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Latest Chip scale package Stories

2014-07-10 23:04:59

ChinaMarketResearchReports.com adds latest report on “Global and China IC Substrate Industry Report, 2014-2015” to its store. Dallas, TX (PRWEB) July 10, 2014 PCB (printed circuit board) industry can be divided into three broad categories i.e. rigid PCB, flexible PCB (FPCB) and substrate. IC substrate industry suffered a continuous decline in 2012 and 2013, rooted in two aspects: first, the PC shipment declined, and CPU substrate as the main type of IC substrate enjoyed the highest...

2014-06-09 08:36:32

PHOENIX, June 9, 2014 /PRNewswire/ -- FlipChip International - (FCI), the global technology leader in flip chip bumping and wafer level packaging, announced that their CTO, Ted Tessier, will be presenting a collaborative paper with Fujikura Limited entitled "Enabling Wearable Electronics: Innovation Through Miniaturization" at the TechSearch International Packaging and Assembly Considerations in Wearable Electronics Workshop to be held in Austin, Texas on June 11(th) and 12(th),...

2014-02-25 23:25:04

Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced that they have qualified and started Laminate Production in their Suzhou factory. Ipoh, Malaysia (PRWEB) February 25, 2014 Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced that they have qualified and started Laminate Production in their Suzhou factory. The shift of the semiconductor business into smartphones and tablets has...

2011-06-13 10:18:00

TOKYO, June 13, 2011 /PRNewswire/ -- Fujikura Limited today announced an exciting collaboration with FlipChip International, LLC of Phoenix, Arizona USA on next generation semiconductor packaging technology. FCI and Fujikura have agreed to partner on the further development and commercialization of next generation semiconductor packaging including flexible substrate based embedded die, Fan-Out packages, and high density, 3D interposer technologies. Bob Forcier, Chief Executive Office...

2010-08-16 08:00:00

PHOENIX, Aug. 16 /PRNewswire/ -- FlipChip International (FCI) today announced that it has signed a patent license agreement with Cookson Electronics covering its intention to facilitate the industry's ease in adopting the use of Polymer Collar(TM) technology to enhance the drop-shock and thermal cycling reliability of area array packages, particularly wafer level packages used for hand-held devices. By purchasing polymer flux from Cookson, package manufacturers will be permitted to...


Word of the Day
lambent
  • Licking.
  • Hence Running along or over a surface, as if in the act of licking; flowing over or along; lapping or bathing; softly bright; gleaming.
This word comes the Latin 'lambere,' to lick.
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