Latest Chip carriers Stories
HONG KONG, DONGGUAN, China and MILPITAS, Calif., Jan. 5 /PRNewswire-FirstCall/ -- ASAT Holdings Limited (Pink Sheets: ASTTY) (the "Company"), a global provider of semiconductor package design, assembly and test services, announces that Simon Bell, Peter Hopper and Kei W.
PHOENIX, Nov. 9 /PRNewswire/ -- FlipChip International today announced a major step forward in semiconductor package miniaturization with its NANOPillar(TM), wafer bumping technology.
PHOENIX and COLORADO SPRINGS Colo., Oct.
IPOH, Malaysia, Oct. 22 /PRNewswire/ -- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced that they now offer an extremely thin version of their MLP (Micro Leadframe Package).
MOUNTAIN VIEW, Calif., Aug. 20 /PRNewswire/ -- Based on its recent analysis of the advanced electronic packaging market, Frost & Sullivan recognizes Amkor Technology, Inc.
TAIPEI, Taiwan, July 24 /PRNewswire-Asia-FirstCall/ -- Advanced Semiconductor Engineering, Inc. (Stock Code: 2311.tw) has scheduled its 2009 Q1 Earnings Conference Call for Apr 29, 2009 at 20:00 (GMT+08:00). The conference call will feature remarks by Mr.
HONG KONG, DONGGUAN, China and MILPITAS, Calif., July 20 /PRNewswire-FirstCall/ -- ASAT Limited, a subsidiary of ASAT Holdings Limited (OTC Bulletin Board: ASTTY), a global provider of semiconductor package design, assembly and test services, today announced that it has entered into a cross licensing agreement with Unisem (M) Berhad that will allow each company to manufacture and market the other company's key advanced leadless packaging technologies.
BRISTOL, Pa., June 17 /PRNewswire/ -- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, announced that Duerfeldt Engineering Inc.
New J-lead Surface Mount Option Provides More Resilient Circuit Board Connections for Military Applications BOSTON, June 9 /PRNewswire/ -- Vectron International, a leader in the design, manufacture and marketing of Frequency Control, Sensor, and Hybrid Product solutions, today announced from the 2009 IEEE MTT-S International Microwave Symposium that its ceramic 5x7 mm crystal oscillators and translators are now available in J-leaded packages.
BRISTOL, Pa., June 3 /PRNewswire/ -- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has launched a new series of adapters that enable the use of virtually any SMT (surface mount technology) IC (integrated circuit) device on a pitch of 0.4 mm or higher to PC boards on 0.5 mm pitch.
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