Latest Electronic design Stories

Over 500 users have downloaded and tested the software to simulate three dimensional integrated circuits. San Jose, CA (PRWEB) April 18, 2013 MonolithIC 3D Inc., a Silicon Valley startup specializing in 3D ICs, announces a milestone with its 2D and 3D ICs simulator tool. Industry professionals from 49 countries across the globe have downloaded the tool directly from company’s website over 500 times. The MonolithIC 3D team developed the open-source simulator called IntSim v2.5 to help...

Supporting the new ADMA 3 to maximize the effective throughput by reducing the burden on software driver San Jose, CA (PRWEB) April 18, 2013 Arasan Chip Systems, Inc. (“Arasan”), a leading provider of Total IP Solutions for mobile applications, announced today the availability of the industry’s first SD 4.1 Total IP Solution for engineering and product development of SD 4.1 devices with the UHS-II physical layer interface. Arasan is an active contributor to SDA specification....

Certain, Inc. has released a complimentary guide for CMOs with tips to unlock the event channel and accelerate revenue by turning the traditional view of corporate events inside out. San Francisco, CA (PRWEB) April 17, 2013 Certain, Inc., the leading provider of enterprise event management technology for the global meetings and events industry, has released its latest guide for Chief Marketing Officers (CMOs). Titled, How Smart CMOs Accelerate Revenue with Events, the 9 page guide offers...

Purdue University Researchers are developing a new type of semiconductor technology for future computers and electronics based on "two-dimensional nanocrystals" layered in sheets less than a nanometer thick that could replace today's transistors. The layered structure is made of a material called molybdenum disulfide, which belongs to a new class of semiconductors - metal di-chalogenides - emerging as potential candidates to replace today's technology, complementary metal oxide...

World's most flexible interconnect fabric IP enables higher frequencies with lowest power consumption SUNNYVALE, Calif., April 16, 2013 /PRNewswire/ -- Arteris Inc., the inventor and leading supplier of network-on-chip (NoC) interconnect IP solutions, today announced that Rockchip has again selected Arteris(®) FlexNoC(®) interconnect IP as the backbone SoC interconnect for its new SoC platforms. (Photo: http://photos.prnewswire.com/prnh/20120831/SF66149LOGO) "Arteris exceeded...

More New Thermal Interface Material Characterization Tools SANTA CLARA, Calif., April 16, 2013 /PRNewswire/ -- Thermal Engineering Associates, Inc. (TEA) announces the availability of a new family of Thermal Interface Material (TIM) characterization tools that offer flexibility, standardization, and low cost. The tools are comprised of the popular TEA Thermal Test Chip (TTC) in sizes ranging from 2.5mm square to 12.8mm square mounted on a variety of popular packages including BGA,...

Synopsys IC Validator Enables LG Electronics to Accelerate Manufacturing Compliance MOUNTAIN VIEW, Calif., April 15, 2013 /PRNewswire/ -- Highlights Synopsys' In-Design physical verification with IC Validator and IC Compiler place-and-route solution accelerates LG Electronics' manufacturing closure by two weeks Multiple successful tapeouts using In-Design physical verification demonstrate accelerated manufacturing closure for high-performance core design LG Electronics has...

College of Engineering, Pune, India students learn about quantum mechanics PUNE, India, April 11, 2013 /PRNewswire/ -- Honeywell (NYSE: HON) yesterday introduced Professor David Gross, Nobel laureate in Physics, to the students and faculty of College of Engineering, Pune, India, as part of its global Honeywell Initiative for Science & Engineering (HISE). Professor Gross is among 22 Nobel laureates that Honeywell has sponsored at universities worldwide since 2006. The event...

Agreement will assess new technology that will advance global in-flight wireless connectivity HAMBURG, Germany, April 10, 2013 /PRNewswire/ -- Honeywell (NYSE: HON) and Boeing have signed a technical services agreement to research and develop technologies for the next generation of high-speed, in-flight wireless connectivity on Boeing platforms including the 787, 777, 737NG and 747-8. With this agreement, Honeywell and Boeing are addressing passengers' increasing demands for faster,...

-- Alex Ismail Named President, Energy, Safety, & Security, Automation and Control Solutions MORRIS TOWNSHIP, N.J., April 9, 2013 /PRNewswire/ -- Honeywell (NYSE: HON) today announced several senior leadership changes reflecting its continued evolution, global growth, and development of leadership. "Honeywell is in an enviable position to capitalize on the strength and experience of a highly capable leadership team to support the further development of our organization," said...