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Latest Chip carriers Stories

2011-12-19 13:45:00

BRISTOL, Pa., Dec. 19, 2011 /PRNewswire/ -- Aries Electronics, a US manufacturer of standard, programmed and custom interconnection products used worldwide, now offers the industry's first CSP sockets that accept any area-array device for high-temperature testing up to +200 degrees C. The new AR4HT Series sockets incorporate a low-profile 0.45 mm contact structure (compressed) that is shorter than other low-profile contacts and provides excellent compliance for reliable ATE...

2011-11-10 07:00:00

PHOENIX, Nov. 10, 2011 /PRNewswire/ -- FlipChip International, LLC USA (FCI) and Fujikura Ltd. (President: Yoichi Nagahama) today announced ChipletT(TM) and ChipsetT(TM) embedded die packages for single die or multi-die semiconductor packaging applications. ChipletT and ChipsetT package products are based on Fujikura's flex-based laminate embedded die technology "WABE Technology(TM)" and will provide breakthrough cost-effective, ultra low profile packages by leveraging roll to roll...

2011-09-10 07:00:00

Heidelberg Instruments, a leader in design, development and production of laser lithography systems, announced an order for a VPG 800 Maskless Lithography System from the Taiwan based Kinsus Interconnect Technology Corp . VPG 800 is an ideal for high volume production of todayâs demanding photomasks for various applications, including the advanced electronic packaging. (PRWEB) September 10, 2011 Heidelberg Instruments, a leader in design, development and production of laser...

2011-08-30 16:16:00

SAN DIEGO, Aug. 30, 2011 /PRNewswire/ -- AEM, Inc. is pleased to announce the editors of Military Embedded Systems have selected the company's Sn/Pb (tin/lead) conversion process as their Editor's Choice. The announcement was made in the July/August issue. AEM's hi-rel-qualified Sn/Pb (tin/lead) conversion process is designed to mitigate the formation of tin whiskers in surface-mount components. (Logo: http://photos.prnewswire.com/prnh/20110830/LA60106LOGO) Here's what the editors...

2011-07-25 08:30:00

ATLANTA, July 25, 2011 /PRNewswire/ -- World Micro, Inc., a global supplier of electronic components, announced today that it has completed the installation of its newly acquired MUST III wetting balance solderability test system. Built by U.K. based GEN3 Systems, Ltd., the balance tester was purchased from and installed by Ascentech LLC, the developer's North American distributor. The tester is a purpose designed system that enables fast and accurate solderability testing of surface...

2011-07-13 11:14:00

BOULDER, Colo., July 13, 2011 /PRNewswire/ -- SparkFun shares its passion for electronics by providing parts, knowledge, and innovation for those looking to explore the world of embedded electronics. It helps anyone discover their inner inventor and enables individuals to create their WHO: own electronics projects. SparkFun loves to teach people the skills they need to start...

2011-06-13 10:18:00

TOKYO, June 13, 2011 /PRNewswire/ -- Fujikura Limited today announced an exciting collaboration with FlipChip International, LLC of Phoenix, Arizona USA on next generation semiconductor packaging technology. FCI and Fujikura have agreed to partner on the further development and commercialization of next generation semiconductor packaging including flexible substrate based embedded die, Fan-Out packages, and high density, 3D interposer technologies. Bob Forcier, Chief Executive Office...

2011-06-09 16:58:00

IEPER, Belgium, June 9, 2011 /PRNewswire-FirstCall/ -- Melexis, the pioneer in programmable linear Hall sensors launches its third product generation. This new family breaks with the conventional "single-in-line-package" (SIP) approach since they require more careful design consideration to avoid mounting, space, EMI, reliability and cost penalties at the system level. The new Melexis programmable linear Hall ICs are surface-mount devices (SMD) supporting the trend for improved...

2011-04-20 14:26:00

In the news release, President & CEO of Chip Supply, Inc., Edward Perrot Announces Retirement, issued 20-Apr-2011 by Chip Supply, Inc. over PR Newswire, we are advised by the company that Mr. Perrott's last name was as misspelled in the headline. The complete, corrected release follows: President & CEO of Chip Supply, Inc., Edward Perrott Announces Retirement ORLANDO, Fla., April 20, 2011 /PRNewswire/ -- After 30 years with Chip Supply, Inc., President & CEO Edward J....

2011-04-20 13:57:00

ORLANDO, Fla., April 20, 2011 /PRNewswire/ -- After 30 years with Chip Supply, Inc., President & CEO Edward J. Perrott announces his retirement. Perrott served in various capacities through the years, becoming president and CEO in 1991. Under his tenure, Chip Supply grew into the largest independent die distributor in the world, as well as a leading global provider of high reliability interconnect solutions, serving the military, aerospace, medical, industrial and communications...