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Latest Etching Stories

2010-07-01 12:10:45

Integrated circuits, which enable virtually every electronics gadget you use on a daily basis, are constantly being pushed by the semiconductor industry to become smaller, faster, and cheaper. As has happened many times in the past and will continue in the future, integrated circuit scaling is perpetually in danger of hitting a wall that must be maneuvered around. According to Maxime Darnon, a researcher at the French National Center for Scientific Research, in order to continue increasing...

2010-06-10 14:25:00

SAN FRANCISCO, June 10 /PRNewswire/ -- Leading high purity, semiconductor seals specialist, Perlast Ltd, a unit of IDEX Corp., is further lowering the cost-of-ownership of Etch and chemical vapor deposition (CVD) process equipment with the launch of new Kimura K23X and K2CD elastomers. Perlast will be unveiling the new materials at Intersolar North America 2010 in San Francisco's Moscone Center West Hall from July 13-15, booth number 8217. Kimura K13X, and now K23X and K2CD elastomers,...

2010-05-31 08:00:00

ST. FLORIAN, Austria, May 31 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that world-renowned research institute, Fraunhofer IZM-ASSID, has placed an order for two EVG temporary bonding and debonding (TB/DB) systems for thin-wafer handling and processing for 3D ICs. ASSID (All Silicon System Integration Dresden), a new project group of Fraunhofer IZM, will use EVG's...

2010-03-10 09:32:00

SHANGHAI, and SAN FRANCISCO, March 10 /PRNewswire-Asia/ -- Advanced Micro-Fabrication Equipment, Inc. (http://www.amec-inc.com/ ) (AMEC) today announced that it has closed its Series D financing round by securing $46 million from existing investors. They include: Shanghai Venture Capital Co. Ltd. (http://www.shvc.com.cn/ ), Walden International (http://www.waldenintl.com/ ), Lightspeed Venture Partners (http://www.lightspeedvp.com/ ), Goldman Sachs (http://www.goldmansachs.com/ ),...

2010-01-13 16:05:00

SAN JOSE, Calif., Jan. 13 /PRNewswire-FirstCall/ -- Novellus Systems (Nasdaq: NVLS) today introduced its next-generation ultra-violet thermal processing (UVTP) system, the SOLA xT. The SOLA xT is used in the manufacturing of advanced logic devices at 45nm and below and incorporates a proprietary UVTP treatment process that modifies the physical characteristics of a previously-deposited film through exposure to ultraviolet light and heat. The new system, featuring on-board UV monitoring and...

2009-12-01 01:36:00

TOKYO, December 1 /PRNewswire-FirstCall/ -- The Soitec Group (Euronext, Paris), the world's leading supplier of engineered substrates for the microelectronics industry, and CEA-Leti, a leading global research center committed to creating and commercializing innovation in micro- and nanotechnologies, today announced plans to expand their collaboration on wafer-to-wafer 3D integration by offering customers a joint, comprehensive industrial solution. The global offer envisioned by the...

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2009-11-04 07:45:18

New technology provides tamper-free option without reducing fruit quality Laser labeling of fruit and vegetables is a new, patented technology in which a low-energy carbon dioxide laser beam is used to label, or "etch" information on produce, thereby eliminating the need for common sticker-type labels. The technology has been licensed for use on a variety of fruits and vegetables and is being used in New Zealand, Australia, and Pacific Rim countries. It has been approved in Asia, South...

2009-10-08 09:18:00

NEWPORT, Wales, Oct 8 /PRNewswire/ -- Surface Technology Systems plc (STS), a leader in plasma process technologies for manufacturing MEMS and advanced semiconductor devices, today announced that they have received an order from Onera (Office National d'Etudes et Recherches Aerospatiales) for an APS plasma tool for deep oxide etching. This inductively coupled plasma (ICP) - based source, originally launched 10 years ago, has been specifically modified to overcome the limitations of...

2009-10-05 08:00:00

SAN JOSE, Calif., Oct. 5 /PRNewswire-FirstCall/ -- Novellus Systems (Nasdaq: NVLS) today announced that it has developed a manufacturing process to extend the company's SPEED Max shallow trench isolation (STI) application to the 32 nm technology node. The new process technology takes advantage of the dynamic profile control (DPC(TM)) of the SPEED Max high density plasma chemical vapor deposition (HDP-CVD) platform. By tailoring the deposition, etch, and sputter-to-deposition (S/D)...

2009-10-05 04:46:00

BERGISCH GLADBACH, Germany, October 5 /PRNewswire/ -- At this year's Semicon Europa 2009, FRT again presents innovative wafer metrology solutions for R&D and process control tasks in MEMS, semiconductor, and photovoltaic production. A selection of FRT's products can be viewed and tried for test measurements in hall 3, booth 101 at Semicon Europa in Dresden from October 6th to 8th 2009. One of these year's highlights is the multisensor metrology tool MicroProf TTV that precisely...


Word of the Day
lambent
  • Licking.
  • Hence Running along or over a surface, as if in the act of licking; flowing over or along; lapping or bathing; softly bright; gleaming.
This word comes the Latin 'lambere,' to lick.
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