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Latest Application-specific integrated circuit Stories

2014-05-20 12:37:59

Improves Power Efficiency, Reduces Systems Costs IRVINE, Calif., May 20, 2014 /PRNewswire/ -- Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced that it has enhanced its portfolio of photocouplers with the addition of a smart gate driver photocoupler. Housed in a thin SO16L package, the new TLP5214 is suited to driving medium-power IGBTs and power MOSFETs. Used to...

2014-05-15 12:42:02

Cadence Digital Implementation, Signoff and Custom/Analog Tools Also Qualified on 28nm FD-SOI Process SAN JOSE, Calif., May 15, 2014 /PRNewswire/ -- Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced the immediate availability of two intellectual property (IP) solutions for third-party designs on the 28nm FD-SOI process node that is accessible via the recently announced agreement between STMicroelectronics and Samsung Electronics. On this...

2014-05-13 08:38:26

Virtex UltraScale Delivers Quality High-End Devices a Generation Ahead of its Competition SAN JOSE, Calif., May 13, 2014 /PRNewswire/ -- Xilinx, Inc. (NASDAQ: XLNX) today announced the first customer shipment of the Virtex® UltraScale(TM) VU095 All Programmable FPGA, and the expansion of the industry's only 20nm high-end family to enable single chip implementation of 400G and 500G applications. The Virtex UltraScale VU095 device provides unprecedented levels of performance, system...

2014-05-07 12:34:51

CAMBRIDGE, MA, May 7, 2014 /CNW/ - Fidus Systems, Inc., a leader in electronic product development and consulting services, is thrilled to announce the opening of its Boston design center. With the addition of Boston, Fidus proudly offers customers four design center locations across North America; including, Ottawa, Kitchener-Waterloo, and San Jose. "As a high-tech entrepreneur and an MIT graduate, I'm excited to expand into the Boston area," says Michael Wakim, Fidus, President and...

2014-05-04 23:02:06

Triad’s rASIC™ technology reduces mixed signal ASIC development times by one full year. It is like giving a design team an engineering time machine to get to a wearable tech future a year ahead of the competition. Winston-Salem, N.C. (PRWEB) May 04, 2014 Triad Semiconductor announces rASIC™ solutions for rapid wearable technology IC development. An rASIC is a reconfigurable full custom mixed signal ASIC that radically reduces development times by one full year. Wearable tech...

2014-05-02 08:28:50

AUSTIN, Texas, May 2, 2014 /PRNewswire/ -- Tekmos, Inc., a leader in legacy device replacements to extend product life of microcontrollers, ASICs, Standard Products and FPGAs, has introduced the TK68HC811E2, with an operating temperature rating up to 175 degrees C. Tekmos president, Lynn Reed, says "this high temperature microprocessor is our first of a series of hot chips" and will be featured at the upcoming International Conference and Exhibition on High Temperature Electronics...

2014-05-01 08:45:25

Achieves Higher Operating Frequencies and Smaller Area MOUNTAIN VIEW, Calif., May 1, 2014 /PRNewswire/ -- Highlights: -- Design Compiler Graphical delivers 10 percent faster timing and tight correlation to IC Compiler -- Mellanox widely deploys Design Compiler Graphical to achieve challenging design goals within schedule Synopsys, Inc. (Nasdaq: SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems,...

2014-04-28 12:35:56

inrevium/Fidus partnership extends customer access to Xilinx-based products and high-speed electronic design services SAN JOSE, CA, April 28, 2014 /PRNewswire/ - inrevium AMERICA, Inc. a Tokyo Electron Device (TED) company, and Fidus Systems, Inc., are pleased to announce a partnership that will enhance the ability of both companies to serve an ever growing global customer base. inrevium and Fidus are both proud to be Xilinx Alliance Program Premier Design Services Members....

2014-04-23 08:39:14

14 nm FPGA Test Chips Confirm the Performance, Power and Density Advantage Altera Receives Using Industry's Most Advanced Process Technology SAN JOSE, Calif., April 23, 2014 /PRNewswire/ -- Altera Corporation (NASDAQ: ALTR) today announced the demonstration of its FPGA technology based on Intel's 14 nm Tri-Gate process. The 14 nm-based FPGA test chips incorporate key intellectual property (IP) components - transceivers, mixed-signal IP and digital logic - used in Stratix® 10 FPGAs and SoCs....

2014-04-21 08:28:26

New Open-Silicon HMC Controller IP for Xilinx Virtex-7 FPGAs enables system developers to utilize high memory bandwidth and decrease time to market SAN JOSE, Calif., April 21, 2014 /PRNewswire/ -- Xilinx, Inc. (NASDAQ: XLNX) and Open-Silicon, Inc., both founding developer members of the Hybrid Memory Cube Consortium (HMCC), today announced Hybrid Memory Cube (HMC) controller IP for Xilinx Virtex®-7 FPGAs. The high-performance nature of Virtex-7 FPGAs enables system developers to...


Word of the Day
cruet
  • A vial or small glass bottle, especially one for holding vinegar, oil, etc.; a caster for liquids.
This word is Middle English in origin, and ultimately comes from the Old French, diminutive of 'crue,' flask.
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