Latest Electronic packaging Stories
The Asia-Pacific Electronic Packaging Material Market driven by growing need for smaller electronic packaging materials for consumer electronics.
North American Electronic Packaging Material Market driven by rapid advancements in electronic device technologies
A new location, expanded services, and increased personnel. Agawam, MA (PRWEB) May 27, 2011 2011 is poised to be a significant year for Litron Inc., of Agawam MA.
Two new thermally conductive silicones offer a variety of performance factors for thermal management challenges in medical devices. Carpinteria, CA (Vocus/PRWEB) January 13, 2011 NuSil Technology LLC, the global leader in silicone materials for the healthcare and pharmaceutical industries, introduces two thermally conductive healthcare silicone elastomers.
Compact Size, High-Density Pin Count and Flexible Design Option Wenatchee, WA (PRWEB) November 22, 2010 SOURIAU PA&E has brought High Temperature Co-Fired Ceramic (HTCC) technology to its popular line of Micro-D connectors, providing design engineers with a new connector option that delivers high levels of mechanical performance and superior wire bonding density.
SAN DIEGO, Oct.
ALBUQUERQUE, N.M., April 8 /PRNewswire/ -- Life BioScience, Inc. (LBSI) has received a grant totaling $150,000 from the National Science Foundation (NSF) for further development of its proprietary glass ceramic platform for next generation electronic packaging substrates.
The smaller the components in electronic circuits, the more interference-prone they are. If the components are too densely packed, they can interfere with one another. A near-field scanner can accurately detect weak fields and help to protect bank cards against fraud.
Palomar Technologies, provider of precision automation equipment and contract assembly services for microelectronics, will showcase the latest application capabilities of its high value-added microelectronic packaging services and equipment at SEMICON West 2008 booth #7515, in San Francisco, California from July 15-17, 2008.
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