Quantcast
Last updated on April 19, 2014 at 13:20 EDT

Latest Chip carriers Stories

2012-07-09 02:27:52

PHOENIX, July 9, 2012 /PRNewswire/ -- FlipChip International - (FCI), a global technology leader in Wafer Level Packaging and flip chip wafer bumping, announced today the acquisition of Millennium Microtech Holdings Corporation (MMH) of the Cayman Islands through a strategic Merger with FCI's Cayman Island entity. FCI's acquisition of MMH results in FCI securing controlling interest in Millennium Microtech (Shanghai) (MMS), located in the Zhang Jiang Hi- Tech Park, Pudong New Area, Shanghai,...

2012-07-05 18:20:23

BILLERICA, Mass., July 5, 2012 /PRNewswire/ -- TEL NEXX, Inc., a wholly owned subsidiary of Tokyo Electron U.S. Holdings, is pleased to announce a new multi-year joint development program in 3D semiconductor packaging with IBM. TEL NEXX has collaborated with IBM R&D for many years (as NEXX Systems) to develop new concepts for interposers, lead-free bumping, microbumps, and other cutting-edge interconnect solutions. Now denser packaging and more energy conscious requirements are pushing...

2012-07-03 02:25:14

CARLSBAD, Calif., July 3, 2012 /PRNewswire-iReach/ -- Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced the company will be exhibiting live demonstrations on the 3800 Die Bonder and 8000 Wire Bonder at SEMICON West 2012, July 10-12 in San Francisco, CA, in booth #6157. (Photo: http://photos.prnewswire.com/prnh/20120703/CG33742) The 3800 Die Bonder demonstration will reveal a fully automated component attach...

2012-06-12 10:25:54

PHOENIX, June 12, 2012 /PRNewswire/ -- FlipChip International, LLC (FCI) of Phoenix, Arizona (President: Bob Forcier) and Fujikura Ltd. (President: Yoichi Nagahama) today announced conclusion of a Joint Strategic Sales and Business Development Agreement. This agreement will allow both parties to combine technology development, design, sales and marketing for their recently launched ChipletT(TM) and ChipsetT(TM) ultra low profile embedded semiconductor package product lines based on both the...

2012-05-29 06:26:20

FARMINGTON, Conn., May 29, 2012 /PRNewswire-iReach/ -- Global Information, Inc. is pleased to announce two significant new reports on Integrated Circuit (IC) Packaging The Worldwide IC Packaging Market, 2012 Edition After a year of remarkable growth in 2010, when Integrated Circuit (IC) revenue grew 40.6% and units expanded 35.5%, 2011 experienced a slight downturn in the second half of the year. Semiconductor industry growth has nearly ground to a halt, expected to expand by just...

2012-05-23 02:30:29

DALLAS, May 23, 2012 /PRNewswire/ -- Texas Instruments Incorporated (NASDAQ: TXN) (TI) today announced it has shipped nearly 6.5 billion units of copper wire bonding technology in its analog, embedded processing and wireless products. This milestone underscores TI's confidence in copper as a viable replacement to gold in its semiconductor product roadmaps, and the electronics industry's acceptance of the technology, due to performance, quality and reliability benefits for a range of...

2012-04-24 02:35:09

WILMINGTON, Mass., April 24, 2012 /PRNewswire/ -- Heilind Electronics, the largest distributor of interconnect products in North America, is now stocking WAGO's 2060 series of surface mount PCB terminal blocks with push-button termination. The 2060 series from WAGO features an installed height of only 4.5 mm and is available in one, two or three poles styles. Its unique wire entry "balcony" guides the wire to a proper termination and allows wiring at a slight angle. This series is...

2012-03-16 10:22:05

BILLERICA, Mass., March 16, 2012 /PRNewswire/ -- Tokyo Electron Limited ("TEL") (Headquarters: Minato ward, Tokyo, Japan; President and CEO: Hiroshi Takenaka) is pleased to announce the completion of a definitive acquisition agreement with NEXX Systems Inc. ("NEXX") (Headquarters: Billerica, Massachusetts, USA; President and CEO: Tom Walsh). Over the years, NEXX collaborated with TEL to study process technology in advanced packaging equipment for the development of 3D Thru Silicon Vias...

2012-03-06 08:00:00

PHOENIX and PORTO, Portugal, March 6, 2012 /PRNewswire/ -- FlipChip International (FCI), the global technology leader in flipchip bumping and Wafer Level Packaging, and NANIUM S.A. (NANIUM), a world-class provider of manufacturing, test and engineering services in the semiconductor business, announced today License, Sales and Marketing agreements for 300mm flipchip bumping and Wafer Level Packaging. (Logo: http://photos.prnewswire.com/prnh/20120306/LA64593LOGO-a) (Logo:...

2012-01-02 05:00:00

BILLERICA, Mass. and HSIN-CHU, Taiwan, Jan. 2, 2012 /PRNewswire/ -- A leading advanced packaging equipment provider, NEXX Systems (NEXX) sold a 300mm Stratus electrochemical deposition (ECD) system to Powertech Technology (PTI), a major IC packaging and testing company headquartered in Taiwan. The Stratus will be used for copper pillar bumps and re-distribution layers in advanced packaging applications that enable portable intelligent devices, such as smart phones and tablet PCs. The...