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EoPlex Presents Paper Co-Authored With STMicroelectronics at Device Packaging Annual Conference of International Microelectronics and Packaging Society

March 11, 2010

REDWOOD CITY, Calif., March 11 /PRNewswire/ — EoPlex Technologies, the company that produces complex electronic components in a high-speed, low-cost, clean tech process, has co-authored a paper with its customer, STMicroelectronics, the world’s fifth largest semi-conductor company. The paper, entitled “High Performance and Cost Effective Molded Array Package Substrate,” was presented yesterday by EoPlex Vice President, Philip Rogren, for the Annual Device Packaging Conference of IMAPS International Microelectronics and Packaging Society.

“We are pleased that STMicroelectronics has co-authored the important discussions presented in this paper,” said Arthur Chait, CEO of EoPlex. “Their participation in describing the new QFN Multi Row (QFN-MR) packaging family and their interest in EoPlex’s advanced substrate for QFN-MR means a great deal to us. I extend my personal thanks to Pierangelo Magni, Mark Shaw and Maura Mazzola for contributing their perspective.”

This new packaging family combines the manufacturing efficiencies of QFN with greater design flexibility and performance than BGAs and QFPs. In addition, the molded array package (MAP) substrate simplifies assembly flow and enables test in the strip prior to singulation. EoPlex’s unique print forming processes and advanced materials combine to create a MAP substrate that is more cost effective and is also very environmentally friendly in both its manufacture and use.

The disruptive EoPlex platform technology is a clean additive process that uses proprietary deposition techniques and materials to produce ceramic-metal or metal-polymer components, such as cell phone antennas and the micro semiconductor packages described above. The EoPlex process can replace many older processes, such as etching and plating, that require toxic chemicals or processes, and machining that generates fine particle wastes. The EoPlex process also allows new design freedoms and advancements that were not available before – all at very low cost.

About STMicroelectronics

STMicroelectronics is a global leader, serving customers across the spectrum of electronics applications with innovative semiconductor solutions. ST aims to be the undisputed leader in multimedia convergence and power applications leveraging its vast array of technologies, design expertise and combination of intellectual property portfolio, strategic partnerships and manufacturing strength. In 2009, the company’s net revenues were $8.51 billion. Further information on ST can be found at http://www.st.com/.

About EoPlex Technologies, Inc.

EoPlex Technologies, Inc. is the creator of an innovative deposition technique based on custom printing equipment and proprietary “inks” that carry ceramic, metallic or polymer materials to millions of locations. This allows the manufacture of components with integrated chambers, channels, dielectrics, sensors, circuits, reactors, energy scavengers and other features. Many parts are created simultaneously in large panels and at low cost. A further advantage of the process is that it is additive and, as a result, is very environmentally friendly. EoPlex manufactures miniature antennas like those used in cell phones, GPS devices and other portable devices. The company also produces a new semiconductor packaging micro-lead frame that offers better performance and lower cost in many portable devices. EoPlex is a privately held company based in Redwood City, CA and is backed by ATA Ventures, Draper Fisher Jurvetson, Labrador Ventures and Draper-Richards. For more information, visit http://www.eoplex.com.

SOURCE EoPlex Technologies, Inc.


Source: newswire



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