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NEC Electronics Corporation Licenses USB On-The-Go Technology From TransDimension for Next Generation Mobile Phone Applications

Posted on: Tuesday, 10 February 2004, 06:00 CST

Agreement Marks TransDimension's Entry

Into the Japanese Cellular Phone Market

¶ TransDimension, a leading provider of USB connectivity solutions for embedded applications, today announced that NEC Electronics Corporation (TSE), a leader in Large Scale Integration (LSI), has licensed its USB On-The-Go (OTG) technology to integrate into their next generation LSI chip for third generation (3G) mobile phones. The announcement with NEC Electronics marks TransDimension's entry into the Japanese cellular phone market. ¶ Through TransDimension's USB OTG technology, NEC Electronics will leverage the readily available USB standard to obtain direct connectivity for its 3G phones with other mobile devices and computer peripherals. USB OTG will greatly enhance the connectivity feature set of 3G phones by providing access to other smart devices, like digital cameras, PDA's and computer peripherals to exchange data without the aid of a PC. ¶"The next-generation of mobile phones will be required to offer a rich multimedia experience to the end-user. A necessary part of that experience will be the ability to share data with other users through direct connectivity to other smart devices," said Rick Goerner, TransDimension president and CEO. "NEC will leverage our USB OTG technology to quickly and cost effectively introduce a proven, high performance USB solution into their LSI chip."¶ Having previously announced design wins with Qualcomm and Motorola, TransDimension's partnership with NEC Electronics is further validation that interconnectivity between smart mobile devices is a priority for major cellular phone manufacturers and TransDimension's USB OTG technology is experiencing rapid market adoption. ¶"This announcement with NEC Electronics is a milestone for TransDimension as it is our first licensing agreement in the Japanese cellular phone market. We now have major design wins with some of the biggest players in the cellular phone industry which validates USB as a solution for direct connectivity between mobile devices," added Goerner. "This announcement is a direct result of our ongoing commitment to offer the industry's most complete OTG solution, consisting of our USB OTG controllers, and our USBLink software and class drivers."¶ TransDimension recently entered into a collaborative partnership with ARM, Ltd. whereby TransDimension's technology has been validated with ARM-based systems and is now marketed to ARM(R) Partners, such as NEC Electronics, who can therefore rely on the technology to integrate seamlessly with their SoC design. TransDimension will continue to leverage the partnership with ARM to develop further relationships with manufacturers of mobile devices.

¶ About TransDimension

¶ Headquartered in Irvine, California, TransDimension is a privately held company founded in 1997 to develop and market solutions targeting peripheral connectivity. TransDimension's product lines include the integrated circuits, IP cores and USB software stacks that enable direct connectivity and I/O for a wide range of applications and mobile devices. Until now, these products have required an indirect means, such as a PC host, for exchanging data. SoftConnex, an independent subsidiary of TransDimension, delivers a complete software solution for USB, including the broadest OS and CPU platform support and the largest library of peripheral class drivers available. More information about TransDimension and SoftConnex can be found at http://www.transdimension.com and http://www.softconnex.com.

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