Carsem Announces Extremely Thin MLP
IPOH, Malaysia, Oct. 22 /PRNewswire/ — Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced that they now offer an extremely thin version of their MLP (Micro Leadframe Package). The current offering, referred to as the X3 package, is a two lead package with nominal dimensions of 0.6 mm long by 0.3 mm wide and 0.3 mm thick, which is very similar in size to a 0201 surface mount component. Carsem is currently in the process of registering the package outline with JEDEC’s (Joint Electron Device Engineering Council) JC-11 Committee for Mechanical (Package Outlines) Standardization.
The package is produced using Carsem’s advanced MLP manufacturing capabilities including saw-singulation, which provides a package with precise square edges to assure easier handling during the printed circuit board manufacturing process. Carsem will begin offering high-volume, full turn-key manufacturing services, including electrical testing, laser mark and tape-and-reel, in early 2010.
Rick Flowers, Carsem’s V.P. of World Wide Sales and Marketing stated, “We developed this package to primarily support the need for an effective solution to the manufacture of transient voltage suppression (TVS) diodes that are used to protect the electronic communication and consumer devices against electrostatic discharges (ESD). We expect the need for this extremely thin version of our MLP to expand to include other package body sizes and lead counts.”
Carsem’s Chief Technology Officer, L.W. Yong stated, “The technology staff that worked on our ‘X3 Package Development Team’ did an outstanding job in meeting the multiple challenges in creating this extremely small MLP package. I am very proud of their efforts and dedication.”
Anyone interested in further details about this new package should contact your local Carsem sales office, which can be found on the Carsem Web site at http://www.carsem.com.
Carsem is a leading provider of turn-key packaging and test services to the semiconductor industry and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem’s portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL) and a SiP (System-in-Package) capability. Carsem also offers a full range of turn-key test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards, having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia; Suzhou, China; and sales offices across the USA, the UK and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: http://www.carsem.com.
Press Contact: Rick Flowers VP of World Wide Sales and Marketing Telephone Number: +60 5 3123333 Fax Number: +60 5 3125333 Email Address: firstname.lastname@example.org
Web site address: http://www.carsem.com
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