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Semicon Europa: FRT Introduces Ultra High Aspect-Ratio Measurements for Through-Silicon Vias (TSV) in 3D Wafer Packaging

October 5, 2009

BERGISCH GLADBACH, Germany, October 5 /PRNewswire/ — At this year’s
Semicon Europa 2009, FRT again presents innovative wafer metrology solutions
for R&D and process control tasks in MEMS, semiconductor, and photovoltaic
production. A selection of FRT’s products can be viewed and tried for test
measurements in hall 3, booth 101 at Semicon Europa in Dresden from October
6th to 8th 2009
.

One of these year’s highlights is the multisensor metrology tool
MicroProf TTV that precisely determines total wafer thickness variation as
well as bow, warp and flatness according to SEMI standards. Thanks to its
multisensor capability, the tool can be extended with additional sensors
based on reflectometry, interferometry, confocal microscopy and atomic force
microscopy, enabling it to reliably perform complicated inspection tasks such
as through-silicon via measurements (TSV) at ultra high aspect-ratios of up
to 1:100.

FRT’s unique multisensor technology is the ultimate base for wafer
metrology applications in today’s high-tech industries, because it combines
various inspection tasks based on the measurement of film thickness,
roughness, contour and 3D topography into one upgradeable and future-safe
metrology tool.

Henrik Leskinen, Manager Equipment Control of the MEMS manufacturer VTI
Technologies states: “… our FRT system turned out to be the most suitable
choice for monitoring process parameters. Due to its flexible
sensor-integration concept and automation capabilities, we are able to
conduct measurements both on entire wafers with regard to TTV as well as
local high-resolution measurements.”

Whether it is during polishing, lithography or etching of both patterned
and unpatterned wafers of any size, all measurements are highly repeatable
and matchable across multiple inspection tools. To fulfil cleanroom
requirements in the backend and frontend, FRT metrology tools can be
configured as EFEM versions with full automation, robotic wafer handling and
SECS/GEM integration.

    Further Information:
    http://www.wafer-metrology.com (opens PDF in browser)
    http://www.frt-gmbh.com (company website)
    About FRT

For 14 years, Fries Research & Technology GmbH (FRT) has been a trusted
partner for industry-proven surface metrology solutions. FRT tools are used
for the non-destructive investigation of topography, profile, film thickness,
roughness and other properties. More than 300 international companies from
the semiconductor, MEMS, optical, photovoltaic, automotive, medical and other
industries equip their R&D and production with FRT metrology systems. FRT
operates from Germany and maintains subsidiaries in China, Switzerland and
the United States.

    FRT, Fries Research & Technology GmbH
    Phone: +49(0)2204-84-24-30
    E-Mail: info@frt-gmbh.com

SOURCE FRT, Fries Research & Technology GmbH


Source: newswire



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