3D Chip Packaging Expected to be a Major Inflection Point for the Semiconductor Industry, Allowing Smaller Packages, Lower Power Consumption and Higher Data BandwidthSingapore,

Singapore, May 25, 2011 - (ACN Newswire) - The Institute of Microelectronics (IME), an institute of the Agency for Science, Technology and Research (A*STAR) have announced today their cooperation with TowerJazz, the global specialty foundry leader, on breakthrough projects in micro-electro-mechanical systems (MEMS), packaging and application-specific integrated circuits (ASICs).IME seeks to advance research and development (R&D) in microelectronics in the area of MEMS, packaging and IC design.

HSINCHU, Taiwan, R.O.C., May 17, 2011 /PRNewswire/ -- TSMC (TWSE: 2330, NYSE: TSM) today announced the winner of the TSMC Europractice Innovation award for the most innovative mixed signal or RF (Radio Frequency) design submitted by a European university through the Europractice IC service coordinated by imec.

Joint facility will develop new tools and integration schemes for growing wafer-level packaging marketSingapore, Apr 13, 2011 - (ACN Newswire) - Applied Materials, Inc., the global leader in providing manufacturing solutions for the semiconductor, flat panel display and solar photovoltaic industries, today signed an agreement with the Institute of Microelectronics (IME), a world-renowned research institute under the Agency for Science, Technology and Research (A*STAR), to set up a Center of Excellence in Advanced Packaging in Singapore.

PARIS, September 29, 2010 /PRNewswire/ -- Set up in December 2001 as a spin-off of IMEC, Photovoltech has the backing of its shareholders TOTAL and GDF SUEZ.