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Latest Chip carriers Stories

2010-08-16 08:00:00

PHOENIX, Aug. 16 /PRNewswire/ -- FlipChip International (FCI) today announced that it has signed a patent license agreement with Cookson Electronics covering its intention to facilitate the industry's ease in adopting the use of Polymer Collar(TM) technology to enhance the drop-shock and thermal cycling reliability of area array packages, particularly wafer level packages used for hand-held devices. By purchasing polymer flux from Cookson, package manufacturers will be permitted to...

2010-08-03 13:39:00

BRISTOL, Pa., Aug. 3 /PRNewswire/ -- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has expanded its line of Fine Pitch Bump Adapters to include adapters that accommodate boards with pitches down to 0.40 mm. As part of the Correct-A-Chip series, the new Fine Pitch Bump Adapters allow customers to use higher pitch devices on smaller pitch boards. (Photo: http://photos.prnewswire.com/prnh/20100803/PH45050 ) (Photo:...

2010-07-13 15:10:00

ORLANDO, Fla., July 13 /PRNewswire/ -- Chip Supply, Inc., a global provider of semiconductor die and specialized packaging solutions, is pleased to announce the addition of Lupton Associates to its domestic sales team to represent Chip Supply in Maryland, Virginia, and North Carolina's Research Triangle Park. Lupton was specifically chosen as a partner because of its unique ability to provide existing and potential customers with the same kind of value-added service for which Chip Supply is...

2010-07-07 08:00:00

CHANDLER, Ariz. and DALLAS, July 7 /PRNewswire/ -- Amkor Technology, Inc. (Nasdaq: AMKR) and Texas Instruments Incorporated (TI) (NYSE: TXN) today announced they have qualified and begun production of the industry's first fine pitch copper pillar flip chip packages - shrinking bump pitch up to 300 percent compared to current solder bump flip chip technology. Co-developed to lower the packaging costs of integrated circuit (IC) devices with fine pitch input/output (I/O) pad structures of...

2010-05-24 07:00:00

OAKLAND, Calif., May 24 /PRNewswire/ -- RJR Polymers, a leading developer of high performance air cavity semiconductor packaging, announced today the newest generation of its innovative Liquid Crystal Polymer (LCP) technology. Offering a low-cost, highly flexible alternative to traditional ceramic and over molded packaging options, RJR's LCP air cavity packaging technology delivers a high degree of electrical isolation to the silicon die in a modular assembly process that supports the use...

2010-04-01 04:00:00

REDWOOD CITY, Calif., April 1 /PRNewswire/ -- EoPlex Technologies, the company that produces complex electronic components in a high-speed, low-cost, clean tech, print forming process, announced today that Eric Leonard as joined the company as Director of Sales and Marketing. Leonard will be responsible for the management and execution of EoPlex sales activities. "We are pleased to welcome Eric Leonard as an EoPlex team member," stated Arthur Chait, President and CEO of EoPlex. "Eric has...

2010-03-30 09:33:00

ST. FLORIAN, Austria, March 30 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Morocco-based wafer-level camera manufacturer Nemotek Technologie has placed a repeat order for EVG's bonding and UV nanoimprint lithography (UV-NIL) systems - the EVG520IS and IQ Aligner. Nemotek will use these systems to address its production demands for CMOS image sensors and...

2010-03-11 04:00:00

REDWOOD CITY, Calif., March 11 /PRNewswire/ -- EoPlex Technologies, the company that produces complex electronic components in a high-speed, low-cost, clean tech process, has co-authored a paper with its customer, STMicroelectronics, the world's fifth largest semi-conductor company. The paper, entitled "High Performance and Cost Effective Molded Array Package Substrate," was presented yesterday by EoPlex Vice President, Philip Rogren, for the Annual Device Packaging Conference of IMAPS...

2010-03-10 05:00:00

GENEVA, March 10 /PRNewswire-FirstCall/ -- STMicroelectronics (NYSE: STM), a leader in power applications, has announced innovative plastic air-cavity packages that enable high-power transistors for Radio-Frequency (RF) applications such as transceivers, broadcast equipment and MRI scanners to deliver performance and cost advantages over alternative devices in ceramic packages. Air-cavity packages provide high electrical isolation for silicon die, and are well suited for high-frequency,...

2010-02-05 11:30:00

BRISTOL, Pa., Feb. 5 /PRNewswire/ -- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, recently added new BGA Switch-A-Pitch Adapters that allow for smaller pitch devices to be used with larger pitch boards. The new adapters in the series adapt 0.40 mm devices to boards with a 1.00 mm pitch. (Photo: http://www.newscom.com/cgi-bin/prnh/20100205/PH50440 ) Aries' BGA Switch-A-Pitch Adapters, part of the extensive line of...


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  • Boughs or branches.
  • Warbling of birds in trees.
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