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TI introduces industry’s most highly integrated piezo haptic driver

July 20, 2011

DALLAS, July 20, 2011 /PRNewswire/ — Texas Instruments Incorporated (TI) (NYSE: TXN) today introduced the most highly integrated piezo haptic driver for mobile consumer and industrial designs. The DRV8662 features an integrated 105-V boost converter, power diode, and 50-V to 200-V peak-to-peak (Vpp) fully-differential amplifier, resulting in a solution size that is 50 percent smaller than leading competitors. The DRV8662 also lowers total solution cost by 40 percent compared to competing solutions, thanks to an efficient, transformer-less design. With the capability to drive a wide range of piezo actuator voltages and fast start-up time, the DRV8662 benefits designers creating fast, high-definition haptic designs. To order samples and learn more, visit: http://www.ti.com/drv8662-pr.

“Realistic tactile feedback effects considerably enhance the overall user experience of touch-enabled consumer electronics devices,” said Steve Anderson, senior vice president of TI’s High Performance Analog business. “The integration of the DRV8662 haptics driver makes it easy to include effects like localized vibrations and frequency variations in both touch screen-input devices and those without a touch screen, from mobile phones and tablets to computer accessories, home appliances, and industrial automation consoles.”

Key features and benefits

  • Piezo modules enable fast start-up time (1.5 milliseconds), thin form-factor and high bandwidth, resulting in the production of haptic effects not possible with intertial-based actuators.
  • Drives piezo actuator capacitances from 50 to 680 nanofarad (nF) at 300 Hz, enabling a wide variety of high-resolution haptic effects, including feedback localized to specific areas of the device, as well as vibrations and pulses that change in frequency based on how the user is interacting with the device.
  • Transformer-less design and wide supply range of 3.0 to 5.5-V with direct battery connection reduces solution size and cost.
  • Thermal overload protection prevents damage when the device is overdriven.

Availability and pricing

The DRV8662 is available now in a 4-mm x 4-mm x 0.9-mm QFN package, priced at $1.75 in quantities of 1,000.

Tools and support

An evaluation module is available for the DRV8662, priced at $100, and includes a fully-programmable MSP430G2553, as well as analog and digital interfaces for complete standalone and in-system evaluation. Out of the box, the MSP430 is programmed with sample haptic waveforms for immediate evaluation. To view more information, including reference material and sample code, and to place an order, visit http://www.ti.com/drv8662evm-pr.

A simulation model for the DRV8662 is also available in TINA-TI 9.1, a SPICE-based analog simulation program. Download TINA-TI 9.1 at www.ti.com/tina-ti-download-pr.

OMAP compatibility

The DRV8662 can be used with TI’s OMAP(TM) family of processors in touch screen-enabled devices, such as handsets. The processing power of the OMAP devices, coupled with the high-definition haptic effects enabled by the DRV8662, significantly improve the user experience.

Learn more about the DRV8662 and haptic technology by visiting the links below:

About Texas Instruments

Texas Instruments semiconductor innovations help 80,000 customers unlock the possibilities of the world as it could be – smarter, safer, greener, healthier and more fun. Our commitment to building a better future is ingrained in everything we do – from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities. This is just the beginning of our story. Learn more at www.ti.com.

Trademarks

TI E2E Community and OMAP are trademarks of Texas Instruments. All registered trademarks and other trademarks belong to their respective owners.

SOURCE Texas Instruments Incorporated


Source: newswire



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