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2005-06-21 18:15:00

A new technique for fabricating liquid cooling channels onto the backs of high-performance integrated circuits could allow denser packaging of chips while providing better temperature control and improved reliability. Developed at the Georgia Institute of Technology, the wafer-level fabrication technique includes polymer pipes that will allow electronic and cooling interconnections to be made simultaneously using automated manufacturing processes. The low-temperature technique, which is...


Word of the Day
bodacious
  • Remarkable; prodigious.
  • Audacious; gutsy.
  • Completely; extremely.
  • Audaciously; boldly.
  • Impressively great in size; enormous; extraordinary.
This word is probably from the dialectal 'boldacious,' a blend of 'bold' and 'audacious.'
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