Sequans Communications Uses VeriSilicon’s ZSP Core for WiMAX/LTE Products

February 14, 2011

SOPHIA ANTIPOLIS, France, Feb. 14, 2011 /PRNewswire-Asia/ — VeriSilicon Holdings Co., Ltd. (VeriSilicon), a leading world class ASIC design foundry and semiconductor IP provider, today announced that Sequans Communications, a leading 4G chipmaker, will be using the synthesizable Quad-MAC ZSP DSP core for its next generation mobile WiMAX and LTE baseband processors.

Sequans is a global leader in WiMAX chips and expanded in 2009 to the LTE chip market. Sequans selected the Quad-MAC ZSP core in 2005 to power its WiMAX chips and has been in successful volume production of WiMAX chips for several years.

“We are pleased that Sequans, an industry leader in WiMAX and LTE chips, has decided to work more closely with VeriSilicon and leverage our Quad-MAC ZSP core further to better serve the performance and power efficiency demands of Sequans’ products in 4G markets,” said Dr. Wayne Dai, CEO of VeriSilicon. “The Quad-MAC ZSP architecture offers the best balance of performance, power efficiency and cost to meet the needs of the most demanding applications. Ease of use and strong support are the cornerstones of our ZSP cores and we stand behind our customers to ensure their success.”

The challenges presented by 4G demand increasingly high performance and energy efficient solutions. It is also very important to consider product flexibility and scalability when making design decisions.

“Sequans has relied on VeriSilicon’s ZSP’s scalable architecture for several years,” said Bertrand Debray, vice president of engineering, Sequans. “We selected VeriSilicon’s Dual-MAC ZSP cores and later Quad-MAC ZSP cores to power our mobile WiMAX and LTE chips. The ease of use and efficiency of the ZSP cores and the strong support provided by VeriSilicon continue to give us market advantages.”

About VeriSilicon

Founded in 2002, VeriSilicon Holdings Co., Ltd. (“VeriSilicon”) is a fast growing IC (integrated circuit) design foundry providing custom silicon solutions and SoC turnkey services. VeriSilicon has an extensive track record of accelerating customer designs from initial specification to silicon, achieving first silicon success — on time and on spec — and taking customer silicon through volume production, utilizing its partner network of leading wafer foundries and assembly and test companies in Asia Pacific. In addition to its flexible engagement model, superior supply chain management, and strong service culture, VeriSilicon’s market leading licensable digital signal processing (ZSP)cores and Star IP based SoC platforms, along with value-added mixed signal IP portfolio, are the key differentiators for its success in a broad range of application markets, including multimedia, voice and wireless communications. VeriSilicon’s global customer base of market leading multinationals and fabless start-up companies benefit from shorter development cycles, reduced cost of ownership, and economies of scale. VeriSilicon currently has research and development centers in Santa Clara, California, and Dallas, Texas; Shanghai and Beijing, China; with sales and customer support offices in Nice, France; Santa Clara, US; Shanghai, Beijing and Shenzhen, China; Tokyo, Japan; Taipei, Taiwan; and Seoul, Korea.

For more information, please visit www.verisilicon.com

About Sequans Communications

Sequans Communications is a 4G chipmaker, supplying LTE and WiMAX chips to equipment manufacturers and mobile operators worldwide. Founded in 2004 to address the WiMAX opportunity where it is now a global leader, Sequans expanded in early 2009 to address the LTE market. Sequans chips are inside some of the world’s leading WiMAX networks and will soon be inside LTE networks. Sequans is based in Paris, France with additional offices throughout the world, including USA, United Kingdom, Israel, Japan, Hong Kong, Singapore, Taiwan, and China. www.sequans.com.

SOURCE VeriSilicon Holdings Co., Ltd.

Source: newswire

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