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Latest EV Group Stories

2009-07-16 08:00:00

St. Florian, Austria, July 16 /PRNewswire/ -- EV Group (EVG) today announced a joint effort with Applied Materials, Inc. to develop wafer bonding processes for the manufacture of through-silicon vias (TSVs) in three-dimensional integrated circuit (3D IC) packaging applications. The two companies will be working together as members of the EMC-3D Semiconductor 3D Equipment and Materials Consortium. Growing consumer demand for smaller, lower-power electronic devices with greater...

2009-07-13 08:00:00

ST. FLORIAN, Austria, July 13 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled its next-generation UV-nanoimprint lithography (UV-NIL) step and repeat system--the EVG770 Gen II NIL Stepper. The new system features capabilities designed to address growing customer demands for improved pattern fidelity at ever-smaller feature densities, greater process reliability and increased...

2009-07-09 12:40:00

ALBANY, N.Y. and ST. FLORIAN, Austria, July 9 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that SEMATECH, the global consortium of chipmakers, has selected EVG's fully automated 300-mm GEMINI(R) wafer bonder for enabling next-generation TSV and 3D interconnects. This order represents the industry's first fully automated 300-mm wafer bonder to integrate all four types of...

2009-06-09 08:00:00

Product Redesign Provides R&D Institutions and Universities with Superior Wafer Bonding Technology at an Affordable Cost ST. FLORIAN, Austria, June 9 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has launched an all-new EVG501 wafer bonding system to address rising cost burdens for its university and R&D customers. Redesigned based on customer feedback, the...

2009-06-04 12:00:00

Company Makes Continued Inroads in High-Volume Manufacturing Market ST. FLORIAN, Austria, June 4 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that EPCOS - a leading electronic components, modules and systems manufacturer - selected EVG's fully automated GEMINI wafer bonder for high-volume RF components production at EPCOS's production facility based in Munich, Germany....

2009-05-12 08:00:00

Prestigious Research Institute a Strategic Win for EV Group St. Florian, Austria, May 12 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Fraunhofer Institute for Applied Optics and Precision Engineering IOF--one of 57 institutes of the Fraunhofer-Gesellschaft dedicated to applied optics and precision applications-oriented research--selected EVG's UV-based nanoimprint...

2009-04-01 08:00:00

ST. FLORIAN, Austria, April 1 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has entered a joint development program (JDP) with CEA/Leti -- one of Europe's renowned research labs focusing on microelectronics and nanotechnology. EVG, an early leader in through-silicon-via (TSV) and 3D integration technology, will provide CEA/Leti with its world-class, 300-mm temporary...

2009-02-03 08:00:00

ST. FLORIAN, Austria, Feb. 3 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Sweden-based Silex Microsystems, the world's largest independent MEMS foundry, has placed a major follow-on order for its GEMINI automated bond cluster, EVG 6200NT mask and bond aligner and EVG301 mask cleaner -- all of which will be used in the production of highly sophisticated MEMS devices...

2009-01-20 08:00:00

SEOUL, South Korea and ST. FLORIAN, Austria, Jan. 20 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that leading Korean components manufacturer, Samsung Electro-Mechanics Co., LTD. (SEMCO), selected the company's EVG810LT, a LowTemp(R) plasma activation system, for its R&D work involving stacked and 3D MEMS devices. The tool will be shipped and installed in March,...

2009-01-07 08:00:00

ST. FLORIAN, Austria and ROLLA, Mo., Jan. 7 /PRNewswire/ -- EV Group (EVG) and Brewer Science, Inc., today announced the installation of an EVG 500 series wafer-bonding system at Brewer Science's Taiwan applications lab. Located in Hsinchu Science Park, this joint effort offers customers timely localized support in the Asia-Pacific region for 3D IC and other advanced process development programs. In a shared commitment to speed commercialization of through-silicon via (TSV) technology...


Word of the Day
Cthulhu
  • A gigantic fictional humanoid alien god being described with a head resembling an octopus and dragon wings and claws, around whom an insane cult developed.
  • Pertaining to the mythos of Cthulhu and additional otherworldly beings created by H. P. Lovecraft or inspired by his writings and imitators.
This word was invented in 1926 by H.P. Lovecraft for his short story, 'The Call of Cthulhu.' 'Cthulhu' may be based on the word 'chthonic,' which in Greek mythology refers to the underworld.
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