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Latest EV Group Stories

2011-06-01 08:00:00

ST. FLORIAN, Austria, June 1, 2011 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is collaborating with the Industrial Technology Research Institute (ITRI)--Taiwan's largest and one of the world's leading high-tech R&D institutions--in the development of advanced manufacturing processes for next-generation MEMS devices. As part of the collaboration, ITRI has...

2011-04-19 08:00:00

ST. FLORIAN, Austria, April 19, 2011 /PRNewswire/ -- EV Group (EVG) today announced that its longtime customer and partner, industry-leading research center CEA-Leti (Grenoble, France), has installed multiple EVG tools in its industry-first 300-mm cleanroom dedicated to R&D and prototyping for 3D-integration applications. While Leti's new state-of-the-art facility is focused on R&D and prototyping, EVG's equipment will be leveraged with an eye toward widespread adoption of 3D...

2011-04-11 08:00:00

ST. FLORIAN, Austria, April 11, 2011 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has received the 2010 European Nanoimprint Technology Product Innovation Award from independent market research firm, Frost & Sullivan. The prestigious award recognizes EVG's accomplishments in addressing industrial needs with nanoimprinting solutions. Frost & Sullivan...

2011-02-22 08:00:00

SANTA CLARA, Calif., Feb. 22, 2011 /PRNewswire/ -- STRATEGIES IN LIGHT -- EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, today announced the latest addition to its portfolio of products created to optimize the manufacture of high-brightness light-emitting diodes (HB-LEDs), compound semiconductors and power electronics. The new EVG620HBL fully...

2010-12-07 18:39:00

CARLSBAD, Calif., Dec. 7, 2010 /PRNewswire/ -- Shrink Nanotechnologies, Inc. ("Shrink") (OTC Bulletin Board: INKN), an innovative nanotechnology company developing products and licensing opportunities in the solar energy industry, medical diagnostics and sensors and biotechnology research and development tools businesses, announced today that it has entered into a multi-year development and manufacturing agreement with EV Group, a 30 year old Austria-based leader in the nano-imprint...

2010-12-01 10:25:00

CHIBA, Japan, Dec. 1, 2010 /PRNewswire/ -- SEMICON JAPAN -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has developed a new micro-lens molding process that can enable volume production of very-high-resolution (up to eight megapixels and higher) wafer-level optics for use in smart phones, pico projectors and myriad other applications. The new Monolithic Lens Molding (MLM)...

2010-10-19 08:00:00

DRESDEN, Germany, Oct. 19 /PRNewswire/ -- SEMICON EUROPA - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced receipt of its first order from the Fraunhofer Research Institution for Electronic Nano Systems ENAS (Chemnitz, Germany). Fraunhofer ENAS purchased an EVG6200NT automated mask aligner and an EVG540 automated wafer bonder, and will employ the flexible, multi-process EVG systems for...

2010-10-19 08:00:00

DRESDEN, Germany, Oct. 19 /PRNewswire/ -- SEMICON EUROPA -- EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, today announced the latest addition to its industry-leading EVG500 Series of permanent wafer bonding systems. The new three-chamber EVG520L3 wafer bonding system builds on the series' proven strengths in temperature control, piston force...

2010-10-18 08:00:00

DRESDEN, Germany, Oct. 18 /PRNewswire/ -- SEMICON EUROPA -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received an order for its GEMINI® fully automated wafer bonding system from Sensonor Technologies AS--a pioneer in the manufacture of MEMS sensors. The GEMINI system will be installed at Sensonor's wafer fab in Horten, Norway, where it will be used in the...

2010-10-13 10:56:00

COPENHAGEN, Denmark, Oct. 13 /PRNewswire/ -- NNT CONFERENCE -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled a new technology capability that enables ultra-high-resolution patterning of features down to 12.5 nm: Soft Molecular Scale Nanoimprint Lithography (SMS-NIL). Based on EVG's proven UV-NIL systems, SMS-NIL provides customers with a repeatable, cost-effective process for producing...


Word of the Day
endocarp
  • The hard inner (usually woody) layer of the pericarp of some fruits (as peaches or plums or cherries or olives) that contains the seed.
This word comes from the Greek 'endon,' in, within, plus the Greek 'kardia,' heart.
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