DALLAS, May 23, 2012 /PRNewswire/ -- Texas Instruments Incorporated (NASDAQ: TXN) (TI) today announced it has shipped nearly 6.5 billion units of copper wire bonding technology in its analog,

SAN DIEGO, Dec.15, 2011 /PRNewswire/ -- Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly, announced today they fully support copper wire

SEOUL, South Korea and CUPERTINO, Calif., Dec.

SEOUL, South Korea, April 4, 2011 /PRNewswire/ -- MagnaChip Semiconductor Corporation ("MagnaChip Semiconductor") (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, today announced that it now offers cost competitive and state of the art copper wire bonding technology for the specialized needs of foundry customers.

University of Illinois engineers have developed a novel direct-writing method for manufacturing metal interconnects that could shrink integrated circuits and expand microelectronics.