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Last updated on April 18, 2014 at 7:49 EDT

Latest Bing Dang Stories

2005-06-21 18:15:00

A new technique for fabricating liquid cooling channels onto the backs of high-performance integrated circuits could allow denser packaging of chips while providing better temperature control and improved reliability. Developed at the Georgia Institute of Technology, the wafer-level fabrication technique includes polymer pipes that will allow electronic and cooling interconnections to be made simultaneously using automated manufacturing processes. The low-temperature technique, which is...