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Latest Ball grid array Stories

2011-02-08 14:00:00

BRISTOL, Pa. Feb. 8, 2011 /PRNewswire/ -- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, now offers a line of adapters which convert TSSOP, QFP and other fine pitch devices to any other fine-pitch bumped package or routing configuration down to 0.4mm pitch. (Photo: http://photos.prnewswire.com/prnh/20110208/PH44366 ) These unique Fine Pitch Bump Adapters are mounted to the existing PCB via raised pads up to 0.010" (0.25...

2011-01-07 10:17:00

BRISTOL, Pa., Jan. 7, 2011 /PRNewswire/ -- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, now offers machined high-frequency center probe test sockets to accommodate IC devices with a lead pitch of 0.30 mm. With very low inductance and capacitance, the sockets are ideal for a wide variety of BGA (ball grid array), CSP (chip scale package) and MLF (micro land frame) packages. (Photo:...

2010-08-03 13:39:00

BRISTOL, Pa., Aug. 3 /PRNewswire/ -- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has expanded its line of Fine Pitch Bump Adapters to include adapters that accommodate boards with pitches down to 0.40 mm. As part of the Correct-A-Chip series, the new Fine Pitch Bump Adapters allow customers to use higher pitch devices on smaller pitch boards. (Photo: http://photos.prnewswire.com/prnh/20100803/PH45050 ) (Photo:...

2010-02-05 11:30:00

BRISTOL, Pa., Feb. 5 /PRNewswire/ -- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, recently added new BGA Switch-A-Pitch Adapters that allow for smaller pitch devices to be used with larger pitch boards. The new adapters in the series adapt 0.40 mm devices to boards with a 1.00 mm pitch. (Photo: http://www.newscom.com/cgi-bin/prnh/20100205/PH50440 ) Aries' BGA Switch-A-Pitch Adapters, part of the extensive line of...

2010-01-05 08:30:00

HONG KONG, DONGGUAN, China and MILPITAS, Calif., Jan. 5 /PRNewswire-FirstCall/ -- ASAT Holdings Limited (Pink Sheets: ASTTY) (the "Company"), a global provider of semiconductor package design, assembly and test services, announces that Simon Bell, Peter Hopper and Kei W. Chua, appointees of funds managed by J.P. Morgan Partners Asia LDC (the "JPMP Funds") to the Board of Directors of the Company, have resigned as Directors effective as of December 30, 2009. These former Directors have...

2009-10-22 06:40:00

IPOH, Malaysia, Oct. 22 /PRNewswire/ -- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced that they now offer an extremely thin version of their MLP (Micro Leadframe Package). The current offering, referred to as the X3 package, is a two lead package with nominal dimensions of 0.6 mm long by 0.3 mm wide and 0.3 mm thick, which is very similar in size to a 0201 surface mount component. Carsem is currently in the process of...

2009-06-17 11:06:00

BRISTOL, Pa., June 17 /PRNewswire/ -- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, announced that Duerfeldt Engineering Inc. (DEI) has joined Aries' representative network, covering the entire Pacific Northwest, including Oregon, Washington, Idaho and Montana. As an engineering-oriented manufacturer's representative firm, DEI is uniquely qualified to assist its customers in selecting the appropriate components offered by DEI...

2009-06-03 13:31:00

BRISTOL, Pa., June 3 /PRNewswire/ -- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has launched a new series of adapters that enable the use of virtually any SMT (surface mount technology) IC (integrated circuit) device on a pitch of 0.4 mm or higher to PC boards on 0.5 mm pitch. These are ideally suited to adapting an IC device to some of the more popular TSSOPs (thin-shrink small outline packages) and QFPs (quad flat packages)...

2009-01-07 15:04:00

BRISTOL, Pa., Jan. 7 /PRNewswire/ -- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, today announced its new patented CSP/BallNest Hybrid Socket suitable for prototyping, test or burn-in of CSP (chip scale package), BGA (ball grid array), microBGA and LGA (land grid array) devices. The socket, which features a lid that nests each ball termination into the socket for a reliable connection, can be used on any device with a 0.30 mm...

2008-12-18 08:18:00

LEHIGH VALLEY, Pa., Dec. 18 /PRNewswire-FirstCall/ -- Air Products (NYSE: APD) has signed two contracts with Nokia to supply nitrogen to its Beijing and Dongguan plants in China for use in the company's electronics assembly and packaging process. Nokia has recently converted its printed circuit board assembly to a lead-free solder process, and nitrogen is needed in reflow soldering, a widely used method in surface mount technology (SMT) for packaging components on electronics printed...


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