Latest Electronic packaging Stories

2011-05-28 00:00:51

A new location, expanded services, and increased personnel. Agawam, MA (PRWEB) May 27, 2011 2011 is poised to be a significant year for Litron Inc., of Agawam MA. Litron has invested over a million dollars in both the purchase of an additional 9,500 square foot facility just four doors down from their existing 23,500 square foot facility as well as upgrading and expanding upon their equipment and service offerings. The new 45 Bowles Road, Agawam MA 01001 facility will allow Litron to break...

2011-01-15 00:00:44

Two new thermally conductive silicones offer a variety of performance factors for thermal management challenges in medical devices. Carpinteria, CA (Vocus/PRWEB) January 13, 2011 NuSil Technology LLC, the global leader in silicone materials for the healthcare and pharmaceutical industries, introduces two thermally conductive healthcare silicone elastomers. These elastomers can be used as a cure-in-place adhesive or potting compound between electrical/electric components and heat sinks as...

2010-11-23 00:01:09

Compact Size, High-Density Pin Count and Flexible Design Option Wenatchee, WA (PRWEB) November 22, 2010 SOURIAU PA&E has brought High Temperature Co-Fired Ceramic (HTCC) technology to its popular line of Micro-D connectors, providing design engineers with a new connector option that delivers high levels of mechanical performance and superior wire bonding density. HTCC technology is typically used in high-reliability applications, such as defense/aerospace electronics, infrared sensors...

2010-10-27 17:04:00

SAN DIEGO, Oct. 27 /PRNewswire/ -- Quik-Pak, a division of Delphon Industries and leader in Microelectronic Packaging and Assembly, has entered into a contract with UltraComm for the packaging and assembly of electro/optic Cores which are embedded into High Speed Optical Transceivers for military and space applications. UltraComm provides custom engineering design, and systems integration services to a wide variety of companies. "The electro/optic Cores that UltraComm designs for harsh...

2010-04-08 08:00:00

ALBUQUERQUE, N.M., April 8 /PRNewswire/ -- Life BioScience, Inc. (LBSI) has received a grant totaling $150,000 from the National Science Foundation (NSF) for further development of its proprietary glass ceramic platform for next generation electronic packaging substrates. These novel substrates will integrate a number of enhancements into a single substrate that includes high density copper interconnects, high pressure microfluidics for thermal management requirements and optical waveguide...

2009-04-06 09:40:00

The smaller the components in electronic circuits, the more interference-prone they are. If the components are too densely packed, they can interfere with one another. A near-field scanner can accurately detect weak fields and help to protect bank cards against fraud. Their miniature size is their strength "“ and also their weakness. Be it in cell phones, cars or computers, electronic components are getting smaller and smaller and increasingly powerful. The smaller they are, the faster...

2008-07-08 09:01:04

Palomar Technologies, provider of precision automation equipment and contract assembly services for microelectronics, will showcase the latest application capabilities of its high value-added microelectronic packaging services and equipment at SEMICON West 2008 booth #7515, in San Francisco, California from July 15-17, 2008. Palomar is ready to address equipment and application concerns for those involved with optoelectronic, RF, and microelectronic packaging needs in the solar, LED,...

Word of the Day
  • A Roman unit of weight, 1⁄1728 of a pound.
  • A weight of four grains used in weighing gold and precious stones; a carat.
  • In anatomy, a formation suggesting a husk or pod.
  • The lowest unit in the Roman coinage, the twenty-fourth part of a solidus.
  • A coin of base silver of the Gothic and Lombard kings of Italy.
'Siliqua' comes from a Latin word meaning 'a pod.'