve known and unknown risks, uncertainties, assumptions and other factors that could cause the actual performance, financial condition or results of operations of ASAT Holdings Limited to differ materially from those expressed or implied in any forward-looking statement. The forward-looking statements in this release reflect the current beliefs and expectations of the Company as of this date, and the Company undertakes no obligation to update these forward-looking statements to reflect actual results or events or circumstances that occur after the date of this news release.
SOURCE ASAT Holdings Limited