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Latest EV Group Stories

2010-09-23 08:00:00

ST. FLORIAN, Austria, Sept. 23 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has shipped an EVG520IS semi-automated wafer bonding system and two EVG6200 automated alignment systems to King Abdullah University of Science and Technology (KAUST) in Saudi Arabia. Students at the graduate-level institution will use the EVG equipment for advanced technology research and...

2010-07-12 08:00:00

ST. FLORIAN, Austria, July 12 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has introduced the EVG560HBL wafer bonder -- the industry's first fully automated wafer bonding system for high-brightness light emitting diode (HB-LED) manufacturing. The system features a new design for multi-substrate bonding and is capable of throughput rates of an unprecedented 160...

2010-07-08 08:00:00

ST. FLORIAN, Austria and SINGAPORE, July 8 /PRNewswire/ -- EV Group (EVG), a supplier of wafer bonding equipment for the MEMS, nanotechnology and semiconductor markets, and the Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR), today announced that they have entered into a two-year cooperation agreement to advance 3D IC integration technologies. 3D IC offers more flexibility in the designs. By minimizing interconnect...

2010-07-06 13:07:00

ST. FLORIAN, Austria, July 6 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has introduced the EVG610 mask and bond aligner, specifically to address its university and research customers' demands for a lower costing system with greater process versatility. Complementing the EVG501 R&D wafer bonder launched a year ago, the EVG610 is specifically designed to...

2010-05-31 08:00:00

ST. FLORIAN, Austria, May 31 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that world-renowned research institute, Fraunhofer IZM-ASSID, has placed an order for two EVG temporary bonding and debonding (TB/DB) systems for thin-wafer handling and processing for 3D ICs. ASSID (All Silicon System Integration Dresden), a new project group of Fraunhofer IZM, will use EVG's...

2010-03-30 09:33:00

ST. FLORIAN, Austria, March 30 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Morocco-based wafer-level camera manufacturer Nemotek Technologie has placed a repeat order for EVG's bonding and UV nanoimprint lithography (UV-NIL) systems - the EVG520IS and IQ Aligner. Nemotek will use these systems to address its production demands for CMOS image sensors and...

2010-03-02 08:00:00

St. Florian, Austria, March 2 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has shipped two wafer bonding systems to the University of Michigan's Lurie Nanofabrication Facility (LNF)--a leading center for MEMS and microsystems research and an integral member of the National Nanotechnology Infrastructure Network (NNIN), which is supported by the National Science...

2009-10-06 02:00:00

DRESDEN, Germany, Oct. 6 /PRNewswire/ -- SEMICON Europa 2009 -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has completed the installation of two automated fusion bonding systems for 300-mm wafers at a leading semiconductor foundry and at a major consumer electronics manufacturer. The GEMINI® FB automated production fusion bonding systems will be employed...

2009-09-29 08:00:00

ST. FLORIAN, Austria, Sept. 29 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that the RFID/USN Center has selected EVG's fully automated GEMINI(®) wafer bonding system for stacked 3D MEMS device development. Located in Incheon, Korea, RFID/USN is a leading MEMS foundry that offers manufacturing services for companies to initiate production...

2009-09-08 09:24:00

NEW YORK, Sept. 8 /PRNewswire/ -- Reportlinker.com announces that a new market research report is available in its catalogue. Nanopatterning http://www.reportlinker.com/p0131222/Nanopatterning.html This report analyzes the Global Market for Nanopatterning in Millions of US$. The market for "Nanopatterning" in this report is analyzed by the following technology types - Nanoimprint Lithography (Hot Embossing Lithography, UV Nanoimprint Lithography, Soft Lithography, & Others),...


Word of the Day
virgule
  • A punctuation mark (/) used to separate related items of information.
  • A little rod; a twig.
This word comes from the Late Latin 'virgula,' accentual mark, a diminutive of 'virga,' rod.
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