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Latest Chip carriers Stories

2009-04-21 01:56:00

TAIPEI, Taiwan, April 21 /PRNewswire-Asia-FirstCall/ -- Advanced Semiconductor Engineering, Inc. (Stock Code: 2311.tw) has scheduled its 2009 Q1 Earnings Conference Call for Apr 29, 2009 at 20:00 (GMT+08:00). The conference call will feature remarks by Mr. Joseph Tung, CFO. This conference call will be webcasted by CANcast and can be accessed at http://www.corpasia.net/cancast/taiwan/index.php?id=tw2311_68&version=e . Investors who would like to participate in this event via the...

2009-01-22 07:00:00

DALLAS, Jan. 22 /PRNewswire/ -- Texas Instruments Incorporated (TI) (NYSE: TXN) today announced the ADS795x family of low power, precision SAR analog-to-digital converters (ADC) in a small form factor. These devices provide excellent linearity and AC performance for high-density applications and are optimized to deliver maximum performance in battery and low-voltage applications, such as handheld medical instruments, programmable logic controllers and digital power supplies. The ADS795x...

2009-01-07 15:04:00

BRISTOL, Pa., Jan. 7 /PRNewswire/ -- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, today announced its new patented CSP/BallNest Hybrid Socket suitable for prototyping, test or burn-in of CSP (chip scale package), BGA (ball grid array), microBGA and LGA (land grid array) devices. The socket, which features a lid that nests each ball termination into the socket for a reliable connection, can be used on any device with a 0.30 mm...

2008-12-03 08:00:00

DALLAS, Dec. 3 /PRNewswire/ -- Texas Instruments (TI) (NYSE: TXN) today introduced a family of +/- 70V, fault protected RS-485 transceivers that achieve overvoltage protection with no external termination needed. These low-power devices serve as drop-in upgrades to existing RS-485 designs without costly board redesigns. The new half- and full-duplex transceivers simplify design in industrial automation, motor control and heating, ventilating, and air conditioning (HVAC) equipment. (See...

2008-11-10 15:00:22

ASAT Holdings, a provider of semiconductor package design, assembly and test services, has entered into an agreement to license Amkor's FusionQuad package technology. This agreement will enable ASAT to manufacture packages based on Amkor's FusionQuad technology platform. Jim Fusaro, corporate vice president of wirebond products at Amkor, said: "The market has been seeking a low cost package technology to better serve applications in the 150 to 350 pin count range. We believe FusionQuad...

2008-10-14 09:00:14

Semtech Corp. (Nasdaq: SMTC), a leading supplier of analog and mixed-signal semiconductors, today announced the SX1501 platform of GPIO expanders that come in 4-, 8-, and 16-channels of I/Os operating with a VDD range of 1.2V to 5.5V. The devices connect easily to today's low core voltage chipsets in battery powered handheld applications without the need for level translating circuits. Each channel of the true bi-directional style of I/O offers mask programmable interrupts, programmable...

2008-10-13 09:00:34

Unisem Group today announced that it has started volume shipment of packages using its industry-leading copper wirebonding technology. Unisem's copper wirebond process has been qualified by several IC manufacturers worldwide, including Integrated Device Technology (IDT), a leading provider of mixed-signal semiconductor solutions. The IDT thin shrink small outline packages (TSSOP) integrate Unisem's copper wirebonds for a wide range of applications, including clock devices for desktops and...

2008-09-18 12:00:36

Imbera Electronics, today announces the launch of its next generation integrated module board (IMB) technology, available across Imbera's full range of turnkey manufacturing services. IMB technology allows OEMs/ODMs to produce smaller boards, quickly and in a cost-effective manner by making simple adaptations to existing manufacturing processes. The advanced packing solution already has considerable momentum, with early customer-wins including a contract with Ibiden, the world's number one...

2004-11-30 12:00:12

TDK Semiconductor Corp., a leader in the design and manufacture of mixed-signal semiconductors for world markets, today unveiled a new member of its power meter system-on-chip (SoC) product line. The new TDK 71M6511 integrates a 21-bit delta-sigma converter with three sensor channels, 32-bit compute engine, MCU, RTC, LCD driver, and precision voltage reference, and is ideal for tamper-resistant residential time-of-use (TOU) and pre-payment metering. "The 71M6511 mirrors many architectural...