I/O, I/O, How Much Faster Can We Go: Chip-to-Chip Interconnects
Posted on: Thursday, 6 October 2005, 09:00 CDT
Research and Markets (http://www.researchandmarkets.com/reports/c25287) has announced the addition of I/O, I/O, How Much Faster Can We Go: Chip-to-Chip Interconnects to their offering
Chip-to-chip interconnections will not get the attention that central processing units or memory systems will, in regard to extending performance in processor systems. Nonetheless, at all points in a system, the overall performance of the process is affected by its weakest elements. As processor capacity continued to grow and memory caches grew as well, the possibility of bottlenecks increased. In many cases the bottlenecks were caused by the system architecture within the interface.
Several factors contributed to the development of standard interconnections. Market conditions helped to define a spirit of cooperation. Standard interconnection is a platform for individual companies to build upon. By utilizing a common interconnection, companies can devote more resources toward building differentiators at the edge of an application. An added benefit to working with common industry interconnections is that interoperability with common components is assured -- an advantage when working with OEMs.
This report identifies three emerging chip-to-chip interconnections: HyperTransport, PCI Express, and RapidIO. The origins and evolution of each interconnection is reviewed. Technical barriers and interconnection roadmaps are included and lastly, forecasts are made about the proliferation of interconnection technologies within selected market applications.
Contents Include:
Executive Summary
Introduction
Methodology
Technology Overview
HyperTransport
PCI and PCI-X
PCI Express
RapidIO
Comparisons of Interconnect Technologies
Brief Notations About Proprietary Interconnects
Case Studies
HyperTransport
PCI Express
RapidIO
Product Overview
HyperTransport
PCI Express
RapidIO
Interfaces By Application
Computing
Networking
Telecommuting
Consumer Electronics
Further Into the Ecosystem
Report Summary
List of Tables
List of Figures
For more information visit http://www.researchandmarkets.com/reports/c25287
Source: Business Wire
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