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Amkor Joins IBM, Chartered and Samsung to Broaden Common Platform Technology Offerings With Package and Test Solutions for Advanced Silicon Processes

Posted on: Monday, 25 September 2006, 09:01 CDT

Amkor Technology, Inc. (Nasdaq: AMKR) today announced that it is

collaborating with IBM, Chartered Semiconductor Manufacturing and

Samsung Electronics Co., Ltd. in qualifying 90-nanometer (nm) and 65nm

flip-chip packaging and design capabilities for Common Platform

technology. Amkor has already qualified several die and package

combinations at both 90nm and 65nm with several new 65nm qualifications

in process for the Common Platform partners. Additionally, Amkor has

started 45nm qualifications for next-generation semiconductor

applications.

Common Platform technology is a collaborative effort by IBM, Chartered,

and Samsung to create an open and flexible design and manufacturing

environment at leading-edge semiconductor technologies down to 45nm and

beyond. With this newest collaboration for optimizing silicon/package

interaction for Common Platform technology, customers can now leverage

this cross-foundry manufacturing approach to achieve even more complete

market solutions.

"It's a simple

equation. Successful commercialization of next generation semiconductor

technology requires not only advanced silicon, but also the combination

of appropriate assembly and test technologies and proven manufacturing

scale," said Mike Barrow, Amkor's senior vice

president, flip chip business unit. "Changing

from individual efforts to joint collaboration with Common Platform

partners provides Amkor with early access to advanced silicon, enhancing

our ability to develop assembly and test collateral for next-generation

applications."

"Extending the Common Platform technology

ecosystem to include collaboration on advanced wafer bump and flip chip

processes is a natural step in our evolution to provide clients complete

solutions," said Kevin Meyer, vice president

of worldwide marketing and platform alliances at Chartered. "Amkor's

commitment to Common Platform-based technology for partnering on

optimized solutions involving manufacturing, packaging and test benefits

the entire user community. Additionally, Amkor's

commitment to Singapore as a base for Common Platform technology

packaging and test services will greatly reduce our customers'

time to market."

"Today's

announcement underscores the importance that we attach to incorporating

advanced assembly and test technology into the Common Platform

technology ecosystem," said Ana Hunter, vice

president of technology for Samsung Semiconductor, Inc. "We

are proud to welcome Amkor as a member of the Common Platform ecosystem,

noting that in having already qualified the 65nm process for wafer bump

and flip chip assembly, Amkor can provide market-ready solutions for

customers. As part of our ongoing collaboration, Amkor and Samsung are

also working on lead-free bump and assembly solutions, and we look

forward to continuing these efforts as they advance to the 45nm process

node."

"Our collaboration with Amkor began in 2004

and continues to provide both IBM and its partners with significant

value. Amkor has demonstrated a proven track record in delivering 90nm

Common Platform technology solutions, most recently addressing the needs

of next generation gaming applications with turnkey flip chip packaging"

said Steve Longoria, vice president, Semiconductor Technology Platform

for IBM Technology Collaboration Solutions. "The

addition of Amkor as a Common Platform technology ecosystem solutions

provider enhances our client offerings with the necessary packaging

roadmaps, assembly, and test technologies expected by leading edge

technology adopters."

"In the past twelve months, Amkor has

delivered over 10 million flip chip packages containing 90nm Common

Platform silicon from multiple foundries for the gaming market. This

proven track record for turnkey package execution has shown Amkor's

ability to deliver Customer Ready Technologies to the Common Platform

ecosystem," said Amkor's

Mike Barrow. "Now we can work more

collaboratively with all joint development partners to address

increasingly difficult chip-to-package interactions on advanced silicon

nodes before customer products are even finalized."

About Amkor

Amkor Technology, Inc. (Nasdaq: AMKR) is a leading provider of advanced

semiconductor assembly and test services. The company offers

semiconductor companies and electronics OEMs a complete set of

microelectronic design and manufacturing services. More information on

Amkor is available from the company's SEC

filings and on Amkor's web site: www.amkor.com.

About the Common Platform Technology Collaboration

IBM, Chartered and Samsung have broken new ground in the semiconductor

industry with a unique collaboration focused on leading-edge, jointly

developed digital CMOS process technologies and advanced manufacturing.

The Common Platform model is further supported by a comprehensive

ecosystem of design enablement and implementation partners from the EDA,

IP, and design services industries. This ecosystem allows foundry

customers to easily source their chip designs to multiple 300mm

foundries with unprecedented flexibility and choice. Common Platform

technology features 90nm, 65nm, and 45nm process technologies developed

as part of a collaboration between IBM, Chartered, Samsung and Infineon.

Forward Looking Statements

This press release contains forward looking statements within the

meaning of the Private Securities Litigation Reform Act of 1995 that

involve risks and uncertainties, including but not limited to statements

regarding supporting Common Platform members with package and test

solutions; qualifications on 90nm, 65nm and 45nm silicon; collaboration

with joint development partners; gaining access to next generation

silicon; developing assembly and test collateral; providing market-ready

solutions for customers; expansion of wafer bump, probe and test

services; and collaboration on lead-free bump and assembly solutions.

These statements are subject to a number of risks and uncertainties that

could cause actual results to differ from our expectations, including,

but not limited to: consumer demand for products incorporating packages

based on Common Platform technologies; our relationships with IBM,

Chartered and Samsung; and our ability to successfully qualify packages

on 45nm silicon, work with joint development partners on Common Platform

technology, and implement market-ready and lead-free bump and assembly

solutions.

Further information on risk factors that could affect the outcome of the

events set forth in these statements and that could affect the company's

operating results and financial condition is detailed in Amkor's

filings with the Securities and Exchange Commission, including the

Report on Form 10-K for the year ended December 31, 2005 and Form 10-Q

for the quarter ended March 31, 2006.

Source: Business Wire

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