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Latest Amkor Technology Stories

2014-06-10 16:30:07

DUBLIN, June 10, 2014 /PRNewswire/ -- Research and Markets (http://www.researchandmarkets.com/research/pg7cp6/system_in_package) has announced the addition of the "System in Package (SIP) Market by Technology, Type, Interconnection Technology, Applications and Geography - Global Trends & Forecasts to - 2014 - 2020" report to their offering. http://photos.prnewswire.com/prnh/20130307/600769 The semiconductor packaging industry in the past decade has seen the emergence of System in...

2014-05-30 23:06:44

GIA announces the release of a trend report on 3D Packaging. Market for 3D Packaging is projected to witness strong growth driven by the growing trend towards miniaturization of electronic devices, and strong emphasis on product performance, power efficiency, and cost reduction. San Jose, California (PRWEB) May 30, 2014 Follow us on LinkedIn - 3D packaging technology is an advanced approach used to vertically stack semiconductor components such as diodes, ICs and MOSFETs for reducing the...

2014-04-30 16:34:44

DUBLIN, April 30, 2014 /PRNewswire/ -- Research and Markets (http://www.researchandmarkets.com/research/fhhfv8/the) have announced the addition of the "The Multi-Component IC Packaging Market 2014 Edition" [http://www.researchandmarkets.com/research/fhhfv8/the ] report to their offering. (Logo: http://photos.prnewswire.com/prnh/20130307/600769 ) Complex multi-component packages have added a new dimension to high speed and small form factor, and have been game...

2014-04-23 23:02:58

Manufacturing companies are now implementing Coherix Tru3D™ vision technology in their assembly process to visualize in seconds if a critical part is missing or not correctly fitted. Ann Arbor, MI (PRWEB) April 23, 2014 Forward-thinking manufacturers are now raising the bar in quality and safety by implementing Coherix Tru3D™ technology. These manufacturers have moved from a single prove out implementation to multiple implementations of the Coherix technology in their assembly...

2014-03-13 08:32:33

DUBLIN, Mar. 13, 2014 /PRNewswire/ --Research and Markets (http://www.researchandmarkets.com/research/wpjl8r/global) has announced the addition of the "Concise Analysis of the International Semiconductor Assembly and Test Services Market - Forecasts to 2016" report to their offering. (Logo: http://photos.prnewswire.com/prnh/20130307/600769) One of the main trends witnessed in the Global Semiconductor Assembly and Test Services market is the increase in production capacity. As a result...

2014-01-23 23:20:29

GIA announces the release of a trend report on Flip-Chip. Market for Flip-Chip is projected to witness strong growth driven by growing demand for high speed, and high performance IC packaging solutions. San Jose, California (PRWEB) January 23, 2014 Follow us on LinkedIn – Flip-chip is one of the key packaging techniques for microelectronic circuits. The technique is finding rapid adoption in consumer and high-end applications. The adoption of flip-chip technique is primarily fueled by...

2014-01-07 23:03:54

GIA announces the release of a trend report on Outsourced Semiconductor Assembly and Test (OSAT). Market for OSAT is projected to witness strong growth led by rising adoption of packaging and assembly technologies in electronic and portable devices, and rapid growth in demand in Southeast Asia. San Jose, California (PRWEB) January 07, 2014 Follow us on LinkedIn – Semiconductor assembly involves a process of electrically and mechanically connecting a completely-processed circuit...


Word of the Day
tesla
  • The unit of magnetic flux density in the International System of Units, equal to the magnitude of the magnetic field vector necessary to produce a force of one newton on a charge of one coulomb moving perpendicular to the direction of the magnetic field vector with a velocity of one meter per second. It is equivalent to one weber per square meter.
This word is named for Nikola Tesla, the inventor, engineer, and futurist.