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Latest EV Group Stories

2009-07-16 08:00:00

St. Florian, Austria, July 16 /PRNewswire/ -- EV Group (EVG) today announced a joint effort with Applied Materials, Inc. to develop wafer bonding processes for the manufacture of through-silicon vias (TSVs) in three-dimensional integrated circuit (3D IC) packaging applications. The two companies will be working together as members of the EMC-3D Semiconductor 3D Equipment and Materials Consortium. Growing consumer demand for smaller, lower-power electronic devices with greater...

2009-07-13 08:00:00

ST. FLORIAN, Austria, July 13 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled its next-generation UV-nanoimprint lithography (UV-NIL) step and repeat system--the EVG770 Gen II NIL Stepper. The new system features capabilities designed to address growing customer demands for improved pattern fidelity at ever-smaller feature densities, greater process reliability and increased...

2009-07-09 12:40:00

ALBANY, N.Y. and ST. FLORIAN, Austria, July 9 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that SEMATECH, the global consortium of chipmakers, has selected EVG's fully automated 300-mm GEMINI(R) wafer bonder for enabling next-generation TSV and 3D interconnects. This order represents the industry's first fully automated 300-mm wafer bonder to integrate all four types of...

2009-06-09 08:00:00

Product Redesign Provides R&D Institutions and Universities with Superior Wafer Bonding Technology at an Affordable Cost ST. FLORIAN, Austria, June 9 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has launched an all-new EVG501 wafer bonding system to address rising cost burdens for its university and R&D customers. Redesigned based on customer feedback, the...

2009-06-04 12:00:00

Company Makes Continued Inroads in High-Volume Manufacturing Market ST. FLORIAN, Austria, June 4 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that EPCOS - a leading electronic components, modules and systems manufacturer - selected EVG's fully automated GEMINI wafer bonder for high-volume RF components production at EPCOS's production facility based in Munich, Germany....

2009-05-12 08:00:00

Prestigious Research Institute a Strategic Win for EV Group St. Florian, Austria, May 12 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Fraunhofer Institute for Applied Optics and Precision Engineering IOF--one of 57 institutes of the Fraunhofer-Gesellschaft dedicated to applied optics and precision applications-oriented research--selected EVG's UV-based nanoimprint...

2009-04-01 08:00:00

ST. FLORIAN, Austria, April 1 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has entered a joint development program (JDP) with CEA/Leti -- one of Europe's renowned research labs focusing on microelectronics and nanotechnology. EVG, an early leader in through-silicon-via (TSV) and 3D integration technology, will provide CEA/Leti with its world-class, 300-mm temporary...

2009-02-03 08:00:00

ST. FLORIAN, Austria, Feb. 3 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Sweden-based Silex Microsystems, the world's largest independent MEMS foundry, has placed a major follow-on order for its GEMINI automated bond cluster, EVG 6200NT mask and bond aligner and EVG301 mask cleaner -- all of which will be used in the production of highly sophisticated MEMS devices...

2009-01-20 08:00:00

SEOUL, South Korea and ST. FLORIAN, Austria, Jan. 20 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that leading Korean components manufacturer, Samsung Electro-Mechanics Co., LTD. (SEMCO), selected the company's EVG810LT, a LowTemp(R) plasma activation system, for its R&D work involving stacked and 3D MEMS devices. The tool will be shipped and installed in March,...

2009-01-07 08:00:00

ST. FLORIAN, Austria and ROLLA, Mo., Jan. 7 /PRNewswire/ -- EV Group (EVG) and Brewer Science, Inc., today announced the installation of an EVG 500 series wafer-bonding system at Brewer Science's Taiwan applications lab. Located in Hsinchu Science Park, this joint effort offers customers timely localized support in the Asia-Pacific region for 3D IC and other advanced process development programs. In a shared commitment to speed commercialization of through-silicon via (TSV) technology...


Word of the Day
vermicular
  • Like a worm in form or movement; vermiform; tortuous or sinuous; also, writhing or wriggling.
  • Like the track or trace of a worm; appearing as if worm-eaten; vermiculate.
  • Marked with fine, close-set, wavy or tortuous lines of color; vermiculated.
  • A form of rusticated masonry which is so wrought as to appear thickly indented with worm-tracks.
This word ultimately comes from the Latin 'vermis,' worm.
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