Latest DDR3 SDRAM Stories
New Fan Keeps HyperX Memory Cool While Looking Cool FOUNTAIN VALLEY, Calif., June 2 /PRNewswire/ -- Kingston Technology Company, Inc., the independent world leader in memory products, today announced its new HyperX(R) Fan, designed specifically to keep Kingston(R) HyperX memory cool.
SANTA CLARA, Calif., May 29 /PRNewswire-FirstCall/ -- Advantest Corporation (TSE: 6857, NYSE: ATE), a leading supplier of automatic test equipment (ATE) to semiconductor manufacturers worldwide, today announced availability of its new, expanded configuration T5503 high-speed memory test system, boasting the industry's highest parallel test capability of up to 256 DDR3 devices -- double that of the previous model.
Large-Scale Memory Demo, Guitar Hero(R) Champion at Kingston Booth LOS ANGELES and FOUNTAIN VALLEY, Calif., May 11 /PRNewswire/ -- Kingston Technology Co.
Modules Support Latest Generation XMP-Ready Notebook Computers FOUNTAIN VALLEY, Calif., April 9 /PRNewswire/ -- Kingston Technology Company, Inc., the independent world leader in memory products, today announced the release of its first XMP-ready HyperX(R) DDR3 SO-DIMMs for notebook PCs using Intel's Cantiga mobile chipset.
The Broadest Lines of New Xeon(R) Processor 5500/3500 series (Nehalem) Server, Workstation and Blade Solutions SAN JOSE, Calif., March 30 /PRNewswire-FirstCall/ -- Super Micro Computer, Inc.
Celeno Communications Uses DFI Compliant, Configurable Databahn DDR Controller IP for Best Performance SUNNYVALE, Calif., March 16 /PRNewswire/ -- Denali Software, Inc., a world-leading provider of electronic design automation (EDA) software and intellectual property (IP), today announced that Celeno Communications, a leading provider of semiconductors for multimedia Wi-Fi home networking applications, has incorporated its high-performance Databahn(TM) DDR memory controller IP into its new 5...
Hynix Semiconductor has developed the world's first 1-gigabit dynamic random access memory chip, the company announced Sunday. The South Korean company said mass production of the 1-gigabit DDR3 DRAM chip, which uses 44-nanometer technology, will begin in the third quarter of this year, Yonhap News Agency reported. The new chip is expected to be 50 percent more productive than the previous standard 54-nanometer technology, the company said. DDR3 DRAM is a random access memory technology...
Ultra-Low Latency Kit Increases Frequencies for Even Higher Performance LAS VEGAS and FOUNTAIN VALLEY, Calif., Jan.
Demo to Include Overclocking and Maxing Out System Memory LAS VEGAS and FOUNTAIN VALLEY, Calif., Jan.
eSilicon Corp., a pioneering semiconductor value chain producer (VCP), today announced it delivered working silicon on the world's fastest field programmable gate array (FPGA) for Achronix Semiconductor Corp.
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