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2010-01-05 08:30:00

HONG KONG, DONGGUAN, China and MILPITAS, Calif., Jan. 5 /PRNewswire-FirstCall/ -- ASAT Holdings Limited (Pink Sheets: ASTTY) (the "Company"), a global provider of semiconductor package design, assembly and test services, announces that Simon Bell, Peter Hopper and Kei W. Chua, appointees of funds managed by J.P. Morgan Partners Asia LDC (the "JPMP Funds") to the Board of Directors of the Company, have resigned as Directors effective as of December 30, 2009. These former Directors have...

2009-11-09 07:00:00

PHOENIX, Nov. 9 /PRNewswire/ -- FlipChip International today announced a major step forward in semiconductor package miniaturization with its NANOPillar(TM), wafer bumping technology. NANOPillar(TM) wafer scale bumping delivers for the first time, highly adaptable lead-free solder capping for extremely tight tolerance stand-off geometries in demanding applications including smart phones and portable medical devices. Previously, pillar bump lead-free solder alloys have been limited to a...

2009-10-26 08:30:00

PHOENIX and COLORADO SPRINGS Colo., Oct. 26 /PRNewswire/ -- FlipChip International, (FCI), the global technology leader in flip-chip bumping and Wafer Level Packaging and IC Interconnect (ICI), a TS16949 registered leader in electroless Nickel flip-chip bumping and Wafer Level Packaging announced today a U.S. joint Sales and Marketing agreement. This agreement allows their respective U.S. customers access to the extensive service portfolios of both FCI and ICI. FCI will continue to...

2009-10-22 06:40:00

IPOH, Malaysia, Oct. 22 /PRNewswire/ -- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced that they now offer an extremely thin version of their MLP (Micro Leadframe Package). The current offering, referred to as the X3 package, is a two lead package with nominal dimensions of 0.6 mm long by 0.3 mm wide and 0.3 mm thick, which is very similar in size to a 0201 surface mount component. Carsem is currently in the process of...

2009-08-20 06:45:00

MOUNTAIN VIEW, Calif., Aug. 20 /PRNewswire/ -- Based on its recent analysis of the advanced electronic packaging market, Frost & Sullivan recognizes Amkor Technology, Inc. with the 2009 Global Frost & Sullivan Technology Innovation of the Year Award for its line-up of innovative new products, including through mold via package on package (TMV(TM) PoP), FusionQuad(R), and flip chip molded ball grid array (FCMBGA). Amkor delivers tailored, application-specific package design, as well...

2009-07-24 03:03:00

TAIPEI, Taiwan, July 24 /PRNewswire-Asia-FirstCall/ -- Advanced Semiconductor Engineering, Inc. (Stock Code: 2311.tw) has scheduled its 2009 Q1 Earnings Conference Call for Apr 29, 2009 at 20:00 (GMT+08:00). The conference call will feature remarks by Mr. Joseph Tung, CFO. This conference call will be webcasted by CANcast and can be accessed at http://www.corpasia.net/cancast/taiwan/index.php?id=tw2311_68&version=e . Investors who would like to participate in this event via the...

2009-07-20 06:00:00

HONG KONG, DONGGUAN, China and MILPITAS, Calif., July 20 /PRNewswire-FirstCall/ -- ASAT Limited, a subsidiary of ASAT Holdings Limited (OTC Bulletin Board: ASTTY), a global provider of semiconductor package design, assembly and test services, today announced that it has entered into a cross licensing agreement with Unisem (M) Berhad that will allow each company to manufacture and market the other company's key advanced leadless packaging technologies. The packaging technologies included in...

2009-06-17 11:06:00

BRISTOL, Pa., June 17 /PRNewswire/ -- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, announced that Duerfeldt Engineering Inc. (DEI) has joined Aries' representative network, covering the entire Pacific Northwest, including Oregon, Washington, Idaho and Montana. As an engineering-oriented manufacturer's representative firm, DEI is uniquely qualified to assist its customers in selecting the appropriate components offered by DEI...

2009-06-09 09:37:00

New J-lead Surface Mount Option Provides More Resilient Circuit Board Connections for Military Applications BOSTON, June 9 /PRNewswire/ -- Vectron International, a leader in the design, manufacture and marketing of Frequency Control, Sensor, and Hybrid Product solutions, today announced from the 2009 IEEE MTT-S International Microwave Symposium that its ceramic 5x7 mm crystal oscillators and translators are now available in J-leaded packages. The J-lead packaging provides defense customers...

2009-06-03 13:31:00

BRISTOL, Pa., June 3 /PRNewswire/ -- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has launched a new series of adapters that enable the use of virtually any SMT (surface mount technology) IC (integrated circuit) device on a pitch of 0.4 mm or higher to PC boards on 0.5 mm pitch. These are ideally suited to adapting an IC device to some of the more popular TSSOPs (thin-shrink small outline packages) and QFPs (quad flat packages)...


Word of the Day
toccata
  • In music, a work for a keyboard-instrument, like the pianoforte or organ, originally intended to utilize and display varieties of touch: but the term has been extended so as to include many irregular works, similar to the prelude, the fantasia, and the improvisation.
This word is Italian in origin, coming from the feminine past participle of 'toccare,' to touch.
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