ASAT Holdings Limited Appoints Ken Sicz Vice President of Worldwide Customer Quality
Posted on: Wednesday, 7 September 2005, 18:00 CDT
HONG KONG and PLEASANTON, Calif., Sept. 7 /PRNewswire-FirstCall/ -- ASAT Holdings Limited and ASAT Inc., global providers of semiconductor package design, assembly and test services, today announced the appointment of Kenneth A. Sicz as vice president of worldwide customer quality. Mr. Sicz will be located in Hong Kong and will report to Robert J. Gange, president and chief executive officer.
(Logo: http://www.newscom.com/cgi-bin/prnh/20030414/ASATLOGO )
Mr. Sicz comes to ASAT with more than 30 years of quality assurance, operations and marketing experience in the semiconductor industry. He most recently worked in director level positions at ChipPAC, a semiconductor test and advanced packaging service provider, where he was in charge of worldwide procurement and quality and reliability assurance.
"Over the span of his career Ken has demonstrated a proven ability to develop and implement successful quality control programs for semiconductor companies," said Mr. Gange. "I am confident Ken's background in the quality assurance and operations areas, combined with his experience in the semiconductor industry, will enable him to make an immediate contribution to ASAT during this important period as we transition our manufacturing from Hong Kong to China."
"ASAT is well known in the semiconductor industry as a leader in advanced packaging technology and industry leading time-to-market results for its customers," said Mr. Sicz. "I look forward to developing new benchmarks for quality that will drive improved manufacturing performance for the company."
Prior to joining ASAT, Mr. Sicz spent seven years with ChipPAC. He has also served in many senior level positions with various companies in the semiconductor industry, including IPEC/Planar, VLSI Technology, and Motorola. Mr. Sicz holds a bachelor's degree in electrical engineering from Arizona State University.
ASAT Holdings Limited
ASAT Holdings Limited is a global provider of semiconductor package design, assembly and test services. With over 17 years of experience, the Company offers a definitive selection of semiconductor packages and world- class manufacturing lines. ASAT's advanced package portfolio includes standard and high thermal performance ball grid arrays, leadless plastic chip carriers, thin array plastic packages, system-in-package and flip chip. ASAT was the first company to develop moisture sensitive level one capability on standard leaded products. Today the Company has operations in the United States, Asia and Europe. ASAT, Inc. is a wholly owned subsidiary of ASAT Holdings Limited and the exclusive representative of ASAT for services in North America. For more information visit http://www.asat.com/.
For further information, please contact: Ed Varga ASAT Holdings Ltd. 925.398.0400 ed_varga@asat.com Jim Fanucchi Summit IR Group Inc. 408.404.5400 ir@asat.com
Photo: NewsCom: http://www.newscom.com/cgi-bin/prnh/20030414/ASATLOGOAP Archive: http://photoarchive.ap.org/PRN Photo Desk, photodesk@prnewswire.com
ASAT Holdings Ltd.
CONTACT: Ed Varga of ASAT Holdings Ltd., +1-925-398-0400 ored_varga@asat.com; or Jim Fanucchi of Summit IR Group Inc., +1-408-404-5400 orir@asat.com, for ASAT Holdings Ltd.
Web site: http://www.asat.com/
Source: PRNewswire-FirstCall
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