Latest Electronic packaging Stories

2015-01-11 23:00:51

The Asia-Pacific Electronic Packaging Material Market driven by growing need for smaller electronic packaging materials for consumer electronics.

2014-11-10 23:04:21

North American Electronic Packaging Material Market driven by rapid advancements in electronic device technologies

2011-05-28 00:00:51

A new location, expanded services, and increased personnel. Agawam, MA (PRWEB) May 27, 2011 2011 is poised to be a significant year for Litron Inc., of Agawam MA.

2011-01-15 00:00:44

Two new thermally conductive silicones offer a variety of performance factors for thermal management challenges in medical devices. Carpinteria, CA (Vocus/PRWEB) January 13, 2011 NuSil Technology LLC, the global leader in silicone materials for the healthcare and pharmaceutical industries, introduces two thermally conductive healthcare silicone elastomers.

2010-11-23 00:01:09

Compact Size, High-Density Pin Count and Flexible Design Option Wenatchee, WA (PRWEB) November 22, 2010 SOURIAU PA&E has brought High Temperature Co-Fired Ceramic (HTCC) technology to its popular line of Micro-D connectors, providing design engineers with a new connector option that delivers high levels of mechanical performance and superior wire bonding density.

2010-04-08 08:00:00

ALBUQUERQUE, N.M., April 8 /PRNewswire/ -- Life BioScience, Inc. (LBSI) has received a grant totaling $150,000 from the National Science Foundation (NSF) for further development of its proprietary glass ceramic platform for next generation electronic packaging substrates.

2009-04-06 09:40:00

The smaller the components in electronic circuits, the more interference-prone they are. If the components are too densely packed, they can interfere with one another. A near-field scanner can accurately detect weak fields and help to protect bank cards against fraud.

2008-07-08 09:01:04

Palomar Technologies, provider of precision automation equipment and contract assembly services for microelectronics, will showcase the latest application capabilities of its high value-added microelectronic packaging services and equipment at SEMICON West 2008 booth #7515, in San Francisco, California from July 15-17, 2008.

Word of the Day
  • A volcanic mudflow.
The word 'lahar' comes from Javanese.