Latest Chip carriers Stories
REDWOOD CITY, Calif., April 14, 2011 /PRNewswire/ -- EoPlex Technologies, Inc.
LOS ANGELES, March 8, 2011 /PRNewswire/ -- OFC/NFOEC -- Tektronix Component Solutions announced today its new 30 GHz leadless chip carrier (LCC) packaging platform to meet the broadband performance requirements demanded by telecommunications systems and modules, military/aerospace applications, and terrestrial communications.
Janco Incorporated, a nationwide provider of medical packaging has recently announced an improved ability to provide pharmaceutical and medical customers with better packaging solutions in 2011. Dover, NH (PRWEB) February 16, 2011 Janco Incorporated, a provider of industrial plastic fabrication based in Dover, New Hampshire has recently announced the perfection of new technology allowing them to provide flexible medical packaging design for a variety of critical medical products,...
BRISTOL, Pa. Feb.
SAN DIEGO, Jan. 19, 2011 /PRNewswire/ -- AEM, Inc. announces a hirel-qualified Sn/Pb (tin/lead) conversion process designed to mitigate the formation of tin whiskers in surface-mount components.
BRISTOL, Pa., Jan. 7, 2011 /PRNewswire/ -- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, now offers machined high-frequency center probe test sockets to accommodate IC devices with a lead pitch of 0.30 mm.
MENLO PARK, Calif., Nov. 10, 2010 /PRNewswire/ -- Tyco Electronics introduced today a breakthrough technology that allows manufacturers to include surface-mountable thermal protection in their standard RoHS-compliant reflow assembly process.
SAN DIEGO, Oct.
REDWOOD CITY, Calif., Oct. 14 /PRNewswire/ -- EoPlex, Inc. today announced availability of its new high performance, clean-tech lead carrier for semiconductor packaging.
OAKLAND, Calif., Sept.
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