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Latest Ball grid array Stories

2010-01-05 08:30:00

HONG KONG, DONGGUAN, China and MILPITAS, Calif., Jan. 5 /PRNewswire-FirstCall/ -- ASAT Holdings Limited (Pink Sheets: ASTTY) (the "Company"), a global provider of semiconductor package design, assembly and test services, announces that Simon Bell, Peter Hopper and Kei W. Chua, appointees of funds managed by J.P. Morgan Partners Asia LDC (the "JPMP Funds") to the Board of Directors of the Company, have resigned as Directors effective as of December 30, 2009. These former Directors have...

2009-10-22 06:40:00

IPOH, Malaysia, Oct. 22 /PRNewswire/ -- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced that they now offer an extremely thin version of their MLP (Micro Leadframe Package). The current offering, referred to as the X3 package, is a two lead package with nominal dimensions of 0.6 mm long by 0.3 mm wide and 0.3 mm thick, which is very similar in size to a 0201 surface mount component. Carsem is currently in the process of...

2009-06-17 11:06:00

BRISTOL, Pa., June 17 /PRNewswire/ -- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, announced that Duerfeldt Engineering Inc. (DEI) has joined Aries' representative network, covering the entire Pacific Northwest, including Oregon, Washington, Idaho and Montana. As an engineering-oriented manufacturer's representative firm, DEI is uniquely qualified to assist its customers in selecting the appropriate components offered by DEI...

2009-06-03 13:31:00

BRISTOL, Pa., June 3 /PRNewswire/ -- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has launched a new series of adapters that enable the use of virtually any SMT (surface mount technology) IC (integrated circuit) device on a pitch of 0.4 mm or higher to PC boards on 0.5 mm pitch. These are ideally suited to adapting an IC device to some of the more popular TSSOPs (thin-shrink small outline packages) and QFPs (quad flat packages)...

2009-01-07 15:04:00

BRISTOL, Pa., Jan. 7 /PRNewswire/ -- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, today announced its new patented CSP/BallNest Hybrid Socket suitable for prototyping, test or burn-in of CSP (chip scale package), BGA (ball grid array), microBGA and LGA (land grid array) devices. The socket, which features a lid that nests each ball termination into the socket for a reliable connection, can be used on any device with a 0.30 mm...

2008-12-18 08:18:00

LEHIGH VALLEY, Pa., Dec. 18 /PRNewswire-FirstCall/ -- Air Products (NYSE: APD) has signed two contracts with Nokia to supply nitrogen to its Beijing and Dongguan plants in China for use in the company's electronics assembly and packaging process. Nokia has recently converted its printed circuit board assembly to a lead-free solder process, and nitrogen is needed in reflow soldering, a widely used method in surface mount technology (SMT) for packaging components on electronics printed...

2008-07-02 09:00:16

XJTAG (www.xjtag.com), a leading supplier of IEEE Std. 1149.x JTAG-compliant boundary scan development systems, has appointed Cadence(R) Channel Partner, Parallel Systems (www.parallel-systems.co.uk), as a distributor to sell its developer-friendly XJTAG system into the Electronic Design Automation (EDA) channel in the UK and Ireland. Parallel Systems will be selling the XJTAG system into its established base of printed circuit board (PCB) system houses and silicon developers,...