October 5, 2010
For Future Chips, Smaller Must Also Be Better
The explosion of portable communication devices that we enjoy today -- such as cell and smart phones, Bluetooth hands-free units, and wireless Internet networks -- has resulted in part from the development of a wide variety of integrated circuits that create, process and receive the microwave frequencies on which the communication is based.
Continuing demand for higher performance over a wider range of frequencies has shrunk the physical size of circuits and fueled the development of new materials in thin-film forms, tested in detail over the entire microwave spectrum (1-50GHz).
"Our recent achievements certainly pave the way for realizing high-frequency microwave applications using thin-film BST capacitors," said Prof. Xianlin Dong from the Shanghai Institute of Ceramics, Chinese Academy of Sciences.
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