Eric Leonard Joins EoPlex Technologies as Director of Sales & Marketing

April 1, 2010

REDWOOD CITY, Calif., April 1 /PRNewswire/ — EoPlex Technologies, the company that produces complex electronic components in a high-speed, low-cost, clean tech, print forming process, announced today that Eric Leonard as joined the company as Director of Sales and Marketing. Leonard will be responsible for the management and execution of EoPlex sales activities.

“We are pleased to welcome Eric Leonard as an EoPlex team member,” stated Arthur Chait, President and CEO of EoPlex. “Eric has the skills and experience to contribute significantly in promoting our revolutionary print deposition technique to build monolithic miniature structures with multiple materials and high complexity. Our new product lines, including the advanced molded array package substrate, will be well served by his understanding of the semiconductor packaging industry and its markets.”

Leonard has more than 30 years of experience in sales and business development within the semiconductor packaging industry. He has brought new packaging technologies to the marketplace, selling innovative products that reflect the history of packaging from lead frame to laminates, Tab to Flip Chip and packaging solutions for MEMS and High Brightness LED’s. Leonard has marketed back end equipment and materials, managing assembly and test services across the globe. Before joining EoPlex, he introduced silicon packaging as Director of Worldwide Sales at Hymite, Inc. Previously he served Quantum Leap Packaging, ChipPAC, Amkor Technology and Dusan Equipment. Leonard is an active member of IMAPS, MEMS Industry Group, JEDEC and other semiconductor organizations.

About EoPlex Technologies, Inc.

EoPlex Technologies, Inc. is the creator of an innovative deposition technique based on custom printing equipment and proprietary “inks” that carry ceramic, metallic or polymer materials to millions of locations. This allows the manufacture of components with integrated chambers, channels, dielectrics, sensors, circuits, reactors, energy scavengers and other features. Many parts are created simultaneously in large panels and at low cost. A further advantage of the process is that it is additive and, as a result, is very environmentally friendly. EoPlex manufactures miniature antennas like those used in cell phones, GPS devices and other portable devices. The company also produces a new semiconductor packaging micro-lead frame that offers better performance and lower cost in many portable devices. EoPlex is a privately held company based in Redwood City, CA and is backed by ATA Ventures, Draper Fisher Jurvetson, Labrador Ventures and Draper-Richards. For more information, visit http://www.eoplex.com. Media contact, Janice Odell 415.738.2165 or email jan@fordodell.com.

SOURCE EoPlex Technologies, Inc.

Source: newswire

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