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Texas Instruments "LoCosto" RF and Baseband Single Chip Solution Recognized As Most Innovative Baseband and/or Applications Processor

Posted on: Monday, 6 November 2006, 09:00 CST

Semiconductor Insights (SI), the leader in technical and patent analyses of integrated circuits and electronic systems, today announced that it has awarded Texas Instruments "LoCosto" Single-Chip Platform the 2006 INSIGHT Award for Most Innovative Baseband and/or Applications Processor.

"Texas Instruments designed a significant product for mobile applications by integrating both RF and baseband functionality together on a single chip," said Michael Keller, SI's Technology Manager for Wireless. "The dual functionality can potentially reduce the three biggest challenges in mobile systems - space, power, and cost, all of which relate to the number of components needed to perform the necessary functions on a handset."

With an integrated solution there are, obviously, fewer components required. Not only does an integrated solution reduce the number of chips, it also eliminates trace leads allowing for considerably smaller PCBs. As there are fewer components, they do not have to be independently powered, lowering power consumption. And finally, fewer components means less to purchase. Even if you increase the price for one component slightly, but eliminate another altogether, the OEM will be coming out ahead. Industry members estimate component count and PCB space will be reduced by as much as 50%, while over all BOM will decrease by 25% or more.

"We are pleased with Semiconductor Insights' recognition of Texas Instruments "LoCosto" single chip solution, which is ramping in volume today with more than 15 customers worldwide. The integrated features that the "LoCosto" solution offers to mobile applications in a single chip, combined with TI's innovative DRP technology, will enable smaller, cheaper, and lower power systems in the market," said Remi El-Ouazzane, Director of TI's 2.5G business for its Wireless Terminals Business Unit.

While there are competing solutions, SI's recent analysis of Texas Instruments' "LoCosto" single chip solution revealed the functionality is provided using TI's proven 90nm process lithography. This relates to a die size that is considerably small, a key necessity for mobile applications. The die size of the LoCosto solution measures about 25% smaller than that of the Infineon E-Goldradio, which was designed using a 130nm process. The die size savings will allow TI to produce more die per wafer for a sustainable competitive position.

"LoCosto" is a family of scalable single-chip solutions, which will range in capability from supporting only GSM voice to a device that supports a robust set of features for the higher end of the emerging market, like audio encoding standards like MP3 and AAC; Bluetooth; megapixel camera; calendaring; and more. This allows customers flexibility to address growing GSM-based regions like China, India, Brazil and Africa, and feature phone markets such as Europe, Asia and U.S.

Additional Information:

- About Texas Instruments "LoCosto" RF and Baseband Single Chip Solution

http://www.semiconductor.com/resources/reports_database/view_device.asp?sinumber=15586

- About the INSIGHT Awards

http://www.semiconductor.com/insightawards/index.asp

- About Semiconductor Insights

http://www.semiconductor.com/about_si/index.asp

About Semiconductor Insights

Semiconductor Insights (SI) is the leading technical advisor to the world's microelectronics community. SI supports its clients in asserting their intellectual property (IP) rights and developing and commercializing new technologies and products, through in-depth technical investigation of integrated circuits and electronic systems. Typical clients are major electronics and semiconductor corporations in Japan, Korea, Taiwan, Europe, and North America and their representing law firms. SI has participated in virtually every major semiconductor licensing campaign since the company's inception in 1989 and clients include such hallmarks as Infineon, Intel, TSMC, and Texas Instruments.

 Contacts: Semiconductor Insights Jill Perry 613-599-6500 jillP@semiconductor.com

SOURCE: Semiconductor Insights Inc.

Source: MARKET WIRE

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