Last updated on April 18, 2014 at 13:02 EDT

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2013-04-08 08:33:24

Represents the First Partnership to Address the Cost, Engineering and Supply Chain Challenges Associated with Silicon Interposers Needed for Next Generation Chip Designs JARFALLA, Sweden and SAN JOSE, Calif., April 8, 2013 /PRNewswire/ -- Silex Microsystems, the world's largest pure-play MEMS foundry, and BroadPak, a leading provider of ultra-high performance 2.5D silicon interposer and 3D integration technologies, today announced the immediate availability of their jointly developed...