Latest 3D chips Stories

Following nearly a decade of work, IBM finally produced a next-generation 3D chip for personal computers. With this work behind them, they must now focus on a way to keep these chips, in which circuits are stacked on top of one another, cool. These 3D chips, which are layered vertically, enhance PC performance by reducing the distance data must travel. The chips also, however, run significantly hotter than normal side-by-side chips. As the size of chips shrinks exponentially, heat becomes a...