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2011-01-19 12:53:00

SAN DIEGO, Jan. 19, 2011 /PRNewswire/ -- AEM, Inc. announces a hirel-qualified Sn/Pb (tin/lead) conversion process designed to mitigate the formation of tin whiskers in surface-mount components. The AEM process eliminates potential damage to sensitive electronic devices caused by conventional hot-solder dipping while ensuring that converted component terminations contain a minimum of 5% Pb as verified by SEM/EDS and XRF inspection methods. AEM's Sn/Pb conversion process is best suited...


Word of the Day
endocarp
  • The hard inner (usually woody) layer of the pericarp of some fruits (as peaches or plums or cherries or olives) that contains the seed.
This word comes from the Greek 'endon,' in, within, plus the Greek 'kardia,' heart.
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