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Last updated on April 19, 2014 at 18:42 EDT

Latest EV Group Stories

2011-04-11 08:00:00

ST. FLORIAN, Austria, April 11, 2011 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has received the 2010 European Nanoimprint Technology Product Innovation Award from independent market research firm, Frost & Sullivan. The prestigious award recognizes EVG's accomplishments in addressing industrial needs with nanoimprinting solutions. Frost & Sullivan...

2011-02-22 08:00:00

SANTA CLARA, Calif., Feb. 22, 2011 /PRNewswire/ -- STRATEGIES IN LIGHT -- EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, today announced the latest addition to its portfolio of products created to optimize the manufacture of high-brightness light-emitting diodes (HB-LEDs), compound semiconductors and power electronics. The new EVG620HBL fully...

2010-12-07 18:39:00

CARLSBAD, Calif., Dec. 7, 2010 /PRNewswire/ -- Shrink Nanotechnologies, Inc. ("Shrink") (OTC Bulletin Board: INKN), an innovative nanotechnology company developing products and licensing opportunities in the solar energy industry, medical diagnostics and sensors and biotechnology research and development tools businesses, announced today that it has entered into a multi-year development and manufacturing agreement with EV Group, a 30 year old Austria-based leader in the nano-imprint...

2010-12-01 10:25:00

CHIBA, Japan, Dec. 1, 2010 /PRNewswire/ -- SEMICON JAPAN -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has developed a new micro-lens molding process that can enable volume production of very-high-resolution (up to eight megapixels and higher) wafer-level optics for use in smart phones, pico projectors and myriad other applications. The new Monolithic Lens Molding (MLM)...

2010-10-19 08:00:00

DRESDEN, Germany, Oct. 19 /PRNewswire/ -- SEMICON EUROPA - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced receipt of its first order from the Fraunhofer Research Institution for Electronic Nano Systems ENAS (Chemnitz, Germany). Fraunhofer ENAS purchased an EVG6200NT automated mask aligner and an EVG540 automated wafer bonder, and will employ the flexible, multi-process EVG systems for...

2010-10-19 08:00:00

DRESDEN, Germany, Oct. 19 /PRNewswire/ -- SEMICON EUROPA -- EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, today announced the latest addition to its industry-leading EVG500 Series of permanent wafer bonding systems. The new three-chamber EVG520L3 wafer bonding system builds on the series' proven strengths in temperature control, piston force...

2010-10-18 08:00:00

DRESDEN, Germany, Oct. 18 /PRNewswire/ -- SEMICON EUROPA -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received an order for its GEMINI® fully automated wafer bonding system from Sensonor Technologies AS--a pioneer in the manufacture of MEMS sensors. The GEMINI system will be installed at Sensonor's wafer fab in Horten, Norway, where it will be used in the...

2010-10-13 10:56:00

COPENHAGEN, Denmark, Oct. 13 /PRNewswire/ -- NNT CONFERENCE -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled a new technology capability that enables ultra-high-resolution patterning of features down to 12.5 nm: Soft Molecular Scale Nanoimprint Lithography (SMS-NIL). Based on EVG's proven UV-NIL systems, SMS-NIL provides customers with a repeatable, cost-effective process for producing...

2010-09-23 08:00:00

ST. FLORIAN, Austria, Sept. 23 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has shipped an EVG520IS semi-automated wafer bonding system and two EVG6200 automated alignment systems to King Abdullah University of Science and Technology (KAUST) in Saudi Arabia. Students at the graduate-level institution will use the EVG equipment for advanced technology research and...

2010-07-12 08:00:00

ST. FLORIAN, Austria, July 12 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has introduced the EVG560HBL wafer bonder -- the industry's first fully automated wafer bonding system for high-brightness light emitting diode (HB-LED) manufacturing. The system features a new design for multi-substrate bonding and is capable of throughput rates of an unprecedented 160...