Latest EV Group Stories
ST. FLORIAN, Austria, July 3, 2012 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG(®)850TB/DB automated temporary bonding and debonding system built on the company's new XT Frame platform, which has been optimized to support thin-wafer processing for high-volume 3D IC and TSV (through silicon via) manufacturing. A combination of hardware and software...
ST. FLORIAN, Austria, May 24, 2012 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that for the first time, its customers have ranked EVG as one of VLSIresearch's top five 10 BEST Focused Suppliers of Chip Making Equipment companies in the market research firm's extensive customer satisfaction survey results for 2012. EVG was also awarded third place in...
ST. FLORIAN, Austria, March 27, 2012 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Himax Technologies, Inc., a leading producer of CMOS image sensors, power management devices and semiconductor devices and components used in flat panel displays, has placed a repeat order for an IQ Aligner UV nanoimprint lithography (UV-NIL) system from EVG. The IQ...
ST. FLORIAN, Austria and TOKYO, March 14, 2012 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Shin-Etsu Chemical Co., Ltd., the world's largest supplier of semiconductor materials, has joined EVG's open platform for temporary bonding/debonding (TB/DB) materials. Shin-Etsu's advanced adhesives will be qualified with EVG's EZR® (Edge Zone Release) and...
TOKYO, March 1, 2012 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has shipped an EVG301 semi-automated single-wafer cleaning system to Tokyo Institute of Technology (Tokyo Tech). The EVG301 has already been installed at Tokyo Tech's Arai-Nishiyama Lab, and is being used in the research and development of advanced optical communication ICs. Specifically,...
SANTA CLARA, Calif., Feb. 7, 2012 /PRNewswire/ -- STRATEGIES IN LIGHT -- EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, compound semiconductors, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, today announced the EVG620HBL Gen II--the second generation fully automated mask alignment system for volume manufacturing of high-brightness light-emitting diodes (HB-LEDs). Introduced one...
ST. FLORIAN, Austria, Jan. 10, 2012 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has signed a joint-development and licensing agreement with Eulitha AG, a pioneer and leader in the production of high-quality nanostructures using advanced lithography techniques. EVG will integrate Eulitha's PHABLE(TM) mask-based ultraviolet (UV) photolithography technology...
CHIBA CITY, Japan, Dec. 6, 2011 /PRNewswire/ -- SEMICON JAPAN -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Asahi Kasei E-Materials Corporation, the core operating company of the Asahi Kasei Group for electronics materials, energy materials, photosensitive materials and epoxy resins, has purchased an IQ Aligner UV nanoimprint lithography (UV-NIL) system from EVG. The IQ Aligner,...
ST. FLORIAN, Austria, Dec. 5, 2011 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has introduced a new equipment platform, dubbed the XT Frame, that extends process throughput and tool functionality for virtually all of its current volume-manufacturing product offerings. Specifically designed to address new requirements from its high-volume manufacturing...
ST. FLORIAN, Austria, Oct. 26, 2011 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has launched a suite of groundbreaking temporary bonding and debonding (TB/DB) equipment modules that support ZoneBOND(TM) technology. In parallel, EVG has opened its TB/DB equipment platform to enable the use of a wide range of adhesives from various suppliers to give customers the...
