SANTA CLARA, Calif., May 22, 2012 /PRNewswire/ -- Three companies, Thermal Engineering Associates (TEA), Package Science Services (PSS), and Microsanj,

LONDON, March 7, 2012 /PRNewswire/ -- - Stand N250 at Ecobuild 2012 BASF, one of the leading providers of products, systems and solutions for sustainable construction,

Research by UT Dallas engineers could lead to more-efficient cooling of electronics, producing quieter and longer-lasting computers, and cellphones and other devices.

A team of U.S. and Chinese researchers are claiming that they have developed a new type of graphene that could prevent laptops and other electronic devices from overheating.

Size matters… but apparently so does shape – when it comes to conducting heat in very small spaces.