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Last updated on April 17, 2014 at 10:38 EDT

Latest EV Group Stories

2013-11-19 08:37:24

EVG®PHABLE(TM) combines sub-micron resolution of lithography steppers with low cost of ownership and ease of use of proximity aligners ST. FLORIAN, Austria, Nov. 19, 2013 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG(®)PHABLE(TM) exposure system, which is designed specifically for manufacturing photonic components. Leveraging EVG's expertise in...

2013-10-28 08:35:30

EVG®6200 mask alignment system combines wafer bonding, photolithography and nanoimprint lithography in a single, highly flexible platform FREIBURG, Germany, Oct. 28, 2013 /PRNewswire/ -- MICROTAS -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has delivered an EVG(®)6200 semi-automated mask alignment system to Micronit, a manufacturer of lab-on-a-chip products used in...

2013-10-08 08:35:44

EVG®570R2R developed with A*STAR IMRE's Industrial Consortium on Nanoimprint (ICON) DRESDEN, Germany, Oct. 8, 2013 /PRNewswire/ --PLASTIC ELECTRONICS --EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG(®)570R2R--the industry's first roll-to-roll thermal nanoimprint lithography (NIL) tool. Jointly developed with the Industrial Consortium on Nanoimprint (ICON), helmed by...

2013-09-30 00:20:07

A*STAR's new Nanoimprint Foundry will bridge the gap between laboratory-based nanotechnologies and real-world products. This is the first time that Singapore nanotechnology suppliers and manufacturers have been brought together to speed up productisation of nanoimprinting, a technology that imbues ordinary surfaces with unique properties for applications in sectors like consumer care, biomedical devices, optics, filtration, displays and maritime.Singapore, Sept 30,...

2013-09-04 08:38:44

TAIPEI, Taiwan, Sept. 4, 2013 /PRNewswire/ -- SEMICON TAIWAN -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled a new polymer via-filling process for 3D-IC/through-silicon-via (TSV) semiconductor packaging applications. Available on the EVG100 series of resist processing systems, the new NanoFill(TM) process provides void-free via filling of very deep trenches and high-aspect ratio...

2013-09-03 08:33:51

Both Innovators Join Forces to Offer Simple, Cost-Effective Temporary Bonding/Debonding Solution for High-Performance 3D-IC Packaging ST. FLORIAN, Austria, Sept. 3, 2013 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced today that Dow Corning has joined its network of top technology providers to support EVG's LowTemp((TM)) platform for room-temperature wafer bonding and...

2013-07-09 08:35:46

Demand For Flexible, High-Volume Manufacturing Solutions in 3D-IC/Advanced Packaging, MEMS, Power Device and Compound Semiconductor Markets Drive Growth SAN FRANCISCO, July 9, 2013 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has achieved strong revenue growth and expanded its headcount for the first half of 2013. The company attributes this success to...

2013-07-09 08:23:06

SAN FRANCISCO, July 9, 2013 /PRNewswire/ -- INTERSOLAR NORTH AMERICA -- EV Group (EVG), a leading equipment supplier for photovoltaic (PV) cell and module manufacturing, including anti-reflective and anti-soiling coating, nanoimprint lithography, thin-wafer processing, wafer bonding and photolithography equipment, today announced it is showcasing its latest innovations for improving performance and reducing costs of next-generation PV cells and modules at Intersolar North America this...

2013-07-08 08:32:05

Enhanced wafer alignment metrology capability coupled with market-leading GEMINI® FB system creates closed-loop fusion wafer bonding solution to enable high-density TSV devices ST. FLORIAN, Austria, July 8, 2013 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the latest version of its EVG(®)40NT automated measurement system, which is designed to work in concert...

2013-07-01 08:31:06

Three high-volume-production room-temperature debonding process types are supported by a supply chain of seven qualified adhesive suppliers to enable greater manufacturing flexibility ST. FLORIAN, Austria, July 1, 2013 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced its LowTemp(TM) debonding platform, which features three different room-temperature wafer-debonding...